JP7460767B2 - Edwdcイヤーパッド、イヤーマフ部品およびヘッドセット - Google Patents
Edwdcイヤーパッド、イヤーマフ部品およびヘッドセット Download PDFInfo
- Publication number
- JP7460767B2 JP7460767B2 JP2022531578A JP2022531578A JP7460767B2 JP 7460767 B2 JP7460767 B2 JP 7460767B2 JP 2022531578 A JP2022531578 A JP 2022531578A JP 2022531578 A JP2022531578 A JP 2022531578A JP 7460767 B2 JP7460767 B2 JP 7460767B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- outer layer
- inner layer
- ear pad
- ear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 claims description 14
- 238000005192 partition Methods 0.000 claims description 10
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 239000006260 foam Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 387
- 239000000463 material Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 15
- 238000009413 insulation Methods 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000005236 sound signal Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 210000005069 ears Anatomy 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 4
- 239000010985 leather Substances 0.000 description 4
- 238000009958 sewing Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 210000002268 wool Anatomy 0.000 description 4
- 210000003128 head Anatomy 0.000 description 3
- 210000003491 skin Anatomy 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 210000000613 ear canal Anatomy 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 102000004169 proteins and genes Human genes 0.000 description 2
- 108090000623 proteins and genes Proteins 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 210000004207 dermis Anatomy 0.000 description 1
- 210000000883 ear external Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1083—Reduction of ambient noise
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1008—Earpieces of the supra-aural or circum-aural type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/105—Earpiece supports, e.g. ear hooks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
- H04R1/1075—Mountings of transducers in earphones or headphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Headphones And Earphones (AREA)
- Soundproofing, Sound Blocking, And Sound Damping (AREA)
Description
2 イヤーマフ部品
21 ハウジング
22 駆動体
221 振動板
23 前方キャビティ
231 前方キャビティハウジング
24 後方キャビティ
241 後方キャビティハウジング
25 障壁板
251 音声出力ポート
26 追加の後方キャビティ
261 追加の後方キャビティハウジング
27 仕切り板
29 イヤーパッド
291 イヤーパッド頂部
292 イヤーパッド底部
293 外面側
294 内面側
295 ブラケット
2951 留め具
2952 接触部材
29521 第1の接触部材
29522 第2の接触部材
296 外層
2961 第1の外層部
2962 第2の外層部
2963 外層接続箇所
297 内層
2971 第1の内層部
2972 第2の内層部
298 第1の媒体層
299 第2の媒体層
Claims (14)
- イヤーパッドであって、前記イヤーパッドが環状構造であり、前記イヤーパッドが内層および前記内層を覆う外層を備え、前記内層および前記外層がそれぞれ環状構造であり、
前記内層と前記外層が第1の媒体層によって分離され、前記内層が第2の媒体層を被覆し、
前記イヤーパッドがブラケットをさらに備え、前記ブラケットが接触部材を備え、前記接触部材が前記内層かつ前記外層と接触し、
前記第1の媒体層の音響インピーダンスが前記内層および前記外層の音響インピーダンスと異なる、
イヤーパッド。 - 前記内層または前記外層の音響インピーダンスが、前記第1の媒体層の前記音響インピーダンスの少なくとも10倍である、請求項1に記載のイヤーパッド。
- 前記内層または前記外層の音響インピーダンスが、前記第1の媒体層の前記音響インピーダンスの少なくとも1000倍である、請求項1に記載のイヤーパッド。
- 前記外層が第1の外層部および第2の外層部を備え、前記第1の外層部または前記第2の外層部の全部もしくは一部が前記内層を覆っている、請求項1から3のいずれか一項に記載のイヤーパッド。
