WO2021104517A1 - 一种耳垫，耳罩部件及耳机 - Google Patents

一种耳垫，耳罩部件及耳机 Download PDF

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Publication number
WO2021104517A1
WO2021104517A1 PCT/CN2020/132719 CN2020132719W WO2021104517A1 WO 2021104517 A1 WO2021104517 A1 WO 2021104517A1 CN 2020132719 W CN2020132719 W CN 2020132719W WO 2021104517 A1 WO2021104517 A1 WO 2021104517A1
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WO
WIPO (PCT)
Prior art keywords
layer
outer layer
ear pad
inner layer
ear
Prior art date
Application number
PCT/CN2020/132719
Other languages
English (en)
French (fr)
Inventor
马国臻
吴融融
郑勇
张玉
吉成霞
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to KR1020227021613A priority Critical patent/KR20220104046A/ko
Priority to EP20893602.1A priority patent/EP4054204A4/en
Priority to JP2022531578A priority patent/JP7460767B2/ja
Publication of WO2021104517A1 publication Critical patent/WO2021104517A1/zh
Priority to US17/827,719 priority patent/US20220295172A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008—Earpieces of the supra-aural or circum-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/105—Earpiece supports, e.g. ear hooks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1083—Reduction of ambient noise
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058—Manufacture or assembly
    • H04R1/1075—Mountings of transducers in earphones or headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups

Definitions

  • This application relates to the technical field of consumer electronic products, in particular to electronic devices that process audio.
  • the noise in the surrounding environment is very large, it will seriously interfere with the sound signal inside the earphone. Therefore, it is generally desirable to isolate the noise in the surrounding environment so that the user does not listen to the audio signal through the earphone. affected.
  • the existing headset can achieve good noise reduction performance through the combination of active noise reduction and passive noise reduction.
  • active noise reduction is mainly considered from the software algorithm
  • passive noise reduction is mainly considered from the structural design and material selection of the headset.
  • the ear pad part In the structure of the entire headset, the ear pad part not only serves as a buffer to prevent the earphone shell from directly contacting the user's head, but also serves to close the space between the shell and the user's ears, thereby acting as an important barrier to isolate external noise .
  • the design of ear cushion materials and structure directly affects the passive noise reduction capability of the headset. How to improve the noise reduction capability of the headset through the ear cushion material and structure design is a problem that needs to be solved urgently.
  • the embodiments of the present application provide a noise reduction ear pad, a noise reduction earmuff component and a noise reduction earphone to reduce the influence of noise in the external environment on the sound quality of the earphone.
  • an embodiment of the present application provides an ear pad.
  • the ear pad has a ring structure, and the ear pad includes an inner layer and an outer layer covering the inner layer.
  • the inner layer and the outer layer are respectively a ring structure.
  • a first dielectric layer is provided between the inner layer and the outer layer; the inner layer covers the second dielectric layer; the acoustic impedance of the first dielectric layer is the same as the acoustic impedance of the inner layer and the outer layer different.
  • the ear pads provided by the application examples include a double-layered inner layer and an outer layer with a first dielectric layer in between. Compared with traditional ear pads, its noise reduction ability is significantly improved, especially in the mid-to-high frequency noise reduction ability. There is a significant improvement.
  • the ear pad further includes a bracket, the bracket includes a contact piece, and the contact piece is in contact with the inner layer or the outer layer.
  • the inner layer and the outer layer can be fixed by the bracket, and the thickness of the first medium between the inner layer and the outer layer can be adjusted.
  • the outer layer includes a first portion of the outer layer and a second portion of the outer layer, and all or part of the first portion of the outer layer or the second portion of the outer layer Cover the inner layer.
  • the degree of noise reduction can be controlled by selecting the area covered.
  • the outer layer includes a first portion of an outer layer and a second portion of an outer layer
  • the inner layer includes a first portion of an inner layer
  • the first portion of an outer layer covers the inner layer. The first part of the layer.
  • the outer layer includes a first portion of an outer layer and a second portion of an outer layer
  • the inner layer includes a first portion of an inner layer and a second portion of an inner layer.
  • the first part covers the first part of the inner layer
  • the second part of the outer layer covers the second part of the inner layer.
  • the thickness of the first dielectric layer does not exceed 10 times the thickness of the inner layer or the thickness of the outer layer.
  • the thickness of the first dielectric layer is at least 10 times the thickness of the inner layer or the outer layer, the proportion of sound energy being reflected and dissipated at the interface of different media is high, thereby passively reducing noise The effect is good.
  • the acoustic impedance of the inner layer or the outer layer is at least 10 times the acoustic impedance of the first dielectric layer.
  • the acoustic impedance of the inner layer or the outer layer is at least 1000 times the acoustic impedance of the first dielectric layer.
  • the inner layer is one layer, two layers or more than two layers, and there is a third dielectric layer between every two adjacent layers. As the number of layers increases, the proportion of sound energy being reflected and dissipated at the interface of different media is high, thereby improving the effect of passive noise reduction.
  • the first medium layer or the third medium layer is air. Choosing air as the first medium layer or the third medium layer can not only make the sound energy be reflected and dissipated at the interface of different mediums at a high proportion, but also does not increase the complexity of the process.
  • the inner layer or the outer layer and the stent are in contact with each other by hot pressing or sticking.
  • the inner layer or the outer layer is in contact with the stent by means of hot pressing or sticking, which plays a role of fixing the inner layer or the outer layer and can control the distance between the inner layer and the outer layer.
  • an embodiment of the present application provides an earmuff component, the earmuff component includes an ear pad and a housing, and the earmuff component includes the first aspect and any one of the possible implementation manners described in the first aspect
  • the ear pad includes an inner layer and an outer layer, and the bottom of the ear pad is fixed to the housing.
