JP7467155B2 - 撮像ユニットおよび撮像装置 - Google Patents

撮像ユニットおよび撮像装置 Download PDF

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Publication number
JP7467155B2
JP7467155B2 JP2020025077A JP2020025077A JP7467155B2 JP 7467155 B2 JP7467155 B2 JP 7467155B2 JP 2020025077 A JP2020025077 A JP 2020025077A JP 2020025077 A JP2020025077 A JP 2020025077A JP 7467155 B2 JP7467155 B2 JP 7467155B2
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Japan
Prior art keywords
substrate
imaging
adhesive
opening
imaging element
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JP2020025077A
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English (en)
Japanese (ja)
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JP2021131409A5 (https=
JP2021131409A (ja
Inventor
俊史 浦上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2020025077A priority Critical patent/JP7467155B2/ja
Priority to US17/176,967 priority patent/US11343417B2/en
Publication of JP2021131409A publication Critical patent/JP2021131409A/ja
Publication of JP2021131409A5 publication Critical patent/JP2021131409A5/ja
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
JP2020025077A 2020-02-18 2020-02-18 撮像ユニットおよび撮像装置 Active JP7467155B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020025077A JP7467155B2 (ja) 2020-02-18 2020-02-18 撮像ユニットおよび撮像装置
US17/176,967 US11343417B2 (en) 2020-02-18 2021-02-16 Image pickup unit and image pickup apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020025077A JP7467155B2 (ja) 2020-02-18 2020-02-18 撮像ユニットおよび撮像装置

Publications (3)

Publication Number Publication Date
JP2021131409A JP2021131409A (ja) 2021-09-09
JP2021131409A5 JP2021131409A5 (https=) 2023-01-30
JP7467155B2 true JP7467155B2 (ja) 2024-04-15

Family

ID=77273154

Family Applications (1)

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JP2020025077A Active JP7467155B2 (ja) 2020-02-18 2020-02-18 撮像ユニットおよび撮像装置

Country Status (2)

Country Link
US (1) US11343417B2 (https=)
JP (1) JP7467155B2 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1633586S (https=) * 2018-05-15 2019-06-10
JP1629824S (https=) * 2018-05-15 2019-04-22
JP1638779S (https=) * 2018-05-15 2019-08-13
JP1637187S (https=) * 2018-05-15 2019-07-22
JP1638780S (https=) * 2018-05-15 2019-08-13
JP1636779S (https=) * 2018-05-15 2019-07-22
JP1629828S (https=) * 2018-05-15 2019-04-22
JP1629825S (https=) * 2018-05-15 2019-04-22
JP1636781S (https=) * 2018-05-15 2019-07-22
JP1638776S (https=) * 2018-05-15 2019-08-13
JP1629820S (https=) * 2018-05-15 2019-04-22
JP1638777S (https=) * 2018-05-15 2019-08-13
JP7542032B2 (ja) * 2022-06-23 2024-08-29 キヤノン株式会社 撮像装置
WO2024070587A1 (ja) * 2022-09-29 2024-04-04 富士フイルム株式会社 ブレ補正装置
SE546247C2 (en) * 2022-11-17 2024-09-10 Topgolf Sweden Ab Method and arrangement for adjusting a camera lens in relation to a camera sensor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012034070A (ja) 2010-07-29 2012-02-16 Casio Comput Co Ltd 基板の接着方法、基板の実装構造、電子機器、及び基板
JP2012095177A (ja) 2010-10-28 2012-05-17 Sony Corp 撮像素子パッケージ、撮像素子パッケージの製造方法、及び、電子機器
JP2013005047A (ja) 2011-06-13 2013-01-07 Olympus Corp 撮像装置及びこれを用いた電子機器
US20130193545A1 (en) 2012-01-27 2013-08-01 Samsung Electronics Co., Ltd. Semiconductor apparatus and image sensor package using the same
JP2014197769A (ja) 2013-03-29 2014-10-16 株式会社ニコン 撮像ユニット及び撮像装置
JP2019145929A (ja) 2018-02-19 2019-08-29 キヤノン株式会社 撮像装置およびその制御方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4818750B2 (ja) 2006-02-23 2011-11-16 オリンパスイメージング株式会社 撮像装置
US7829833B2 (en) * 2005-05-24 2010-11-09 Olympus Imaging Corp. Arranging and/or supporting an image pickup device in an image pickup apparatus
JP2015012211A (ja) 2013-07-01 2015-01-19 株式会社ニコン 撮像ユニット及び撮像装置
CN103996684B (zh) * 2014-05-20 2017-06-20 格科微电子（上海）有限公司 图像传感器结构及其封装方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012034070A (ja) 2010-07-29 2012-02-16 Casio Comput Co Ltd 基板の接着方法、基板の実装構造、電子機器、及び基板
JP2012095177A (ja) 2010-10-28 2012-05-17 Sony Corp 撮像素子パッケージ、撮像素子パッケージの製造方法、及び、電子機器
JP2013005047A (ja) 2011-06-13 2013-01-07 Olympus Corp 撮像装置及びこれを用いた電子機器
US20130193545A1 (en) 2012-01-27 2013-08-01 Samsung Electronics Co., Ltd. Semiconductor apparatus and image sensor package using the same
JP2014197769A (ja) 2013-03-29 2014-10-16 株式会社ニコン 撮像ユニット及び撮像装置
JP2019145929A (ja) 2018-02-19 2019-08-29 キヤノン株式会社 撮像装置およびその制御方法

Also Published As

Publication number Publication date
US11343417B2 (en) 2022-05-24
US20210258455A1 (en) 2021-08-19
JP2021131409A (ja) 2021-09-09

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