JP7501654B2 - 磁気センサパッケージ - Google Patents

磁気センサパッケージ Download PDF

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Publication number
JP7501654B2
JP7501654B2 JP2022557264A JP2022557264A JP7501654B2 JP 7501654 B2 JP7501654 B2 JP 7501654B2 JP 2022557264 A JP2022557264 A JP 2022557264A JP 2022557264 A JP2022557264 A JP 2022557264A JP 7501654 B2 JP7501654 B2 JP 7501654B2
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Japan
Prior art keywords
magnetic sensor
sensor chip
wiring layer
sensor package
connection
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JP2022557264A
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English (en)
Japanese (ja)
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JPWO2022085319A5 (https=
JPWO2022085319A1 (https=
Inventor
秀幸 佐藤
彰夫 勝部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)
JP2022557264A 2020-10-21 2021-09-07 磁気センサパッケージ Active JP7501654B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020176519 2020-10-21
JP2020176519 2020-10-21
PCT/JP2021/032819 WO2022085319A1 (ja) 2020-10-21 2021-09-07 磁気センサパッケージ

Publications (3)

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JPWO2022085319A1 JPWO2022085319A1 (https=) 2022-04-28
JPWO2022085319A5 JPWO2022085319A5 (https=) 2023-06-19
JP7501654B2 true JP7501654B2 (ja) 2024-06-18

Family

ID=81291231

Family Applications (1)

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JP2022557264A Active JP7501654B2 (ja) 2020-10-21 2021-09-07 磁気センサパッケージ

Country Status (2)

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JP (1) JP7501654B2 (https=)
WO (1) WO2022085319A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7138261B1 (ja) 2022-06-30 2022-09-15 旭化成エレクトロニクス株式会社 半導体パッケージ、及び駆動装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017009566A (ja) 2015-06-26 2017-01-12 旭化成エレクトロニクス株式会社 センサ装置及びセンサ装置の製造方法
JP2017143208A (ja) 2016-02-12 2017-08-17 ローム株式会社 半導体装置およびその製造方法
JP2019102651A (ja) 2017-12-04 2019-06-24 ローム株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0579964U (ja) * 1992-04-03 1993-10-29 株式会社三協精機製作所 磁気センサ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017009566A (ja) 2015-06-26 2017-01-12 旭化成エレクトロニクス株式会社 センサ装置及びセンサ装置の製造方法
JP2017143208A (ja) 2016-02-12 2017-08-17 ローム株式会社 半導体装置およびその製造方法
JP2019102651A (ja) 2017-12-04 2019-06-24 ローム株式会社 半導体装置および半導体装置の製造方法

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JPWO2022085319A1 (https=) 2022-04-28
WO2022085319A1 (ja) 2022-04-28

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