JP7482749B2 - リフトピンのコンタクト位置調整方法、リフトピンのコンタクト位置検知方法、および基板載置機構 - Google Patents
リフトピンのコンタクト位置調整方法、リフトピンのコンタクト位置検知方法、および基板載置機構 Download PDFInfo
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Description
図1は、一実施形態に係るリフトピンのコンタクト位置調整方法を実施可能な基板載置機構を有する基板処理装置の一例を示す断面図である。
本実施形態では基板処理装置として、スパッタリングによって基板上に膜を形成する成膜装置に適用した場合を例にとって説明する。基板としては、例えば半導体ウエハを挙げることができるが、これに限定されない。
次に、以上のような基板処理装置におけるリフトピンのコンタクト位置調整方法について説明する。
以上、実施形態について説明したが、今回開示された実施形態は、全ての点で例示であって制限的なものではないと考えられるべきである。上記の実施形態は、添付の特許請求の範囲およびその主旨を逸脱することなく、様々な形態で省略、置換、変更されてもよい。
10;処理容器
12;排気機構
30;スパッタ粒子放出部
32;ターゲット
40;基板載置台
46;静電チャック
46a;電極
48;直流電源
50;基板昇降機構
51;リフトピン
54;駆動機構
55;モータ
57;ベローズ
60;基板載置機構
70;制御部
121;基板載置機構制御部
122;電圧制御部
124;トルク波形作成部
125;コンタクト位置算出部
126;判定部
127;コンタクト位置調整部
W;基板
Claims (15)
- 基板を静電吸着する静電チャックを有し、基板を載置する基板載置台と、前記基板載置台の基板載置面に対して突没可能に設けられたリフトピンおよび前記リフトピンを昇降させるモータを有する駆動機構を備える基板昇降機構と、を具備する基板載置機構において、前記リフトピンの先端が前記基板にコンタクトする高さ位置であるコンタクト位置を調整するリフトピンのコンタクト位置調整方法であって、
前記基板載置台上に基板を配置し、前記静電チャックの電極に電圧を印加して前記基板をチャックした状態で、前記リフトピンの先端を前記載置面より下方の下端位置から前記載置面より上方の上端位置に移動させる際の前記モータのトルクの時間変化を示すトルク波形を、複数の電圧について作成することと、
前記複数のトルク波形から、前記リフトピンが前記基板にコンタクトした時点であるコンタクトポイントを求め、当該コンタクトポイントと前記モータの速度から、前記コンタクト位置を算出することと、
前記コンタクト位置が適正な範囲か否かを判定することと、
前記コンタクト位置が適正な範囲から外れていると判定された場合に、前記コンタクト位置を自動調整することと、
を有する、リフトピンのコンタクト位置調整方法。 - 前記基板載置機構は、前記リフトピンに、上方に向かうバネ力を及ぼすばね部材を有する、請求項1に記載のリフトピンのコンタクト位置調整方法。
- 前記コンタクト位置を算出する際に、前記複数の電圧について作成された前記トルク波形を重ねて前記コンタクトポイントを求める、請求項1または請求項2に記載のリフトピンのコンタクト位置調整方法。
- 前記コンタクトポイントは、前記複数の電圧のそれぞれに対応する前記トルク波形が分岐した時点である、請求項3に記載のリフトピンのコンタクト位置調整方法。
- 前記コンタクト位置は、前記下端位置を原点とした高さ位置として定義され、前記コンタクト位置の自動調整は、前記駆動機構を制御して前記下端位置を調整することによりなされる、請求項1から請求項4のいずれか一項に記載のリフトピンのコンタクト位置調整方法。
- 基板を静電吸着する静電チャックを有し、基板を載置する基板載置台と、前記基板載置台の基板載置面に対して突没可能に設けられたリフトピンおよび前記リフトピンを昇降させるモータを有する昇降部を有する基板昇降機構と、を備える基板載置機構において、前記リフトピンの先端が前記基板にコンタクトする高さ位置であるコンタクト位置を検知するリフトピンのコンタクト位置検知方法であって、
前記基板載置台上に基板を配置し、前記静電チャックの電極に電圧を印加して前記基板をチャックした状態で、前記リフトピンの先端を前記載置面より下方の下端位置から前記載置面より上方の上端位置に移動させた際の前記モータのトルクの時間変化を示すトルク波形を、複数の電圧について作成することと、
前記複数のトルク波形から前記リフトピンが前記基板にコンタクトした時点であるコンタクトポイントを求め、当該コンタクトポイントと前記モータの速度から、前記コンタクト位置を算出することと、
を有するリフトピンのコンタクト位置検知方法。 - 前記基板載置機構は、前記リフトピンに、上方に向かうバネ力を及ぼすばね部材を有する、請求項6に記載のリフトピンのコンタクト位置検知方法。
- 前記コンタクト位置を算出する際に、前記複数の電圧について作成された前記トルク波形を重ねて前記コンタクトポイントを求める、請求項6または請求項7に記載のリフトピンのコンタクト位置検知方法。
- 前記コンタクトポイントは、前記複数の電圧のそれぞれに対応する前記トルク波形が分岐した時点である、請求項8に記載のリフトピンのコンタクト位置検知方法。
- 基板を処理する基板処理装置の処理容器内で基板を載置する基板載置機構であって、
基板を静電吸着する静電チャックを有し、基板を載置する基板載置台と、
前記基板載置台の基板載置面に対して突没可能に設けられたリフトピンおよび前記リフトピンを昇降させるモータを有する駆動機構を備える基板昇降機構と、
制御部と、
を具備し
前記制御部は、
前記基板載置台上に基板を配置し、前記静電チャックの電極に電圧を印加して前記基板をチャックした状態で、前記駆動機構により前記リフトピンの先端を前記載置面より下方の下端位置から前記載置面より上方の上端位置に移動させた際の前記モータのトルクの時間変化を示すトルク波形を、複数の電圧について作成するトルク波形作成部と、
前記複数のトルク波形から前記リフトピンが前記基板にコンタクトした時点であるコンタクトポイントを求め、当該コンタクトポイントと前記モータの速度から、前記リフトピンの先端が前記基板にコンタクトする高さ位置であるコンタクト位置を算出するコンタクト位置算出部と、
前記コンタクト位置が適正な範囲か否かを判定する判定部と、
前記コンタクト位置が適正な範囲から外れていると判定された場合に、前記コンタクト位置を自動調整するコンタクト位置調整部と、
を有する、基板載置機構。 - 前記リフトピンに、上方に向かうバネ力を及ぼすばね部材をさらに備える、請求項10に記載の基板載置機構。
- 前記コンタクト位置算出部は、前記コンタクト位置を算出する際に、前記複数の電圧について作成された前記トルク波形を重ねて前記コンタクトポイントを求める、請求項10または請求項11に記載の基板載置機構。
- 前記コンタクト位置算出部は、前記複数の電圧のそれぞれに対応する前記トルク波形が分岐した時点を前記コンタクトポイントとする、請求項12に記載の基板載置機構。
- 前記コンタクト位置は、前記下端位置を原点とした高さ位置として定義され、前記コンタクト位置調整部は、前記駆動機構を制御して前記下端位置を調整する、請求項10から請求項13のいずれか一項に記載の基板載置機構。
- 前記基板処理装置は、ターゲットからのスパッタ粒子を前記基板に堆積させて膜を形成するスパッタ装置である、請求項10から請求項14のいずれか一項に記載の基板載置機構。
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