JP7500427B2 - 撮像装置 - Google Patents

撮像装置 Download PDF

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Publication number
JP7500427B2
JP7500427B2 JP2020547476A JP2020547476A JP7500427B2 JP 7500427 B2 JP7500427 B2 JP 7500427B2 JP 2020547476 A JP2020547476 A JP 2020547476A JP 2020547476 A JP2020547476 A JP 2020547476A JP 7500427 B2 JP7500427 B2 JP 7500427B2
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JP
Japan
Prior art keywords
layer
transistor
imaging device
photoelectric conversion
light
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JP2020547476A
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English (en)
Japanese (ja)
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JPWO2020058919A1 (ja
JPWO2020058919A5 (ja
Inventor
舜平 山崎
隆之 池田
哲弥 掛端
亮 徳丸
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Publication of JPWO2020058919A1 publication Critical patent/JPWO2020058919A1/ja
Publication of JPWO2020058919A5 publication Critical patent/JPWO2020058919A5/ja
Priority to JP2024091790A priority Critical patent/JP2024107145A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184—Infrared image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H10F39/80377—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor characterised by the channel of the transistor, e.g. channel having a doping gradient
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Thin Film Transistor (AREA)
JP2020547476A 2018-09-21 2019-09-20 撮像装置 Active JP7500427B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024091790A JP2024107145A (ja) 2018-09-21 2024-06-05 撮像装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018177347 2018-09-21
JP2018177347 2018-09-21
PCT/IB2019/057958 WO2020058919A1 (ja) 2018-09-21 2019-09-20 撮像装置、その作製方法および電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024091790A Division JP2024107145A (ja) 2018-09-21 2024-06-05 撮像装置

Publications (3)

Publication Number Publication Date
JPWO2020058919A1 JPWO2020058919A1 (ja) 2021-10-07
JPWO2020058919A5 JPWO2020058919A5 (ja) 2022-09-14
JP7500427B2 true JP7500427B2 (ja) 2024-06-17

Family

ID=69888442

Family Applications (2)

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JP2020547476A Active JP7500427B2 (ja) 2018-09-21 2019-09-20 撮像装置
JP2024091790A Withdrawn JP2024107145A (ja) 2018-09-21 2024-06-05 撮像装置

Family Applications After (1)

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JP2024091790A Withdrawn JP2024107145A (ja) 2018-09-21 2024-06-05 撮像装置

Country Status (5)

Country Link
US (1) US12349481B2 (https=)
JP (2) JP7500427B2 (https=)
KR (1) KR20210061367A (https=)
CN (1) CN112703598A (https=)
WO (1) WO2020058919A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12009379B2 (en) * 2017-05-01 2024-06-11 Visera Technologies Company Limited Image sensor
WO2021099889A1 (ja) 2019-11-22 2021-05-27 株式会社半導体エネルギー研究所 撮像装置および電子機器
WO2021165781A1 (ja) 2020-02-20 2021-08-26 株式会社半導体エネルギー研究所 撮像装置、電子機器および移動体
JP2023016007A (ja) 2021-07-20 2023-02-01 株式会社半導体エネルギー研究所 表示装置および電子装置
JP2023132302A (ja) * 2022-03-10 2023-09-22 株式会社東芝 固体撮像装置、電子機器、および固体撮像装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
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JP2011096851A (ja) 2009-10-29 2011-05-12 Sony Corp 半導体装置とその製造方法、及び電子機器
JP2013182923A (ja) 2012-02-29 2013-09-12 Canon Inc 光電変換装置、撮像システムおよび光電変換装置の製造方法
JP2018041943A (ja) 2015-12-28 2018-03-15 株式会社半導体エネルギー研究所 撮像装置および電子機器

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JP3719947B2 (ja) 2001-04-18 2005-11-24 シャープ株式会社 固体撮像装置及びその製造方法
EP3614442A3 (en) 2005-09-29 2020-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having oxide semiconductor layer and manufactoring method thereof
JP2009043772A (ja) 2007-08-06 2009-02-26 Panasonic Corp 固体撮像装置及びその製造方法
JP5518381B2 (ja) 2008-07-10 2014-06-11 株式会社半導体エネルギー研究所 カラーセンサ及び当該カラーセンサを具備する電子機器
TWI585955B (zh) 2008-11-28 2017-06-01 半導體能源研究所股份有限公司 光感測器及顯示裝置
JP5402040B2 (ja) 2009-02-06 2014-01-29 ソニー株式会社 固体撮像装置及びその製造方法、並びに撮像装置、並びに半導体装置及びその製造方法、並びに半導体基板
KR101645680B1 (ko) 2009-11-06 2016-08-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP5917036B2 (ja) 2010-08-05 2016-05-11 株式会社半導体エネルギー研究所 Ｓｏｉ基板の作製方法
JP2012054321A (ja) * 2010-08-31 2012-03-15 Sony Corp 固体撮像素子及びその製造方法、並びに固体撮像装置及び撮像装置
US8735263B2 (en) 2011-01-21 2014-05-27 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing SOI substrate
US9123529B2 (en) 2011-06-21 2015-09-01 Semiconductor Energy Laboratory Co., Ltd. Method for reprocessing semiconductor substrate, method for manufacturing reprocessed semiconductor substrate, and method for manufacturing SOI substrate
JP2013016676A (ja) 2011-07-05 2013-01-24 Sony Corp 固体撮像装置及びその製造方法、電子機器
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JP2011096851A (ja) 2009-10-29 2011-05-12 Sony Corp 半導体装置とその製造方法、及び電子機器
JP2013182923A (ja) 2012-02-29 2013-09-12 Canon Inc 光電変換装置、撮像システムおよび光電変換装置の製造方法
JP2018041943A (ja) 2015-12-28 2018-03-15 株式会社半導体エネルギー研究所 撮像装置および電子機器

Also Published As

Publication number Publication date
CN112703598A (zh) 2021-04-23
US20220102419A1 (en) 2022-03-31
JP2024107145A (ja) 2024-08-08
WO2020058919A1 (ja) 2020-03-26
JPWO2020058919A1 (ja) 2021-10-07
US12349481B2 (en) 2025-07-01
KR20210061367A (ko) 2021-05-27

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