  • an embodiment of the present application provides an earmuff component, the earmuff component includes an ear pad and a housing, and the earmuff component includes the first aspect and any of the possible implementation manners described in the first aspect
  • the ear pad includes an inner layer, an outer layer and a bracket, and the inner layer and the outer layer are fixed to the front cavity wall, the back cavity wall or the partition of the earphone by the fixing member of the bracket.
  • an embodiment of the present application provides an earphone.
  • the earphone includes a headband and an earphone receiving end connected to both ends of the headband.
  • the earphone receiving end includes the first aspect and any one of the possible options described in the first aspect. Ear pads in the implementation mode.
  • FIG. 1 is a three-dimensional schematic diagram of a headset provided by Embodiment 1 of the present application;
  • FIG. 2 is a partial cross-sectional view of the earmuff component provided by the second embodiment of the present application
  • FIG. 3 is a schematic diagram of sound wave transmission provided by this application.
  • Figure 4 (a) is a schematic diagram of sound waves passing through the inner and outer layers of the double-layer noise reduction ear pad
  • Figure 4(b) is a schematic diagram of sound waves transmitted through a single-layer noise reduction ear pad
  • Figure 4(c) is a graph of sound absorption coefficient vs frequency of single-layer, double-layer, and three-layer noise reduction headphones;
  • FIG. 5 is a schematic structural diagram of an optical image stabilizer provided by Embodiment 3 of the present application.
  • Figures 6(a)-(e) are cross-sectional views of ear pads provided by Examples 4 to 7 of this application.
  • Earphones also known as earphones or earpieces, generally have two receiving ends, which are worn on the two ears respectively.
  • the earphone can receive the audio signal from the media player, and use the speaker close to the ear to convert it into audible sound waves.
  • the earphones can also isolate the sound of the surrounding environment, and can be used in noisy environments such as recording studios, travel, sports, etc., and are not affected by the noise of the surrounding environment. Therefore, for headphones, it is a very important performance whether they can well isolate the noise of the surrounding environment.
  • FIG. 1 is a three-dimensional schematic diagram of a headset provided by Embodiment 1 of the application.
  • a headset generally includes a headband 1, earmuff parts 2 connected to both ends of the headband 1, and a headphone cord, and the headband is worn on the user's head.
  • the headphone cable of several headsets such as headsets, in-ear headphones, and semi-in-ear headphones can be omitted, and the headphones receive audio signals through wireless communication methods such as Bluetooth.
  • Fig. 2 is a partial cross-sectional view of the earmuff component provided in the second embodiment of the present application.
  • the earmuff component 2 is usually also called the earphone receiving end, which generally includes a housing 21 and an ear pad 23.
  • the earmuff component 2 may further include a driver 22 located inside the housing 21.
  • the space inside the housing 21 is isolated into a plurality of cavities.
  • the sound cavity is related to the acoustic performance of the earphone.
  • One of the cavity where the acoustic performance is basically unaffected is the hardware compartment.
  • the sound cavity may include a front cavity 23 and a rear cavity 24 arranged adjacently, and the hardware compartment is enclosed outside the rear cavity. Batteries, chips, and circuit boards can be placed in the hardware compartment.
  • the hardware compartment is completely isolated from the rear cavity, so there is basically no effect on the acoustic performance of the earphone.
  • the front cavity shell 231 surrounding the front cavity 23 is an ear pad 29, and the side wall surrounding the rear cavity 24 is a rear cavity shell 241. Neither the front cavity shell 231 nor the rear cavity shell 241 is arranged at the boundary between the front cavity 23 and the rear cavity 24.
  • the diaphragm 221 of the driver 22 is located at the junction of the front cavity 23 and the rear cavity 24, with one side facing the front cavity 23 and the other side facing the rear cavity 24. Through the vibration of the diaphragm 221, the The sound waves are transmitted to the front cavity 23 and the rear cavity 24.
  • the other components of the driver 22 may be located in the front cavity 23 or the rear cavity 24.
  • the front cavity 23 and the rear cavity 24 may be isolated by the driver 22, or a baffle 25 may be provided in the earmuff part, and the driver 22 may be installed on the baffle 25, and the baffle 25 The front cavity 23 and the rear cavity 24 are isolated from the driver 22.
  • the additional rear cavity 26 surrounds the outside of the rear cavity 24, and the additional rear cavity 26 is separated from the rear cavity 24 by the rear cavity shell 241.
  • the rear chamber 24 and the additional rear chamber 26 are nested, and the rear chamber 24 is separated from the external environment by the additional rear chamber 26.
  • One side of the back cavity 24 is adjacent to the front cavity 23 and the other side is adjacent to the additional back cavity 26, and the back cavity 24 is surrounded by the front cavity 23 and the additional back cavity 26.
  • the front cavity 23 is arranged adjacent to the additional rear cavity 26 and separated by a partition 27.
  • the part of the side wall surrounding the additional rear cavity 26 except for the partition 27 and the rear cavity shell 241 is an additional rear cavity shell 261.
  • the front cavity shell 231 may be used as a part of the housing 21 of the earphone, and the additional rear cavity shell 261 may also be used as a part of the housing 21. In the case where the additional rear cavity 26 is not provided, the rear cavity shell 241 may also be used as a part of the housing 21 of the earphone.
  • Ear pads may be provided on the periphery of the front cavity shell 231, and the ear pads are in contact with the auricle of the user.
  • the ear pad 29 and the front cavity shell 231 can be fixed by bonding, snapping, or the like.
  • the space enclosed by the ear pad, the front cavity shell, the partition and the baffle is the front cavity.
  • the ear pad 29 can be divided into four parts according to the relative position. They are the part fixed to the housing 21, the part opposite to the housing 21 (that is, the part that is in contact with the user's ear), and the inner diameter skin side of the ring structure.
  • the part fixed to the housing 21 is called the ear pad bottom 292; the part opposite to the housing 21 is the ear pad top 291.
