JP7478856B2 - 弾性部材及びこれを含むディスプレイ装置 - Google Patents
弾性部材及びこれを含むディスプレイ装置 Download PDFInfo
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H10K59/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Description
Claims (19)
- 第1領域及び第2領域を含む弾性部材であって、
前記弾性部材は、第1層と、前記第1層上の第2層と、を含み、フォールディング軸を基準としてフォールディング可能であり、
前記第1領域は、前記フォールディング軸を含む領域と定義され、前記第2領域は、前記第1領域よりも前記フォールディング軸から遠く離れた前記第1領域以外の領域と定義され、
前記第1層の前記第1領域及び前記第2領域のうち少なくとも一つの領域には、複数の孔または溝を含むパターン部が配置され、
前記第1層及び前記第2層は、金属を含み、
前記第1層の熱伝導度は、前記第2層の熱伝導度よりも大きく、
前記第2層の降伏強度は、前記第1層の降伏強度よりも大きく、
前記第1層の熱伝導度は、20W/mk以上であり、
前記第2層の降伏強度は、0.7GPa以上である、弾性部材。 - 前記第1層の厚さは、前記第2層の厚さよりも大きい、請求項1に記載の弾性部材。
- 前記第1層と前記第2層は、直接接触する、請求項1又は2に記載の弾性部材。
- 前記第1層と前記第2層との界面には、拡散部が配置され、
前記拡散部は、前記第1層の物質及び前記第2層の物質を含む、請求項3に記載の弾性部材。 - 前記第1層と前記第2層との間には、接着層が配置される、請求項1又は2に記載の弾性部材。
- 前記接着層の厚さは、前記第1層の厚さよりも小さく、前記第2層の厚さ以上である、請求項5に記載の弾性部材。
- 前記接着層は、金属粒子を含む、請求項5又は6に記載の弾性部材。
- 前記パターン部は、孔または溝形状である、請求項1乃至7のいずれか一項に記載の弾性部材。
- 前記第2領域の端部に配置される第1突出部及び第2突出部のうち少なくとも一つをさらに含む、請求項1乃至8のいずれか一項に記載の弾性部材。
- 前記第1層の厚さは、80μm~150μmであり、
前記第2層の厚さは、10μm~50μmである、請求項1乃至9のいずれか一項に記載の弾性部材。 - 前記第2層の厚さは、前記弾性部材の全体厚さの10%~40%である、請求項1乃至10のいずれか一項に記載の弾性部材。
- 前記パターン部は、前記第2層を部分的にエッチングして形成される、請求項1乃至11のいずれか一項に記載の弾性部材。
- 前記第2層上に配置される第3層をさらに含み、
前記第3層の前記第1領域及び前記第2領域のうち少なくとも一つの領域には、複数の孔または溝を含むパターン部が配置され、
前記第2層の降伏強度は、前記第3層の降伏強度よりも大きく、
前記第3層の熱伝導度は、前記第2層の熱伝導度よりも大きい、請求項1乃至12のいずれか一項に記載の弾性部材。 - 前記第2層及び前記第3層は、互いに直接接触する、請求項13に記載の弾性部材。
- 前記第3層の厚さは、前記第2層の厚さよりも大きい、請求項13又は14に記載の弾性部材。
- 請求項1乃至15のいずれか一項に記載の弾性部材と、
前記弾性部材上に配置され、表示パネル及びタッチパネルのうち少なくとも一つのパネルと、を含む、ディスプレイ装置。 - 前記弾性部材下に配置される保護層をさらに含み、
前記保護層の面積は、前記弾性部材の第1領域及び第2領域の面積の和よりも小さく、
前記保護層の厚さは、前記弾性部材の厚さよりも小さい、請求項16に記載のディスプレイ装置。 - 前記弾性部材と前記パネルとの間に配置される平坦化層をさらに含む、請求項16又は17に記載のディスプレイ装置。
- 前記保護層は、銅粒子を含み、
前記保護層は、前記弾性部材の面積に対して80%~90%の面積のサイズに配置される、請求項17に記載のディスプレイ装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR10-2020-0079402 | 2020-06-29 | ||
KR1020200079402A KR20220001255A (ko) | 2020-06-29 | 2020-06-29 | 탄성 부재 및 이를 포함하는 디스플레이 장치 |
PCT/KR2021/007688 WO2022005070A1 (ko) | 2020-06-29 | 2021-06-18 | 탄성 부재 및 이를 포함하는 디스플레이 장치 |
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JP2023532493A JP2023532493A (ja) | 2023-07-28 |
JP7478856B2 true JP7478856B2 (ja) | 2024-05-07 |
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US (1) | US20230301043A1 (ja) |
EP (1) | EP4174972A4 (ja) |
JP (1) | JP7478856B2 (ja) |
KR (1) | KR20220001255A (ja) |
CN (1) | CN115968491A (ja) |
WO (1) | WO2022005070A1 (ja) |
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CN111564677A (zh) * | 2020-05-25 | 2020-08-21 | 京东方科技集团股份有限公司 | 柔性显示装置 |
EP4336980A1 (en) * | 2021-07-20 | 2024-03-13 | Samsung Electronics Co., Ltd. | Electronic device comprising heat dissipation structure |
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2020
- 2020-06-29 KR KR1020200079402A patent/KR20220001255A/ko not_active Application Discontinuation
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2021
- 2021-06-18 CN CN202180051875.2A patent/CN115968491A/zh active Pending
- 2021-06-18 WO PCT/KR2021/007688 patent/WO2022005070A1/ko unknown
- 2021-06-18 US US18/013,315 patent/US20230301043A1/en active Pending
- 2021-06-18 JP JP2022580482A patent/JP7478856B2/ja active Active
- 2021-06-18 EP EP21831605.7A patent/EP4174972A4/en active Pending
Patent Citations (8)
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JP2014111280A (ja) | 2008-05-16 | 2014-06-19 | Nippon Steel Sumikin Materials Co Ltd | フレキシブルディスプレイ用ステンレス鋼箔の製造方法 |
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CN110853520A (zh) | 2019-11-28 | 2020-02-28 | 京东方科技集团股份有限公司 | 可折叠支撑件、显示装置 |
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CN115968491A (zh) | 2023-04-14 |
JP2023532493A (ja) | 2023-07-28 |
KR20220001255A (ko) | 2022-01-05 |
WO2022005070A1 (ko) | 2022-01-06 |
US20230301043A1 (en) | 2023-09-21 |
EP4174972A1 (en) | 2023-05-03 |
EP4174972A4 (en) | 2024-07-24 |
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