- 前記外層が第1の外層部および第2の外層部を備え、前記内層が第1の内層部を備え、前記第1の外層部が前記第1の内層部を覆う、請求項1から3のいずれか一項に記載のイヤーパッド。
- 前記外層が第1の外層部および第2の外層部を備え、前記内層が第1の内層部および第2の内層部を備え、前記第1の外層部が前記第1の内層部を覆い、前記第2の外層部が前記第2の内層部を覆う、請求項1から3のいずれか一項に記載のイヤーパッド。
- 前記第1の媒体層の厚さが、前記内層の厚さまたは前記外層の厚さの10倍を超えない、請求項1から4のいずれか一項に記載のイヤーパッド。
- 1層の内層または2層以上の内層があり、隣接する2層ごとに第3の媒体層によって分離されている、請求項1から7のいずれか一項に記載のイヤーパッド。
- 前記第1の媒体層が空気または発泡体である、請求項1から8のいずれか一項に記載のイヤーパッド。
- 前記第3の媒体層が空気または発泡体である、請求項8に記載のイヤーパッド。
- 前記内層または前記外層が熱圧着または接着方式で前記ブラケットの前記接触部材と接触している、請求項1から10のいずれか一項に記載のイヤーパッド。
- イヤーマフ部品であって、前記イヤーマフ部品がハウジングと、請求項1から11のいずれか一項に記載のイヤーパッドとを備え、前記イヤーパッドの底部が前記ハウジングに固定されている、イヤーマフ部品。
- イヤーマフ部品であって、前記イヤーマフ部品がイヤーパッドとハウジングとを備え、前記イヤーマフ部品が請求項1から11のいずれか一項に記載のイヤーパッドを備え、前記イヤーパッドが内層、外層およびブラケットを備え、前記内層および前記外層が前記ブラケットの留め具を使用することによってヘッドセットの前方キャビティ壁、後方キャビティ壁または仕切り板に固定されている、イヤーマフ部品。
- ヘッドセットであって、前記ヘッドセットがヘッドバンドと、前記ヘッドバンドの2つの端部に接続されたヘッドセット受信端とを備え、前記ヘッドセット受信端が請求項1から11のいずれか一項に記載のイヤーパッドを備える、ヘッドセット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911217326.9 | 2019-11-30 | ||
CN201911217326.9A CN112887859A (zh) | 2019-11-30 | 2019-11-30 | 一种耳垫,耳罩部件及耳机 |
PCT/CN2020/132719 WO2021104517A1 (zh) | 2019-11-30 | 2020-11-30 | 一种耳垫,耳罩部件及耳机 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023503669A JP2023503669A (ja) | 2023-01-31 |
JP7460767B2 true JP7460767B2 (ja) | 2024-04-02 |
Family
ID=76039542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022531578A Active JP7460767B2 (ja) | 2019-11-30 | 2020-11-30 | Edwdcイヤーパッド、イヤーマフ部品およびヘッドセット |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220295172A1 (ja) |
EP (1) | EP4054204A4 (ja) |
JP (1) | JP7460767B2 (ja) |
KR (1) | KR20220104046A (ja) |
CN (1) | CN112887859A (ja) |
WO (1) | WO2021104517A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138722A (en) | 1991-07-02 | 1992-08-18 | David Clark Company Inc. | Headset ear seal |
JP2009105841A (ja) | 2007-10-25 | 2009-05-14 | Sony Corp | イヤパッド及びヘッドホン装置 |
JP2010062732A (ja) | 2008-09-02 | 2010-03-18 | Sony Corp | ヘッドホン |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2622159A (en) * | 1950-03-11 | 1952-12-16 | Sydney K Herman | Ear pad for earpieces |
US3602329A (en) * | 1970-01-07 | 1971-08-31 | Columbia Broadcasting Systems | Conformal ear enclosure |
US3829624A (en) * | 1973-04-02 | 1974-08-13 | Educational Electronics Inc | Headset and method of making it |
AT377664B (de) * | 1983-05-26 | 1985-04-25 | Akg Akustische Kino Geraete | Ohrpolster |
AT383930B (de) * | 1985-11-18 | 1987-09-10 | Akg Akustische Kino Geraete | Ohrpolster fuer kopfhoerer |
US4856118A (en) * | 1987-02-11 | 1989-08-15 | Bose Corporation | Headphone cushioning |
US5144678A (en) * | 1991-02-04 | 1992-09-01 | Golden West Communications Inc. | Automatically switched headset |
CN2168316Y (zh) * | 1993-04-08 | 1994-06-08 | 秦丽贤 | 降噪声通话式耳罩 |
CA2229859A1 (en) * | 1996-06-21 | 1997-12-24 | Cabot Safety Intermediate Corporation | Acoustical earmuff with incorporated snap-in foam cushion |
GB9805619D0 (en) * | 1998-03-18 | 1998-05-13 | Noise Cancellation Tech | Cushioned earphones |
GB2394166B (en) * | 2002-10-14 | 2006-01-18 | Thales Plc | Cushions |