  • a bracket 295 may be provided at the bottom, and the bracket 295 includes a fixing member and a contact member.
  • the bottom 292 of the ear pad can be directly fixed to the housing 21 or can be fixed to the housing through a bracket 295.
  • the contact 2952 of the bracket is connected with the inner layer or the outer layer of the ear pad.
  • the fixing member 2951 of the bracket is fixed to the front cavity shell, the rear cavity shell or the partition of the housing.
  • the fixing member 2951 of the bracket can be fixed to the front cavity wall, the rear cavity wall or the partition plate by means of engagement, adhesion, magnet adsorption, screws and the like.
  • the bracket can be in various shapes, such as a rectangular parallelepiped, a cube, and other geometrical bodies.
  • the periphery of the part where the ear pad or the bracket and the housing are fixed may be sealed by a sealing pad to prevent sound leakage and reduce external noise from entering the user's ears. Headphones are mainly divided into over-ear headphones and press-on-ear headphones.
  • the main difference between an over-ear headset and an on-ear headset is the size of the earmuffs.
  • the earmuff part of the over-ear earphone can be covered on the auricle of the user.
  • the earmuffs of the earphones are smaller than the earmuffs of the over-ear earphones.
  • the earmuffs of the earphones are pressed on the ears.
  • the earmuffs of the earphones mainly cover the outer ear.
  • the ear pads 29 are used to prevent the shell 21 of the earmuff part 2 from directly contacting the user's head for cushioning, and the ear pads 29 are used to close the space between the shell and the user's ears, thereby preventing sound External leakage and reduce external noise from entering the user’s ears.
  • the principle of noise reduction through ear pads is shown in the schematic diagram of sound wave transmission in FIG. 3. When sound waves propagate in one medium, reflection and transmission occur when they encounter the interface of another medium. Part of the energy of the sound wave is reflected back to the original medium, and the other part of the energy is transmitted to the other medium.
  • the sound pressure and intensity of the reflected wave and the transmitted wave are related to the characteristic impedance of the two media, the speed of sound, and the angle of the incident sound wave.
  • the magnitude of its reflection and transmission only depends on the characteristic impedance of the medium.
  • Figure 4(a) is a schematic diagram of sound waves being transmitted through the inner and outer layers of the ear pad.
  • the distance between the inner layer and the outer layer is D, regardless of the thickness of the inner and outer layers themselves, the mass per unit area of the inner and outer layers is M, and the interval I in the figure is air , II is air or foam, III is foam, between I and II is the inner layer of the ear pad, between II and III is the outer layer of the ear pad, and the incident sound wave p 1i passes through the outer layer of the ear pad
  • the reflected wave return interval I is p 1r
  • the transmitted wave p 2t propagates in the interval II
  • the reflected wave return interval II is p 2r
  • the transmitted wave p 3t is in the interval Transmission lost (TL, transmission loss) when the ear pad includes the inner layer and the outer layer is:
  • ⁇ is the angular frequency
  • k is the wave number of the sound wave in the air
  • R1 is the characteristic impedance of the air
  • j is the imaginary unit
  • r is the attenuation of the sound wave per unit length of the foam
  • d is the thickness of the foam.
  • the incident sound wave p 1i When the ear pad has only the outer layer, the incident sound wave p 1i will be reflected and transmitted when passing through the medium.
  • the reflected wave return interval I is p 1r
  • the transmitted wave p 2t propagates in interval II. for:
  • the sound insulation ability of the material is positively correlated with the sound absorption coefficient, that is, the larger the TL, the stronger the sound insulation ability and the greater the sound absorption coefficient.
  • the sound absorption coefficient of the raw materials was tested through the impedance tube (reference standard ISO 10534-1), and a conclusion consistent with the theory was obtained.
  • the double-layer structure of the inner layer and the outer layer is interposed with a certain thickness of air layer. Compared with simply doubling the thickness of the skin, it has a clear advantage in the ability to absorb noise in the middle and high frequencies.
  • the embodiments of the present application provide a noise reduction ear pad with a double-layer structure of an inner layer and an outer layer, and a first dielectric layer is provided between the inner layer and the outer layer, so as to reduce the sound quality of the earphone from noise in the external environment. Impact.
  • An embodiment of the present application also provides an earphone including the noise reduction ear pad. As the number of ear cushion layers increases, its sound insulation capability will also increase, especially in the mid-to-high frequency range.
  • the embodiment of the present application takes an ear pad with a double-layer structure of the inner layer and the outer layer as an example, and is also applicable to ear pads with a redundant double-layer structure, such as three or more layers.
  • the ear pad has a ring structure.
  • the ear pad may have a circular, oval or square ring structure.
  • the ring-shaped ear pad 29 surrounds the edge of the sound output port 251 on the baffle 25.
  • the ring-shaped middle of the ear pad 29 can be a hollow cavity or a layered film attached to the middle. In the cavity, the sound waves can reach the user's ears through the sound output port while preventing the user's ears from directly contacting the baffle, thereby improving the user's audiovisual experience and enhancing comfort.
  • Figures 6(a)-(d) are cross-sectional views of ear pads according to embodiments of the application.
  • the ear pad of the embodiment of the present application can be divided into an outer layer 296, an inner layer 297, a first dielectric layer 298 between the outer layer and the inner layer, and a second dielectric layer 299 covered by the inner layer.
  • the outer layer 296, the inner layer 297, the first dielectric layer 298, and the second dielectric layer 299 are a structure covered by layers from the outside to the inside.
  • the inner layer and the outer layer are ring-shaped structures, respectively.
  • the inner layer is one layer, two layers or more than two layers, wherein the dielectric layer spaced between every two adjacent layers is a third dielectric layer.
  • the first medium or the third medium layer can be air, sponge, wool or the like.
  • the acoustic impedance of the third ring is different from the acoustic impedance of the inner layer and the outer layer.
