JP7500545B2 - 光学検査システム向けマルチモダリティ多重化照明 - Google Patents

光学検査システム向けマルチモダリティ多重化照明 Download PDF

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JP7500545B2
JP7500545B2 JP2021512758A JP2021512758A JP7500545B2 JP 7500545 B2 JP7500545 B2 JP 7500545B2 JP 2021512758 A JP2021512758 A JP 2021512758A JP 2021512758 A JP2021512758 A JP 2021512758A JP 7500545 B2 JP7500545 B2 JP 7500545B2
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illumination
light
modalities
areas
scan direction
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Japanese (ja)
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JP2022501580A5 (https=
JPWO2020049551A5 (https=
JP2022501580A (ja
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イーガル カツィール
イリア ルツカール
エリー メイモウン
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Orbotech Ltd
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Orbotech Ltd
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/55—Depth or shape recovery from multiple images
    • G06T7/586—Depth or shape recovery from multiple images from multiple light sources, e.g. photometric stereo
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/222—Studio circuitry; Studio devices; Studio equipment
    • H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
    • H04N5/265—Mixing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8812—Diffuse illumination, e.g. "sky"
    • G01N2021/8816—Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8848—Polarisation of light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
JP2021512758A 2018-09-06 2019-08-27 光学検査システム向けマルチモダリティ多重化照明 Active JP7500545B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862727561P 2018-09-06 2018-09-06
US62/727,561 2018-09-06
PCT/IL2019/050958 WO2020049551A1 (en) 2018-09-06 2019-08-27 Multimodality multiplexed illumination for optical inspection systems

Publications (4)

Publication Number Publication Date
JP2022501580A JP2022501580A (ja) 2022-01-06
JP2022501580A5 JP2022501580A5 (https=) 2022-09-01
JPWO2020049551A5 JPWO2020049551A5 (https=) 2022-09-01
JP7500545B2 true JP7500545B2 (ja) 2024-06-17

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JP2021512758A Active JP7500545B2 (ja) 2018-09-06 2019-08-27 光学検査システム向けマルチモダリティ多重化照明

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Country Link
US (1) US11974046B2 (https=)
EP (1) EP3847446A4 (https=)
JP (1) JP7500545B2 (https=)
KR (1) KR102831958B1 (https=)
CN (1) CN112888936A (https=)
WO (1) WO2020049551A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201900005536A1 (it) * 2019-04-10 2020-10-10 Doss Visual Solution S R L Metodo di acquisizione immagini per una macchina di ispezione ottica
US12429430B2 (en) * 2021-08-26 2025-09-30 Emage Equipment Pte. Ltd. Adaptive lighting system and method for inspection of complex objects
CN114813761B (zh) * 2022-06-27 2022-10-14 浙江双元科技股份有限公司 一种基于双光频闪的薄膜针孔和亮斑缺陷识别系统及方法
US12511731B2 (en) 2023-05-09 2025-12-30 Orbotech Ltd. System and method for three-dimensional imaging of samples using a machine learning algorithm
TWI881588B (zh) * 2023-12-11 2025-04-21 家碩科技股份有限公司 可消除電路表面金屬紋路的光學檢測系統
EP4682487A1 (de) * 2024-07-18 2026-01-21 IPAC Improve Process Analytics and Control GmbH Farbmesssystem und verfahren für ortsaufgelöste spektrale farbmessungen einer strukturierten und bedruckten oberfläche
DE102024208944A1 (de) * 2024-09-18 2026-03-19 Isra Vision Gmbh Beleuchtungseinrichtung zum Erzeugen einer Linienbeleuchtung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014009969A (ja) 2012-06-27 2014-01-20 Sumitomo Metal Mining Co Ltd 画像処理装置、画像処理方法、及び露光パターン検査装置
JP2014130130A (ja) 2013-09-30 2014-07-10 Djtech Co Ltd 検査装置

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US5058982A (en) 1989-06-21 1991-10-22 Orbot Systems Ltd. Illumination system and inspection apparatus including same
DE19829986C1 (de) * 1998-07-04 2000-03-30 Lis Laser Imaging Systems Gmbh Verfahren zur Direktbelichtung von Leiterplattensubstraten
IL131284A (en) * 1999-08-05 2003-05-29 Orbotech Ltd Illumination for inspecting surfaces of articles
US20020186878A1 (en) 2001-06-07 2002-12-12 Hoon Tan Seow System and method for multiple image analysis
CN1788194A (zh) * 2003-01-09 2006-06-14 奥博泰克有限公司 用于同时进行二维和形貌检查的方法和装置
US7641365B2 (en) * 2006-10-13 2010-01-05 Orbotech Ltd Linear light concentrator
JP4932595B2 (ja) 2007-05-17 2012-05-16 新日本製鐵株式会社 表面疵検査装置
US8462329B2 (en) * 2010-07-30 2013-06-11 Kla-Tencor Corp. Multi-spot illumination for wafer inspection
US9279774B2 (en) * 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
JP2014052203A (ja) 2012-09-05 2014-03-20 Toshiba Mitsubishi-Electric Industrial System Corp 平面形状測定装置
US9606056B2 (en) 2013-12-06 2017-03-28 Canon Kabushiki Kaisha Selection of spectral bands or filters for material classification under multiplexed illumination
US9638644B2 (en) 2013-08-08 2017-05-02 Camtek Ltd. Multiple mode inspection system and method for evaluating a substrate by a multiple mode inspection system
WO2015042983A1 (zh) 2013-09-30 2015-04-02 华为技术有限公司 一种天线和通信设备
CN106066562B (zh) 2015-04-21 2020-07-10 康代有限公司 具有扩展的角覆盖范围的检查系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014009969A (ja) 2012-06-27 2014-01-20 Sumitomo Metal Mining Co Ltd 画像処理装置、画像処理方法、及び露光パターン検査装置
JP2014130130A (ja) 2013-09-30 2014-07-10 Djtech Co Ltd 検査装置

Also Published As

Publication number Publication date
KR20210050565A (ko) 2021-05-07
US11974046B2 (en) 2024-04-30
CN112888936A (zh) 2021-06-01
EP3847446A1 (en) 2021-07-14
KR102831958B1 (ko) 2025-07-08
US20210360140A1 (en) 2021-11-18
JP2022501580A (ja) 2022-01-06
WO2020049551A1 (en) 2020-03-12
EP3847446A4 (en) 2022-06-01

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