JP7467152B2 - 収容容器及び基板状センサの充電方法 - Google Patents

収容容器及び基板状センサの充電方法 Download PDF

Info

Publication number
JP7467152B2
JP7467152B2 JP2020022759A JP2020022759A JP7467152B2 JP 7467152 B2 JP7467152 B2 JP 7467152B2 JP 2020022759 A JP2020022759 A JP 2020022759A JP 2020022759 A JP2020022759 A JP 2020022759A JP 7467152 B2 JP7467152 B2 JP 7467152B2
Authority
JP
Japan
Prior art keywords
sensor
substrate
container body
storage container
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020022759A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021129024A (ja
JP2021129024A5 (https=
Inventor
侑治 秋月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2020022759A priority Critical patent/JP7467152B2/ja
Priority to US17/168,555 priority patent/US11984332B2/en
Publication of JP2021129024A publication Critical patent/JP2021129024A/ja
Publication of JP2021129024A5 publication Critical patent/JP2021129024A5/ja
Application granted granted Critical
Publication of JP7467152B2 publication Critical patent/JP7467152B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
    • H02J7/70—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries characterised by the mechanical construction
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
    • H02J7/70—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries characterised by the mechanical construction
    • H02J7/731—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries characterised by the mechanical construction specially adapted for holding portable devices containing batteries
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
JP2020022759A 2020-02-13 2020-02-13 収容容器及び基板状センサの充電方法 Active JP7467152B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020022759A JP7467152B2 (ja) 2020-02-13 2020-02-13 収容容器及び基板状センサの充電方法
US17/168,555 US11984332B2 (en) 2020-02-13 2021-02-05 Container and method for charging substrate-like sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020022759A JP7467152B2 (ja) 2020-02-13 2020-02-13 収容容器及び基板状センサの充電方法

Publications (3)

Publication Number Publication Date
JP2021129024A JP2021129024A (ja) 2021-09-02
JP2021129024A5 JP2021129024A5 (https=) 2023-01-31
JP7467152B2 true JP7467152B2 (ja) 2024-04-15

Family

ID=77273061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020022759A Active JP7467152B2 (ja) 2020-02-13 2020-02-13 収容容器及び基板状センサの充電方法

Country Status (2)

Country Link
US (1) US11984332B2 (https=)
JP (1) JP7467152B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11924972B2 (en) 2020-06-02 2024-03-05 Applied Materials, Inc. Diagnostic disc with a high vacuum and temperature tolerant power source
US11589474B2 (en) 2020-06-02 2023-02-21 Applied Materials, Inc. Diagnostic disc with a high vacuum and temperature tolerant power source
TWI899491B (zh) * 2021-08-04 2025-10-01 日商東京威力科創股份有限公司 收容容器及基板狀感測器之充電方法
JP7648310B2 (ja) * 2021-08-04 2025-03-18 東京エレクトロン株式会社 収容容器及び基板状センサの充電方法
US11817724B2 (en) 2022-03-02 2023-11-14 Applied Materials, Inc. Enclosure system with charging assembly
KR102748315B1 (ko) * 2022-09-28 2024-12-31 주식회사 저스템 웨이퍼 용기의 습도 및 온도 센싱 장치
KR102765965B1 (ko) * 2023-02-20 2025-02-07 이규옥 Oht로 이동 가능한 foup 내의 로봇감지 레이저 센서 시스템의 위치 판정 장치
US12562351B2 (en) 2024-01-30 2026-02-24 Applied Materials, Inc. Extreme edge sheath tunability with non-movable edge ring