  • the material of the inner layer and the outer layer is genuine leather, polyurethane leather (PU leather), protein leather, imitation protein leather, or cloth.
  • the materials of the inner layer and the outer layer can be the same or different. Since the outer layer is in contact with human skin, it is preferably a skin-friendly material, and the inner layer does not directly contact human skin, so it is not necessary to be a skin-friendly material.
  • the ear pad of the fourth embodiment of the present invention is divided into an outer layer first part 2961 and an outer layer second part 2962.
  • the optional outer layer can be divided into more than two parts.
  • the outer layer connection 2963 of the first part of the outer layer and the second part of the outer layer can be arranged on the inner diameter skin side or the skin side of the ear pad.
  • the joint is usually set on the inner side.
  • the connection can be arranged on the outside.
  • the area covered by the outer layer first portion 2961 and the outer layer second portion 2962 will be correspondingly different.
  • the area covered by the first outer layer 2961 includes the bottom, skin side and top of the ear pad; the area covered by the second outer layer 2962 includes the inner diameter skin side and the bottom.
  • the area covered by the first part 2961 of the outer layer includes the bottom and the skin side of the pad; the area covered by the second part 2962 of the outer layer includes the top, the inner diameter skin side and the bottom.
  • the inner layer of the ear pad is divided into an inner first part 2971 and an inner second part 2972.
  • the optional inner layer can be divided into more than two parts.
  • the inner layer connection 2973 of the inner layer first part 2971 and the inner layer second part 2972 can be arranged on the inside or outside of the ear pad.
  • the position of the inner connection 2973 may be designed according to the position of the outer connection 2963, or not according to the position of the outer connection 2963. Due to the different positions of the inner connection 2973, the areas covered by the inner first part 2971 and the inner second part 2972 will be correspondingly different.
  • the inner layer junction 2973 When the inner layer junction 2973 is located on the inner diameter skin side, the area covered by the inner layer first part 2971 includes the bottom, skin side and top of the ear pad; the inner layer second part 2972 covers the area including the inner diameter skin side and the bottom.
  • the area covered by the first inner layer 2971 includes the bottom and the skin side of the pad; the area covered by the second inner layer 2972 includes the top, the inner diameter skin side and the bottom.
  • the outer first part 2961 and the outer second part 2962 can be connected by sewing, sticking or hot pressing.
  • the inner first part 2971 and the inner second part 2972 can also be connected by sewing, sticking or hot pressing.
  • the acoustic impedance of the first dielectric layer located between the inner layer and the outer layer is different from the acoustic impedance of the outer layer and the inner layer of the ear pad.
  • the noise reaches the ear through the multi-layered medium during the propagation process. Due to the mismatch of acoustic impedance between different media, the reflection ability at the interface of the medium is enhanced, thereby enhancing the sound insulation of the ear pad and improving the effect of passive noise reduction.
  • the first dielectric layer may be made of other materials such as air, sponge or wool, so that the inner layer and the outer layer are not completely attached, and the acoustic impedance of the material of the first dielectric layer is different from the acoustic impedance of the inner layer and the outer layer.
  • the acoustic impedance of the inner layer or the outer layer is 10 times or more than the acoustic impedance of the first dielectric layer. More preferably, the acoustic impedance of the inner layer or the outer layer is 1000 times or more than the acoustic impedance of the first dielectric layer.
  • the bracket 295 includes a fixing member 2951 and a contact member 2952.
  • the bottom 292 of the ear pad can be directly fixed to the housing 21 or can be fixed to the housing through a bracket 295.
  • the contact 2952 of the bracket is connected to the inner or outer layer of the ear pad.
  • the contact member 2952 of the bracket is divided into a first contact member 29521 and a second contact member 29522. Wherein, the first contact member 29521 is in contact with the inner layer first portion 2971 and the outer layer first portion 2961 respectively; the second contact member 29522 is in contact with the inner layer second portion 2972 and the outer layer second portion 2962 respectively.
  • the first contact member 29521 may be a plane or a step (two planes).
  • the first contact 29521 is a plane
  • the inner first portion 2971 is fixed to the outer first portion 2961 and then contacts the first contact 29521, or the inner first portion 2971 and the outer first portion 2961 are connected to the first The contact 29521 is in contact.
  • the first contact 29521 includes a step
  • the inner first portion 2971 and the outer first portion 2961 are in contact with a plane of the first contact 29521 respectively. Since the planes contacted by the inner first portion 2971 and the outer first portion 2961 have a height difference, the height difference can control the interval between the inner first portion 2971 and the outer first portion 2961, that is, the thickness of the first dielectric layer 298.
  • the second contact member 29522 may be a plane or a step (two planes).
  • the second contact member 29522 may be a flat surface, and the inner layer second part is fixed to the outer layer second part and then comes into contact with the second contact member 29522, or the inner layer second part and the outer layer second part are in contact with the second part respectively. The contacts are in contact.
  • the second contact member 29522 includes a step
  • the second part of the inner layer and the second part of the outer layer respectively contact a plane of the second contact member 29522. Since there is a height difference between the second part of the inner layer and the second part of the outer layer, the height difference can control the interval between the second part of the inner layer and the second part of the outer layer, that is, the thickness of the first dielectric layer.
  • Fig. 6(b) is a cross-sectional view of the ear pad provided in the fifth embodiment of the application. As shown in FIG.
  • the fixing member of the bracket is located at the protruding member between the first contact member and the second contact member, and a buckle or the like can be provided on the protruding member to connect with the housing 21.
  • the connection between the bracket 295 and the housing 21 may be adhesion, magnet adsorption, screw fixation, etc. in addition to engagement.
  • the inner layer or outer layer of the ear pad can be connected to the first contact piece or the second contact piece of the bracket by hot pressing or sticking.
  • the first part of the inner layer is connected to the first part of the outer layer, or the second part of the inner layer is connected to the second part of the outer layer by bonding, hot pressing or sewing.
