JP7499414B2 - 熱伝導性組成物、熱伝導性シート及びその製造方法 - Google Patents

熱伝導性組成物、熱伝導性シート及びその製造方法 Download PDF

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JP7499414B2
JP7499414B2 JP2023530708A JP2023530708A JP7499414B2 JP 7499414 B2 JP7499414 B2 JP 7499414B2 JP 2023530708 A JP2023530708 A JP 2023530708A JP 2023530708 A JP2023530708 A JP 2023530708A JP 7499414 B2 JP7499414 B2 JP 7499414B2
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thermally conductive
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克之 鈴村
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Fuji Polymer Industries Co Ltd
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Fuji Polymer Industries Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/247—Heating methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2023530708A 2022-02-22 2022-10-07 熱伝導性組成物、熱伝導性シート及びその製造方法 Active JP7499414B2 (ja)

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JP2022025596 2022-02-22
JP2022025596 2022-02-22
PCT/JP2022/037639 WO2023162323A1 (ja) 2022-02-22 2022-10-07 熱伝導性組成物、熱伝導性シート及びその製造方法

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JPWO2023162323A5 JPWO2023162323A5 (https=) 2024-01-31
JP7499414B2 true JP7499414B2 (ja) 2024-06-13

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US (1) US20250145799A1 (https=)
EP (1) EP4477713A4 (https=)
JP (1) JP7499414B2 (https=)
KR (1) KR20240150441A (https=)
CN (1) CN118696096A (https=)
TW (1) TW202334320A (https=)
WO (1) WO2023162323A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168558A (ja) 2008-12-24 2010-08-05 Shin Kobe Electric Mach Co Ltd 熱硬化性樹脂組成物並びにプリプレグ及び積層板
JP2013147600A (ja) 2012-01-23 2013-08-01 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物
JP2017210518A (ja) 2016-05-24 2017-11-30 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2018131486A1 (ja) 2017-01-13 2018-07-19 デンカ株式会社 熱伝導性樹脂組成物、放熱シート、放熱部材及びその製造方法
WO2018190233A1 (ja) 2017-04-12 2018-10-18 デンカ株式会社 熱伝導性シート及びその製造方法
WO2020179115A1 (ja) 2019-03-07 2020-09-10 富士高分子工業株式会社 熱伝導性シート及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001217360A (ja) 2000-02-04 2001-08-10 Denki Kagaku Kogyo Kk 柔軟性放熱スペーサー
JP3807995B2 (ja) * 2002-03-05 2006-08-09 ポリマテック株式会社 熱伝導性シート
CN109415564B (zh) * 2016-07-22 2021-12-21 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
JP7082563B2 (ja) * 2018-12-04 2022-06-08 信越化学工業株式会社 熱伝導性シリコーン組成物の硬化物
TWI894350B (zh) * 2020-10-09 2025-08-21 日商陶氏東麗股份有限公司 導熱性矽組成物及導熱性構件

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010168558A (ja) 2008-12-24 2010-08-05 Shin Kobe Electric Mach Co Ltd 熱硬化性樹脂組成物並びにプリプレグ及び積層板
JP2013147600A (ja) 2012-01-23 2013-08-01 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物
JP2017210518A (ja) 2016-05-24 2017-11-30 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2018131486A1 (ja) 2017-01-13 2018-07-19 デンカ株式会社 熱伝導性樹脂組成物、放熱シート、放熱部材及びその製造方法
WO2018190233A1 (ja) 2017-04-12 2018-10-18 デンカ株式会社 熱伝導性シート及びその製造方法
WO2020179115A1 (ja) 2019-03-07 2020-09-10 富士高分子工業株式会社 熱伝導性シート及びその製造方法

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JPWO2023162323A1 (https=) 2023-08-31
WO2023162323A1 (ja) 2023-08-31
TW202334320A (zh) 2023-09-01
EP4477713A1 (en) 2024-12-18
KR20240150441A (ko) 2024-10-15
EP4477713A4 (en) 2026-03-04
US20250145799A1 (en) 2025-05-08
CN118696096A (zh) 2024-09-24

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