JP7503026B2 - 電子機器 - Google Patents
電子機器 Download PDFInfo
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- JP7503026B2 JP7503026B2 JP2021101563A JP2021101563A JP7503026B2 JP 7503026 B2 JP7503026 B2 JP 7503026B2 JP 2021101563 A JP2021101563 A JP 2021101563A JP 2021101563 A JP2021101563 A JP 2021101563A JP 7503026 B2 JP7503026 B2 JP 7503026B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
- H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Inverter Devices (AREA)
- Structure Of Printed Boards (AREA)
Description
図1は、本実施形態の電子機器であるスイッチ駆動装置40及びその周辺を示す回路図である。車両90には、メインバッテリ10とインバータ30とスイッチ駆動装置40と3相コイル50とが搭載されている。以下では、電気的に接続されていることを、単に「接続」されているという。
以上に示した実施形態は、例えば以下の変更例のように変更して実施できる。
Claims (5)
- 基板(49)と、前記基板に搭載されている回路(41~46,48)とを有し、前記回路が、第1導電部(A)と、前記第1導電部とは異なる電位になる第2導電部(B)とを有する、電子機器(40)において、
前記基板の厚さ方向に見た平面視で、
前記第1導電部が、頂部が丸められた形状の凸角部(AC)を有すると共に、前記第2導電部が、前記凸角部に対峙する凹角部(BC)を有し、
前記凸角部に連続して前記第1導電部の輪郭をなす2直線の延長線が、凸角をなし、
前記凹角部に連続して前記第2導電部の輪郭をなす2直線の延長線が、凹角をなし、
前記凸角の頂点(aC)と前記凹角の頂点(bC)とを通る直線を角線(Lab)とし、前記角線と前記凸角部との交点を凸角部点(aP)とし、前記角線と前記凹角部との交点を凹角部点(bP)として、
前記凸角の頂点から前記凹角の頂点までの距離である角間距離(Dc)よりも、前記凸角部点から前記凹角部点までの距離である角部間距離(Dp)の方が長く、
前記回路は、インバータ(30)のスイッチ(31~36)を駆動する駆動回路(41~46)と、前記駆動回路を制御する制御回路(48)とを含み、
前記第1導電部は、前記駆動回路の一部であり、前記第2導電部は、前記制御回路の一部である、電子機器。 - 前記凸角部の曲率半径(Ra)よりも、前記凹角部の曲率半径(Rb)の方が小さい、請求項1に記載の電子機器。
- 前記凹角部の曲率半径は、0.2mm以下である請求項2に記載の電子機器。
- 前記凹角部は、実質的に凹角状で実質的に凹角の頂点を有する請求項1~3のいずれか1項に記載の電子機器。
- 基板(49)と、前記基板に搭載されている回路(41~46,48)とを有し、前記回路が、第1導電部(A)と、前記第1導電部とは異なる電位になる第2導電部(B)とを有する、電子機器(40)において、
前記基板の厚さ方向に見た平面視で、前記第1導電部が、凸角状の状態から頂部が丸められた形状の凸角部(AC)を有すると共に、前記第2導電部が、前記凸角部に対峙する、実質的に凹角状で実質的に凹角の頂点を有する凹角部(BC)を有し、
前記回路は、インバータ(30)のスイッチ(31~36)を駆動する駆動回路(41~46)と、前記駆動回路を制御する制御回路(48)とを含み、
前記第1導電部は、前記駆動回路の一部であり、前記第2導電部は、前記制御回路の一部である、電子機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021101563A JP7503026B2 (ja) | 2021-06-18 | 2021-06-18 | 電子機器 |
PCT/JP2022/021599 WO2022264774A1 (ja) | 2021-06-18 | 2022-05-26 | 電子機器 |
CN202280042593.0A CN117616878A (zh) | 2021-06-18 | 2022-05-26 | 电子设备 |
US18/533,441 US20240112967A1 (en) | 2021-06-18 | 2023-12-08 | Electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021101563A JP7503026B2 (ja) | 2021-06-18 | 2021-06-18 | 電子機器 |
Publications (3)
Publication Number | Publication Date |
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JP2023000627A JP2023000627A (ja) | 2023-01-04 |
JP2023000627A5 JP2023000627A5 (ja) | 2023-04-26 |
JP7503026B2 true JP7503026B2 (ja) | 2024-06-19 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2021101563A Active JP7503026B2 (ja) | 2021-06-18 | 2021-06-18 | 電子機器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20240112967A1 (ja) |
JP (1) | JP7503026B2 (ja) |
CN (1) | CN117616878A (ja) |
WO (1) | WO2022264774A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006222093A (ja) | 2000-07-24 | 2006-08-24 | Canon Inc | 電子線装置及び画像表示装置 |
JP2010109243A (ja) | 2008-10-31 | 2010-05-13 | Kyocer Slc Technologies Corp | 配線基板 |
WO2012070558A1 (ja) | 2010-11-26 | 2012-05-31 | シャープ株式会社 | 配線基板および表示装置用配線基板 |
JP2015198108A (ja) | 2014-03-31 | 2015-11-09 | 凸版印刷株式会社 | 印刷配線基材およびその製造方法ならびにグラビア版 |
US20200395286A1 (en) | 2019-06-11 | 2020-12-17 | Innolux Corporation | Electronic device |
-
2021
- 2021-06-18 JP JP2021101563A patent/JP7503026B2/ja active Active
-
2022
- 2022-05-26 WO PCT/JP2022/021599 patent/WO2022264774A1/ja active Application Filing
- 2022-05-26 CN CN202280042593.0A patent/CN117616878A/zh active Pending
-
2023
- 2023-12-08 US US18/533,441 patent/US20240112967A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006222093A (ja) | 2000-07-24 | 2006-08-24 | Canon Inc | 電子線装置及び画像表示装置 |
JP2010109243A (ja) | 2008-10-31 | 2010-05-13 | Kyocer Slc Technologies Corp | 配線基板 |
WO2012070558A1 (ja) | 2010-11-26 | 2012-05-31 | シャープ株式会社 | 配線基板および表示装置用配線基板 |
JP2015198108A (ja) | 2014-03-31 | 2015-11-09 | 凸版印刷株式会社 | 印刷配線基材およびその製造方法ならびにグラビア版 |
US20200395286A1 (en) | 2019-06-11 | 2020-12-17 | Innolux Corporation | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
US20240112967A1 (en) | 2024-04-04 |
WO2022264774A1 (ja) | 2022-12-22 |
CN117616878A (zh) | 2024-02-27 |
JP2023000627A (ja) | 2023-01-04 |
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