CN2650740Y (zh) * | 2003-10-15 | 2004-10-27 | 北京理工大学 | 抗噪声隔音耳罩 |
US20060269090A1 (en) * | 2005-05-27 | 2006-11-30 | Roman Sapiejewski | Supra-aural headphone noise reducing |
US7248705B1 (en) * | 2005-12-29 | 2007-07-24 | Van Hauser Llc | Noise reducing headphones with sound conditioning |
EP2127469A2 (en) * | 2006-12-04 | 2009-12-02 | Adaptive Technologies, Inc. | Sound-attenuating earmuff having isolated double-shell structure |
US8467539B2 (en) * | 2008-11-26 | 2013-06-18 | Bose Corporation | High transmission loss cushion |
US8374373B2 (en) * | 2008-11-26 | 2013-02-12 | Bose Corporation | High transmission loss headphone cushion |
DE202008016854U1 (de) * | 2008-12-22 | 2010-02-25 | Sennheiser Electronic Gmbh & Co. Kg | Hörer, Headset und Ohrpolster |
CN201887919U (zh) * | 2010-10-26 | 2011-06-29 | 航宇救生装备有限公司 | 一种降噪耳机 |
EP2763638B1 (en) * | 2011-10-07 | 2019-02-20 | Hearing Components, Inc. | Foam cushion for headphones |
US8651229B2 (en) * | 2012-06-05 | 2014-02-18 | Honeywell International Inc. | Hearing protection |
US20130329933A1 (en) * | 2012-06-06 | 2013-12-12 | Timothy Val Kolton | Hexagonal Headphone Earpiece |
EP2709379A1 (en) * | 2012-09-17 | 2014-03-19 | Sennheiser Communications A/S | Ear appliance |
CN103905946B (zh) * | 2012-12-28 | 2017-08-25 | Gn奈康有限公司 | 金属耳垫 |
US9438980B2 (en) * | 2014-11-20 | 2016-09-06 | Merry Electronics (Shenzhen) Co., Ltd. | Headphone ear cup |
AU2016322836B2 (en) * | 2015-09-14 | 2021-07-29 | Wing Acoustics Limited | Improvements in or relating to audio transducers |
US10573139B2 (en) * | 2015-09-16 | 2020-02-25 | Taction Technology, Inc. | Tactile transducer with digital signal processing for improved fidelity |
CN205144868U (zh) * | 2015-10-22 | 2016-04-13 | 中国人民解放军海军医学研究所 | 双罩杯结构防噪声耳罩 |
US10080077B2 (en) * | 2016-02-09 | 2018-09-18 | Bose Corporation | Ear cushion for headphone |
CN105635886A (zh) * | 2016-03-29 | 2016-06-01 | 张清华 | 一种耳垫和头梁设置有液袋的头戴式耳机 |
CN107484053A (zh) * | 2016-06-08 | 2017-12-15 | 星锐安应用材料股份有限公司 | 穿戴舒适的穿戴式电子装置与其制作方法 |
CN109314812B (zh) * | 2016-06-22 | 2020-02-28 | 杜比实验室特许公司 | 耳机系统 |
CN206389511U (zh) * | 2016-12-31 | 2017-08-08 | 东莞市小林电子有限公司 | 一种保温隔音耳机 |
US10653016B1 (en) * | 2017-06-07 | 2020-05-12 | Facebook Technologies, Llc | Facial-interface cushion, system, and method for head-mounted displays |
US10841686B2 (en) * | 2017-08-23 | 2020-11-17 | Neal John Brace | Accommodating ear pads |
US10187716B1 (en) * | 2017-09-27 | 2019-01-22 | Bose Corporation | Composite earcushion |
US11044542B2 (en) * | 2017-09-27 | 2021-06-22 | Bose Corporation | Composite earcushion |
US10469939B1 (en) * | 2017-09-29 | 2019-11-05 | Apple Inc. | Headphones with tunable dampening features |
US10771876B1 (en) * | 2017-09-29 | 2020-09-08 | Apple Inc. | Headphones with acoustically split cushions |
US10779070B2 (en) * | 2018-01-11 | 2020-09-15 | Newtonoid Technologies, L.L.C. | Thermal pads |
US10524040B2 (en) * | 2018-01-29 | 2019-12-31 | Apple Inc. | Headphones with orientation sensors |