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261159A (ja) 2000-12-04 2002-09-13 Ebara Corp 基板搬送容器
JP2004153119A (ja) 2002-10-31 2004-05-27 Tokyo Electron Ltd プロセスモニタ及び半導体製造装置
JP2005521926A (ja) 2002-02-06 2005-07-21 サイバーオプティクス セミコンダクタ インコーポレイテッド ワイヤレス基板状センサ
JP2006513583A (ja) 2002-12-03 2006-04-20 センサレー コーポレイション 統合化されたプロセス条件検知用ウェハおよびデータ解析システム
JP2013506297A (ja) 2009-09-25 2013-02-21 ケーエルエー−テンカー・コーポレーション 非接触インタフェースシステム
JP2016500929A (ja) 2012-10-30 2016-01-14 ケーエルエー−テンカー コーポレイション 半導体ウェーハ搬送システムに利用するための自動インターフェース装置及び方法
JP2018526814A (ja) 2015-06-16 2018-09-13 ケーエルエー−テンカー コーポレイション 半導体工場自動化システムのパラメタを監視するシステム及び方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7282889B2 (en) * 2001-04-19 2007-10-16 Onwafer Technologies, Inc. Maintenance unit for a sensor apparatus
US6781205B1 (en) * 2002-10-11 2004-08-24 Ion Systems, Inc. Electrostatic charge measurement on semiconductor wafers
TWI268429B (en) 2003-11-29 2006-12-11 Onwafer Technologies Inc Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus
JP7037379B2 (ja) * 2018-02-06 2022-03-16 ローツェ株式会社 薄板状基板保持装置、及び保持装置を備える搬送ロボット
US10916464B1 (en) * 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
US12237189B2 (en) * 2019-11-19 2025-02-25 Micron Technology, Inc. Wafer storage devices configured to measure physical properties of wafers stored therein

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261159A (ja) 2000-12-04 2002-09-13 Ebara Corp 基板搬送容器
JP2005521926A (ja) 2002-02-06 2005-07-21 サイバーオプティクス セミコンダクタ インコーポレイテッド ワイヤレス基板状センサ
JP2004153119A (ja) 2002-10-31 2004-05-27 Tokyo Electron Ltd プロセスモニタ及び半導体製造装置
JP2006513583A (ja) 2002-12-03 2006-04-20 センサレー コーポレイション 統合化されたプロセス条件検知用ウェハおよびデータ解析システム
JP2013506297A (ja) 2009-09-25 2013-02-21 ケーエルエー−テンカー・コーポレーション 非接触インタフェースシステム
JP2016500929A (ja) 2012-10-30 2016-01-14 ケーエルエー−テンカー コーポレイション 半導体ウェーハ搬送システムに利用するための自動インターフェース装置及び方法
JP2018526814A (ja) 2015-06-16 2018-09-13 ケーエルエー−テンカー コーポレイション 半導体工場自動化システムのパラメタを監視するシステム及び方法

Also Published As

Publication number Publication date
JP2021129024A (ja) 2021-09-02
US20210257234A1 (en) 2021-08-19
US11984332B2 (en) 2024-05-14

Similar Documents

Publication Publication Date Title
JP7467152B2 (ja) 収容容器及び基板状センサの充電方法
KR100571589B1 (ko) Ｓｍｉｆ 포드 도어 및 포트 도어 분리 및 복귀 시스템
TWI776016B (zh) 薄板狀基板保持裝置及具備保持裝置之搬送機器人
TWM589358U (zh) 半導體製程模組的頂環
JP2002520831A (ja) 垂直方向インタフェース対応の開放システム
TWI891810B (zh) 收納模組、基板處理系統及消耗構件的搬運方法
EP0555890A2 (en) Vacuum processing system
KR20020025051A (ko) 웨이퍼 핸들링 시스템
US11923232B2 (en) Positioning apparatus, processing system, and positioning method
TWI899491B (zh) 收容容器及基板狀感測器之充電方法
WO2020121869A1 (ja) 基板処理装置の処理方法及び基板処理装置
US4842680A (en) Advanced vacuum processor
JP7660006B2 (ja) 基板処理装置、教示情報生成方法および教示セット
JP7648310B2 (ja) 収容容器及び基板状センサの充電方法
US20190164796A1 (en) Substrate transport system, substrate processing apparatus, hand position adjustment method
JP7545805B2 (ja) ロボット及びそれを備えた基板搬送システム
KR20230111717A (ko) 웨이퍼의 온도 및 습도 측정장치
CN220543862U (zh) 装载腔室及半导体工艺设备
JP2009224423A (ja) 基板処理装置
JP2010238878A (ja) 搬送室
KR20070070435A (ko) 기판 이송 장치
WO2025154561A1 (ja) 収容装置、半導体製造装置及びカセット
KR200279496Y1 (ko) 반도체 웨이퍼 이동공급을 위한 웨이퍼 정면 개방형 용기착탈장치
KR20090065971A (ko) Ｓｍｉｆ 장치
JPWO2006070630A1 (ja) 基板処理装置および基板搬送方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230123

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230123

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20231130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231226

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240226

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240305

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240403

R150 Certificate of patent or registration of utility model

Ref document number: 7467152

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150