  • the inner area enclosed by the first part of the inner layer and the second part of the inner layer is filled with the second dielectric layer.
  • the second medium layer is made of sponge, air or wool, etc., which have different acoustic impedances from those of the inner layer and the outer layer.
  • the acoustic impedance of the inner layer or the outer layer is 10 times or more than the acoustic impedance of the first dielectric layer. More preferably, the acoustic impedance of the inner layer or the outer layer is 1000 times or more than the acoustic impedance of the first dielectric layer.
  • FIG. 6(c) is a cross-sectional view of the ear pad provided in the fifth embodiment of the application.
  • the second contact member 29522 may be two steps (three planes), and the first contact member 29521 may be a plane.
  • the first contact 29521 is in contact with the outer first portion 2961; the second contact is in contact with the inner first portion 2971, the inner second portion 2972, and the outer second portion 2962, respectively. Since there is a height difference between the second part of the inner layer and the second part of the outer layer, the height difference can control the interval between the second part of the inner layer and the second part of the outer layer, that is, the thickness of the first dielectric layer.
  • the interval between the first part of the inner layer and the first part of the outer layer can be adjusted by the distance between the first and second contacts of the stent and the plane connecting the first part of the inner layer.
  • the average thickness of the first dielectric layer does not exceed 24 times the thickness of the inner or outer layer, preferably, the average thickness of the first dielectric layer is 0.1-10 times the inner or outer layer.
  • the thickness is high, the proportion of sound energy being reflected and dissipated at the interface of different media is high, so that the passive noise reduction effect is the best.
  • the second contact member may be two steps (three planes), and the first contact member may be one plane.
  • the first contact piece is in contact with the second part of the outer layer; the second contact piece is in contact with the first part of the inner layer, the second part of the inner layer, and the first part of the outer layer respectively. Since there is a height difference between the first part of the inner layer and the first part of the outer layer, the height difference can control the interval between the first part of the inner layer and the first part of the outer layer, that is, the thickness of the first dielectric layer. Similarly, the interval between the second part of the inner layer and the second part of the outer layer can be adjusted by the distance between the first and second contact pieces of the stent and the plane connecting the second part of the inner layer.
  • the average thickness of the first dielectric layer does not exceed 24 times the thickness of the inner or outer layer; preferably, the average thickness of the first dielectric layer is 0.1-10 times the inner or outer layer
  • the thickness is high, the proportion of sound energy being reflected and dissipated at the interface of different media is high, so that the passive noise reduction effect is the best.
  • the first contact member may be two steps (three planes), and the second contact member may be one plane.
  • the first contact element is in contact with the first part of the outer layer, the second part of the inner layer, and the second part of the outer layer; the second contact element is in contact with the first part of the inner layer. Since there is a height difference between the second part of the outer layer and the second part of the inner layer, the height difference can control the interval between the second part of the inner layer and the second part of the outer layer, that is, the thickness of the first dielectric layer .
  • the interval between the first part of the inner layer and the first part of the outer layer can be adjusted by the distance between the plane connecting the first contact piece of the stent and the first part of the outer layer and the second contact piece.
  • the first contact member may be two steps (three planes), and the second contact member may be one plane.
  • the first contact element is in contact with the first part of the outer layer, the first part of the inner layer, and the second part of the outer layer; the second contact element is in contact with the second part of the inner layer. Since there is a height difference between the first part of the outer layer and the first part of the inner layer, the height difference can control the interval between the first part of the inner layer and the first part of the outer layer, that is, the thickness of the first dielectric layer. Similarly, the interval between the second part of the inner layer and the second part of the outer layer can be adjusted by the distance between the plane connecting the first contact piece of the stent and the second part of the outer layer and the second contact piece.
  • Fig. 6(d) is a cross-sectional view of the ear pad provided in the sixth embodiment of the application. As shown in Figure 6(d), it is the ear pad of the second embodiment of the present invention. Different from the ear pads in the first embodiment, the inner layer in this embodiment only includes the first part of the inner layer and does not include the second part; the outer layer still includes the first part of the outer layer and the second part of the outer layer. Optionally, the outer layer may include more than two parts. Wherein, the joint of the first part of the outer layer, the first part of the inner layer, and the second part of the outer layer can be arranged on the inner diameter skin side or the skin side of the ear pad. As mentioned above, in consideration of aesthetics, the joint is usually set on the inner side.
  • connection can be arranged on the outside.
  • the area covered by the first part of the outer layer, the second part of the outer layer and the first part of the inner layer will be correspondingly different.
  • the area covered by the first part of the outer layer and the first part of the inner layer includes the bottom, skin side and top of the ear pad;
  • the area covered by the second part of the outer layer includes the inner diameter skin side and the bottom.
  • the junction is located on the skin side, the area covered by the first part of the outer layer includes the bottom and the skin side of the ear pad; the area covered by the second part of the outer layer includes the top, the inner diameter skin side and the bottom.
  • the first part of the outer layer, the second part of the outer layer and the first part of the inner layer are connected by sewing, sticking or hot pressing.
  • the space formed between the first part of the outer layer and the first part of the inner layer can fill the first dielectric layer.
  • the reflection ability at the interface of the medium is enhanced, thereby enhancing the sound insulation of the ear pad and improving the effect of passive noise reduction.
  • the first medium layer may be air, sponge or other materials so that the inner layer and the outer layer are not completely attached.
  • the contact pieces of the bracket are divided into a first contact piece and a second contact piece.
  • the second contact is only connected to the second part of the outer layer.
  • the first contact is in contact with the first part of the inner layer and the first part of the outer layer, respectively.
  • the first contact member may be a plane or a step (two planes).
  • the first contact may be a plane, the first part of the inner layer is fixed to the first part of the outer layer and then contacts the first contact, or the first part of the inner layer and the first part of the outer layer are respectively connected to the first contact contact.