US10455314B1 (en) * | 2018-06-21 | 2019-10-22 | Plantronics, Inc. | Air bladder headband cushion |
CN109246510A (zh) * | 2018-09-28 | 2019-01-18 | 出门问问信息科技有限公司 | 耳机 |
US11190878B1 (en) * | 2020-09-16 | 2021-11-30 | Apple Inc. | Headphones with on-head detection |
US11277679B1 (en) * | 2020-09-16 | 2022-03-15 | Apple Inc. | Headphone earcup structure |
CN116076087A (zh) * | 2020-10-09 | 2023-05-05 | Gn 奥迪欧有限公司 | 具有不同性质的多种泡沫的耳塞式耳垫 |
US20220239998A1 (en) * | 2021-01-28 | 2022-07-28 | Sony Interactive Entertainment LLC | Headphone ear pad to optimize comfort and maintain sound quality |
CN115706886A (zh) * | 2021-08-13 | 2023-02-17 | Gn 奥迪欧有限公司 | 具有交错穿孔的贴耳式头戴耳机 |
-
2019
- 2019-11-30 CN CN201911217326.9A patent/CN112887859A/zh active Pending
-
2020
- 2020-11-30 KR KR1020227021613A patent/KR20220104046A/ko not_active Application Discontinuation
- 2020-11-30 JP JP2022531578A patent/JP7460767B2/ja active Active
- 2020-11-30 EP EP20893602.1A patent/EP4054204A4/en active Pending
- 2020-11-30 WO PCT/CN2020/132719 patent/WO2021104517A1/zh unknown
-
2022
- 2022-05-29 US US17/827,719 patent/US20220295172A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138722A (en) | 1991-07-02 | 1992-08-18 | David Clark Company Inc. | Headset ear seal |
JP2009105841A (ja) | 2007-10-25 | 2009-05-14 | Sony Corp | イヤパッド及びヘッドホン装置 |
JP2010062732A (ja) | 2008-09-02 | 2010-03-18 | Sony Corp | ヘッドホン |
Also Published As
Publication number | Publication date |
---|---|
KR20220104046A (ko) | 2022-07-25 |
CN112887859A (zh) | 2021-06-01 |
US20220295172A1 (en) | 2022-09-15 |
EP4054204A1 (en) | 2022-09-07 |
JP2023503669A (ja) | 2023-01-31 |
WO2021104517A1 (zh) | 2021-06-03 |
EP4054204A4 (en) | 2022-12-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0873040B1 (en) | Acoustic noise reduction headset | |
US8111858B2 (en) | Supra-aural headphone noise reducing | |
US9654865B2 (en) | Earphone | |
JP5363825B2 (ja) | ノイズキャンセルヘッドホン | |
JP5441164B2 (ja) | ヘッドホン | |
JPH05207579A (ja) | イヤースピーカ | |
JP2011015338A (ja) | イヤーマフ及びヘッドホン | |
US20210058693A1 (en) | Headphone arrangements for generating natural directional pinna cues | |
WO2024001979A1 (zh) | 电子设备 | |
CN208386874U (zh) | 耳机 | |
US20220225015A1 (en) | Headset | |
CN114268867A (zh) | 头戴式耳机耳罩结构 | |
JP7460767B2 (ja) | Edwdcイヤーパッド、イヤーマフ部品およびヘッドセット | |
JP2019531649A (ja) | スピーカシステム | |
JP3208762U (ja) | モバイル通話装置及びモバイル通話装置に使用するデュアル周波数の受話器 | |
CN220985818U (zh) | 耳机 | |
US11997450B2 (en) | Audio systems, devices, and methods | |
CN116614743A (zh) | 一种耳罩及头戴式耳机 | |
JPH0631834Y2 (ja) | イヤホーン及びイヤホーン用パッド | |
JPS6224998B2 (ja) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220706 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220706 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230727 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230904 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231204 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240304 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240321 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7460767 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |