JPWO2022085319A1 - - Google Patents
Info
- Publication number
- JPWO2022085319A1 JPWO2022085319A1 JP2022557264A JP2022557264A JPWO2022085319A1 JP WO2022085319 A1 JPWO2022085319 A1 JP WO2022085319A1 JP 2022557264 A JP2022557264 A JP 2022557264A JP 2022557264 A JP2022557264 A JP 2022557264A JP WO2022085319 A1 JPWO2022085319 A1 JP WO2022085319A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Measuring Magnetic Variables (AREA)
- Hall/Mr Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020176519 | 2020-10-21 | ||
| JP2020176519 | 2020-10-21 | ||
| PCT/JP2021/032819 WO2022085319A1 (ja) | 2020-10-21 | 2021-09-07 | 磁気センサパッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022085319A1 true JPWO2022085319A1 (https=) | 2022-04-28 |
| JPWO2022085319A5 JPWO2022085319A5 (https=) | 2023-06-19 |
| JP7501654B2 JP7501654B2 (ja) | 2024-06-18 |
Family
ID=81291231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022557264A Active JP7501654B2 (ja) | 2020-10-21 | 2021-09-07 | 磁気センサパッケージ |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7501654B2 (https=) |
| WO (1) | WO2022085319A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7138261B1 (ja) | 2022-06-30 | 2022-09-15 | 旭化成エレクトロニクス株式会社 | 半導体パッケージ、及び駆動装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0579964U (ja) * | 1992-04-03 | 1993-10-29 | 株式会社三協精機製作所 | 磁気センサ |
| JP2017009566A (ja) * | 2015-06-26 | 2017-01-12 | 旭化成エレクトロニクス株式会社 | センサ装置及びセンサ装置の製造方法 |
| JP2017143208A (ja) * | 2016-02-12 | 2017-08-17 | ローム株式会社 | 半導体装置およびその製造方法 |
| JP2019102651A (ja) * | 2017-12-04 | 2019-06-24 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
-
2021
- 2021-09-07 JP JP2022557264A patent/JP7501654B2/ja active Active
- 2021-09-07 WO PCT/JP2021/032819 patent/WO2022085319A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0579964U (ja) * | 1992-04-03 | 1993-10-29 | 株式会社三協精機製作所 | 磁気センサ |
| JP2017009566A (ja) * | 2015-06-26 | 2017-01-12 | 旭化成エレクトロニクス株式会社 | センサ装置及びセンサ装置の製造方法 |
| JP2017143208A (ja) * | 2016-02-12 | 2017-08-17 | ローム株式会社 | 半導体装置およびその製造方法 |
| JP2019102651A (ja) * | 2017-12-04 | 2019-06-24 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7501654B2 (ja) | 2024-06-18 |
| WO2022085319A1 (ja) | 2022-04-28 |
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