  • the first contact includes a step, the first part of the inner layer and the first part of the outer layer respectively contact a plane of the first contact.
  • the height difference can control the interval between the first part of the inner layer and the first part of the outer layer, that is, the thickness of the first dielectric layer.
  • the second contact member may be a plane or a step (two planes). The second part of the outer layer is connected to the second contact.
  • the inner layer or the outer layer can be connected to the first contact piece or the second contact piece of the stent by hot pressing or sticking.
  • the first part of the inner layer and the first part of the outer layer can be connected by adhesion.
  • the first contact piece of the bracket or the fixing part between the first contact piece and the second contact piece of the bracket is connected with the front cavity shell, the rear cavity shell or the partition of the ear shell.
  • the connection between the bracket and the shell includes snap-fit, gluing, magnet adsorption, screw fixation, etc.
  • Fig. 6(e) is a cross-sectional view of the ear pad provided in the seventh embodiment of the application.
  • the plane of the first contact piece and the second contact piece of the bracket of the ear pad in the seventh embodiment is perpendicular to the plane of the ring shape of the ear pad.
  • the plane on which the first contact piece and the second contact piece of the bracket of the ear pad of the fourth to sixth embodiments are located is relatively parallel to the plane on which the ring shape of the ear pad is located.
  • the plane where the first and second contacts of the bracket are located and the plane where the ring shape of the ear pad is located can be appropriately inclined, and the positional relationship between the two planes does not need to be absolutely vertical. Or parallel.
  • the bracket of the ear pad in the seventh embodiment can also be similar to the structure of the bracket of the ear pad in the above embodiments 4 to 6, such as the connection relationship between the first contact piece and the second contact piece and the inner layer and the outer layer, and the first contact
  • the number of planes included in each of the second contact member and the second contact member, and the structure of the fixing member of the bracket can refer to the above-mentioned embodiments.
  • each part of the inner layer and each part of the outer layer may be connected to the connection respectively, or as shown in Figure 6(e), the first and second parts of the inner layer are connected together with the first and second parts of the outer layer. At the same junction 2983.
  • connection should be understood in a broad sense unless otherwise clearly specified and limited. For example, they may be fixed connection or detachable connection. , Or integrally connected; it can be directly connected or indirectly connected through an intermediary.

