JP7490476B2 - インプリント方法、インプリント装置、および物品の製造方法 - Google Patents

インプリント方法、インプリント装置、および物品の製造方法 Download PDF

Info

Publication number
JP7490476B2
JP7490476B2 JP2020118477A JP2020118477A JP7490476B2 JP 7490476 B2 JP7490476 B2 JP 7490476B2 JP 2020118477 A JP2020118477 A JP 2020118477A JP 2020118477 A JP2020118477 A JP 2020118477A JP 7490476 B2 JP7490476 B2 JP 7490476B2
Authority
JP
Japan
Prior art keywords
foreign object
pressing
substrate
imprint
foreign
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020118477A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021036578A (ja
JP2021036578A5 (enExample
Inventor
明夫 青木
正 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of JP2021036578A publication Critical patent/JP2021036578A/ja
Publication of JP2021036578A5 publication Critical patent/JP2021036578A5/ja
Application granted granted Critical
Publication of JP7490476B2 publication Critical patent/JP7490476B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2020118477A 2019-08-20 2020-07-09 インプリント方法、インプリント装置、および物品の製造方法 Active JP7490476B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019150694 2019-08-20
JP2019150694 2019-08-20

Publications (3)

Publication Number Publication Date
JP2021036578A JP2021036578A (ja) 2021-03-04
JP2021036578A5 JP2021036578A5 (enExample) 2023-06-02
JP7490476B2 true JP7490476B2 (ja) 2024-05-27

Family

ID=74645665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020118477A Active JP7490476B2 (ja) 2019-08-20 2020-07-09 インプリント方法、インプリント装置、および物品の製造方法

Country Status (3)

Country Link
US (1) US11531266B2 (enExample)
JP (1) JP7490476B2 (enExample)
KR (1) KR20210022494A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11908711B2 (en) * 2020-09-30 2024-02-20 Canon Kabushiki Kaisha Planarization process, planarization system and method of manufacturing an article
JP7551694B2 (ja) * 2021-11-12 2024-09-17 キヤノン株式会社 異物除去方法、異物除去装置、及び物品の製造方法
JP7832842B2 (ja) * 2022-04-27 2026-03-18 キヤノン株式会社 異物除去方法、形成方法、物品の製造方法、異物除去装置、およびシステム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010069762A (ja) 2008-09-19 2010-04-02 Toshiba Corp パターン形成方法
JP2011165855A (ja) 2010-02-09 2011-08-25 Toshiba Corp パターン形成方法
JP2012243805A (ja) 2011-05-16 2012-12-10 Toshiba Corp パターン形成方法
JP2013004744A (ja) 2011-06-16 2013-01-07 Canon Inc インプリント方法、インプリント装置及び物品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011009250A (ja) * 2009-06-23 2011-01-13 Toshiba Corp 基板処理方法、半導体装置の製造方法及びインプリント装置
JP2012031240A (ja) * 2010-07-29 2012-02-16 Hitachi High-Technologies Corp 微細構造転写用の光重合性樹脂組成物
JP2012146699A (ja) 2011-01-06 2012-08-02 Canon Inc インプリント装置、及びそれを用いた物品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010069762A (ja) 2008-09-19 2010-04-02 Toshiba Corp パターン形成方法
JP2011165855A (ja) 2010-02-09 2011-08-25 Toshiba Corp パターン形成方法
JP2012243805A (ja) 2011-05-16 2012-12-10 Toshiba Corp パターン形成方法
JP2013004744A (ja) 2011-06-16 2013-01-07 Canon Inc インプリント方法、インプリント装置及び物品の製造方法

Also Published As

Publication number Publication date
JP2021036578A (ja) 2021-03-04
KR20210022494A (ko) 2021-03-03
US20210055649A1 (en) 2021-02-25
US11531266B2 (en) 2022-12-20

Similar Documents

Publication Publication Date Title
JP5268524B2 (ja) 加工装置
JP6823374B2 (ja) パターンの欠陥の分析を行う方法、インプリント装置、及び物品の製造方法
KR101879480B1 (ko) 임프린트 방법, 임프린트 장치, 물품 제조 방법, 및 프로그램
TWI392578B (zh) 即時壓印程序缺陷診斷技術
JP6716484B2 (ja) インプリント方法
US11531266B2 (en) Imprinting method, imprint apparatus, and article manufacturing method
JP7270417B2 (ja) インプリント装置の制御方法、インプリント装置、および物品製造方法
US20100320631A1 (en) Method of processing substrate and imprint device
US20120292799A1 (en) Pattern forming method and pattern forming apparatus
JP2024160394A (ja) 異物除去方法、異物除去装置、及び物品の製造方法
JP7137344B2 (ja) インプリント装置、物品の製造方法、情報処理装置、マップの編集を支援する方法及び記憶媒体
JP2013161816A (ja) パターン形成方法
JP6333152B2 (ja) 生成方法、情報処理装置、インプリント方法及び物品の製造方法
KR20190037114A (ko) 임프린트 장치, 임프린트 방법, 임프린트재의 배치 패턴의 결정 방법 및 물품의 제조 방법
JP7551694B2 (ja) 異物除去方法、異物除去装置、及び物品の製造方法
TW202527063A (zh) 成形方法、成形裝置及物品製造方法
JP7025235B2 (ja) パターン形成方法および物品製造方法
US7985957B2 (en) Methods for concealing surface defects
JP7612510B2 (ja) インプリント装置、インプリント方法、及び、物品製造方法
JP7657631B2 (ja) 評価装置、プログラム、評価方法、成形システム、および物品製造方法
JP5611399B2 (ja) 加工装置
JP2022144930A (ja) インプリント方法および半導体装置の製造方法
JP2019192753A (ja) 成形装置及び物品の製造方法
JP7043199B2 (ja) インプリント方法、プログラム、インプリント装置及び物品の製造方法
JP7361831B2 (ja) 情報処理装置、成形装置、成形方法及び物品の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230525

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230525

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240130

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240327

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240416

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240515

R150 Certificate of patent or registration of utility model

Ref document number: 7490476

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150