Abstract

本申请实施例提供一种耳垫，所述耳垫为耳机的一部分。所述耳垫为环状结构，其包括：内层，和覆盖所述内层的外层。其中，所述内层和所述外层分别为环状结构。所述内层与所述外层之间隔有第一介质层；所述内层包覆第二介质层；所述第一介质层的声阻抗与所述内层和所述外层的声阻抗不同。所述耳垫用来封闭在壳体和用户耳朵之间的前腔空间，从而防止声音外漏以及降低外部噪声进入用户耳朵。本申请实施例所提供的耳垫包括内层和外层的双层结构中间间隔第一介质层，相比传统耳垫，其降噪声能力有显著提升，尤其在中高频的降噪声能力上有着明显的提升。本申请实施例还提供了一种包含所述降噪耳垫的耳罩部件以及耳机。

Description

一种耳垫，耳罩部件及耳机
本申请要求于2019年11月30日提交中国专利局、申请号为201911217326.9、发明名称为“一种耳垫，耳罩部件及耳机”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及消费类电子产品技术领域，尤其涉及处理音频的电子设备。
背景技术
耳机在使用过程中，如果周围环境中的噪声很大，会严重干扰耳机内部的声音信号，所以一般希望对周围环境的噪声进行很好的隔离，使用户在通过耳机聆听音频信号的时候，不受到影响。
现有头戴式耳机为了降低外部噪声的影响，通过有源降噪和被动降噪两者综合可达到良好的降噪性能。其中，有源降噪主要是从软件算法方面考虑，而被动降噪主要是从耳机的结构设计、材料选型方面考虑。在整个头戴式耳机的结构中，耳垫部分不仅作为防止耳机外壳直接接触到用户头部的缓冲，还用来封闭在外壳和用户耳朵之间的空间，从而作为隔绝外部噪声的一个重要屏障，耳垫材料和结构的设计直接影响头戴式耳机的被动降噪能力，如何通过耳垫材料和结构设计来提高头戴式耳机的降噪能力，是目前亟待解决的问题。
发明内容
有鉴于此，本申请实施例提供了一种降噪耳垫，降噪耳罩部件及降噪耳机，以降低外部环境中的噪声对耳机的音质的影响。
以下从多个方面介绍本申请，容易理解的是，该以下多个方面的实现方式可互相参考。
第一方面，本申请实施例提供了一种耳垫。所述耳垫为环状结构，所述耳垫包括：内层，和覆盖所述内层的外层。所述内层和所述外层分别为环状结构。所述内层与所述外层之间隔有第一介质层；所述内层包覆第二介质层；所述第一介质层的声阻抗与所述内层和所述外层的声阻抗不同。申请实施例所提供的耳垫包括内层和外层的双层结构中间间隔第一介质层，相比传统耳垫，其降噪声能力有显著提升，尤其在中高频的降噪声能力上有着明显的提升。
根据第一方面，在一种可能的实现方式中，所述耳垫还包括支架，所述支架包括接触件，所述接触件与所述内层或所述外层接触。通过所述支架可以固定内层和外层，而且可以调节内层和外层之间的第一介质的厚度。
根据第一方面，在一种可能的实现方式中，所述外层包括外层第一部分和外层第二部分，所述外层第一部分或所述外层第二部分的全部区域或部分区域覆盖所述内层。通过选择所覆盖的区域可以达到控制降噪的程度。
根据第一方面，在一种可能的实现方式中，所述外层包括外层第一部分和外层第二 部分，所述内层包括内层第一部分，所述外层第一部分覆盖所述内层第一部分。
根据第一方面，在一种可能的实现方式中，所述外层包括外层第一部分和外层第二部分，所述内层包括内层第一部分和内层第二部分，所述外层第一部分覆盖所述内层第一部分，所述外层第二部分覆盖所述内层第二部分。
根据第一方面，在一种可能的实现方式中，所述第一介质层的厚度不超过为所述内层的厚度或所述外层的厚度的10倍。当所述第一介质层的厚度至少为所述内层的厚度或所述外层的厚度的10倍时，声能量在不同的介质交界面被反射和耗散的比例高，从而被动降噪的效果佳。
根据第一方面，在一种可能的实现方式中，所述内层或所述外层的声阻抗至少为所述第一介质层的声阻抗的10倍。从而使噪声在传播过程中通过多层介质再到达耳朵，不同介质间由于声阻抗不匹配，导致在介质界面的反射能力增强，从而增强耳垫的隔声，提升被动降噪的效果。
根据第一方面，在一种可能的实现方式中，所述内层或所述外层的声阻抗至少为所述第一介质层的声阻抗的1000倍。从而使噪声在传播过程中通过多层介质再到达耳朵，不同介质间由于声阻抗不匹配，导致在介质界面的反射能力增强，从而增强耳垫的隔声，提升被动降噪的效果。
根据第一方面，在一种可能的实现方式中，所述内层为一层，两层或两层以上，其中每相邻两层之间隔有第三介质层。随着层数的增加，声能量在不同的介质交界面被反射和耗散的比例高，从而提高被动降噪的效果。
根据第一方面，在一种可能的实现方式中，所述第一介质层或第三介质层为空气。选择空气作为第一介质层或第三介质层，既可以使声能量在不同的介质交界面被反射和耗散的比例高，又不提高工艺复杂程度。
根据第一方面，在一种可能的实现方式中，所述内层或所述外层与所述支架通过热压或者粘粘的方式接触。内层或者外层通过热压或者粘粘的方式与支架接触，起到了固定内层或者外层的作用的同时可以控制内层与外层之间的间距。
第二方面，本申请实施例提供了一种耳罩部件，所述耳罩部件包括耳垫和壳体，所述耳罩部件包括第一方面及第一方面所述任一可能的实现方式中的耳垫，所述耳垫包括内层和外层，所述耳垫的底部与所述壳体固定。
第三方面，本申请实施例提供了一种耳罩部件，所述耳罩部件包括耳垫和壳体，所述耳罩部件包括第一方面及第一方面所述任一可能的实现方式中的耳垫，所述耳垫包括内层，外层和支架，所述内层和所述外层通过所述支架的固定件与耳机的前腔壁，后腔壁或者隔板相固定。
第四方面，本申请实施例提供了一种耳机，所述耳机包括头环以及连接在头环两端的耳机接听端，所述耳机接听端包括第一方面及第一方面所述任一可能的实现方式中的耳垫。
附图说明
图1是本申请实施例一所提供的头戴式耳机的立体示意图；
图2是本申请实施例二所提供的耳罩部件局部剖视图；
图3是本申请所提供的声波传递示意图；
图4(a)为声波通过双层降噪耳垫的内层和外层传递的示意图；
图4(b)为声波通过单层降噪耳垫传递的示意图；
图4(c)为单层，双层，以及三层降噪耳机的吸声系数vs频率图；
图5是本申请实施例三所提供的一种光学图像稳定器的结构示意图；
图6(a)-(e)为本申请实施例四至七所提供的耳垫的剖面图。
图中各元件的标号如下：
头环1；耳罩部件2；壳体21；驱动器22；振膜221；前腔23；前腔壳231；后腔24；后腔壳241；障板25；声音输出口251；附加后腔26；附加后腔壳261；隔板27；耳垫29；耳垫顶部291；耳垫底部292；表皮侧293；内径皮侧294；支架295；固定件2951；接触件2952；第一接触件29521；第二接触件29522；外层296；外层第一部分2961；外层第二部分2962；外层连接处2963；内层297；内层第一部分2971；内层第二部分2972；第一介质层298；第二介质层299。
具体实施方式
耳机，又称为耳筒或听筒，一般具有两个接听端，分别对应佩戴在两只耳朵上。耳机可以接收媒体播放器所发出的音频信号，利用贴近耳朵的扬声器将其转化成可以听到的音波。使用耳机可以在不影响旁人的情况下，独自聆听音响。耳机也可以隔开周围环境的声响，可以在录音室、旅途、运动等在噪吵环境下使用，并且不受周围环境的噪声的影响。所以对于耳机来讲，是否能将周围环境的噪声进行很好的隔离，是一个很重要的性能。
耳机一般有头戴式耳机，入耳式耳机或半入耳式耳机等几种类型。图1为本申请实施例一所提供的头戴式耳机的立体示意图。如图1所示，头戴式耳机一般包括头环1，连接在头环1两端的耳罩部件2，以及耳机线，所述头环佩戴在用户的头上。需要说明的是，头戴式耳机，入耳式耳机以及半入耳式耳机等几种耳机的耳机线可以被省略，耳机通过蓝牙等无线通信的方式接收音频信号。图2是本申请实施例二所提供的耳罩部件局部剖视图。如图2所示，耳罩部件2通常又称为耳机接听端，其一般包括壳体21和耳垫23。可选的，耳罩部件2还可以包括位于所述壳体21内部的驱动器22，所述壳体21内部的空间被隔离为多个腔，其中与耳机声学性能相关的为音腔，对耳机的声学性能基本无影响的腔中有一个是硬件舱。所述音腔可以包括相邻设置的前腔23和后腔24，所述硬件舱包围在所述后腔的外部。在所述硬件舱内可以放置电池，芯片，还可以设置电路板。所述硬件舱与所述后腔是完全隔离的，所以对耳机的声学性能基本无影响。
包围所述前腔23的前腔壳231为耳垫29，包围所述后腔24的侧壁为后腔壳241。所述前腔23与所述后腔24交界的位置既不设置所述前腔壳231也不设置所述后腔壳241。所述驱动器22的振膜221位于所述前腔23和所述后腔24交界的位置，一面朝向所述前腔23，一面朝向所述后腔24，通过所述振膜221的振动，将声波传送到所述前腔23和所述后腔24。所述驱动器22的其他部件可以位于所述前腔23，也可以位于所述后腔24。因为所述前腔23内的声波会输送到用户的耳朵，为了不干扰前腔23内的声 波，可以将所述驱动器22的其他部件放置在所述后腔24内，或者设置在所述前腔23和所述后腔24交界的位置。
可以通过驱动器22将所述前腔23和所述后腔24隔离，也可以在耳罩部件内设置障板25，将所述驱动器22安装在所述障板25上，通过所述障板25和所述驱动器22将所述前腔23和所述后腔24隔离。
附加后腔26包围在所述后腔24的外部，所述附加后腔26与所述后腔24之间通过所述后腔壳241隔离。所述后腔24和所述附加后腔26是嵌套设置，所述后腔24与外部环境之间隔着所述附加后腔26。所述后腔24的一侧与所述前腔23相邻，另一侧与所述附加后腔26相邻，所述后腔24被所述前腔23和所述附加后腔26包围。所述前腔23与所述附加后腔26相邻设置，并通过隔板27隔离。包围所述附加后腔26的侧壁除所述隔板27以及所述后腔壳241之外的部分为附加后腔壳261。
所述前腔壳231可以作为耳机的所述壳体21的一部分，所述附加后腔壳261也可以作为所述壳体21的一部分。在不设置所述附加后腔26的情况下，所述后腔壳241也可以作为所述耳机的壳体21的一部分。
所述前腔壳231的外围可设置耳垫，所述耳垫与用户的耳廓接触。其中，耳垫29与前腔壳231可通过粘合，卡合等方式相固定。所述耳垫，前腔壳，隔板，障板所围成的空间为前腔。耳垫29按相对位置分可分为四个部分，分别为与壳体21相固定的部分，与壳体21相对的部分(即与用户耳朵相接触的部分)，环状结构的内径皮侧294(即耳垫将用户耳朵相包围的一侧)，以及环状结构的表皮侧293(即耳垫与外界环境相接触的一侧)。其中，与壳体21相固定的部分称为耳垫底部292；与壳体21相对的部分成为耳垫顶部291。底部可以设有支架295，该支架295包括固定件和接触件。耳垫的底部292可以直接与壳体21固定也可以通过支架295与壳体固定。支架的接触件2952与耳垫的内层或者外层相连接。支架的固定件2951与壳体的前腔壳，后腔壳或者隔板相固定。支架的固定件2951可通过卡合，粘合，磁铁吸附，螺钉等方式与前腔壁，后腔壁或者隔板相固定。支架可以为多种形状，如长方体，正方体以及其他几何体等。可选的，耳垫或支架与壳体相固定的部位的周围可以通过密封垫密封，以防止而防止声音外漏以及降低外部噪声进入用户耳朵。头戴式耳机主要分为包耳式的耳机和压耳式的耳机。包耳式的耳机和压耳式的耳机的主要区别为耳罩部件的大小不同。包耳式的耳机的耳罩部件可以罩在用户的耳廓上。压耳式的耳机的耳罩部件比包耳式的耳机的耳罩部件小，压耳式耳机的耳罩部件压在耳朵上，压耳式的耳机的耳罩部件主要覆盖的范围为外耳。
所述耳垫29用于防止耳罩部件2的壳体21直接接触到用户头部以起到缓冲的作用，同时耳垫29用来封闭在壳体和用户耳朵之间的空间，从而防止声音外漏以及降低外部噪声进入用户耳朵。具体的，通过耳垫降噪的原理如图3的声波传递示意图所示。声波在一个介质中传播，当遇到另一个介质的界面时就会产生反射和透射，一部分声波的能量被反射回原先的介质，另一部分能量会透射到另一个介质中去。反射波和透射波的声压和声强的大小与两个介质的特性阻抗、声速以及入射声波的角度有关。对于垂直入射于分界面上的平面声波，其反射和透射的大小仅取决于介质的特性阻抗。当介质一的特性阻抗与介质二的特性阻抗存在明显差距时，大部分声能量会被反射。当声波入射到耳垫表面时，入射声能的一部分在耳垫表面被反射，一部分进入耳垫的材料并被其吸收， 一部分则透过耳垫进入用户的耳道，如图3所示，当耳罩部件尽量多的隔绝和吸收外部的噪声时，外部噪声尽可能少的进入用户的耳道。
具体的，在声波传播时，计算声波通过耳垫的传递损失的原理如下：
单层介质的隔声量遵循质量定律，即当材料厚度增加一倍时，隔声量只增加6dB，双层介质可通过使用较少的材料获得较高的隔声能力。图4(a)为声波通过耳垫的内层和外层双层传递的示意图。如图4(a)所示，内层和外层之间的距离为D，不考虑内层和外层本身的厚度，内层和外层的单位面积质量为M，图中区间Ⅰ为空气，Ⅱ为空气或泡棉，Ⅲ为泡棉，区间Ⅰ和Ⅱ之间为耳垫的内层，区间Ⅱ和Ⅲ之间为耳垫的外层，入射声波p 1i在经过耳垫的外层时发生反射和透射，反射波返回区间Ⅰ为p 1r，透射波p 2t在区间Ⅱ中传播，在经过内层时发生反射和透射，反射波返回区间Ⅱ为p 2r，透射波p 3t在区间Ⅱ中传播，耳垫包括内层和外层时的transmission lost(TL,传递损失)为：
Figure PCTCN2020132719-appb-000001
式(1)中ω为角频率，k为空气中声波的波数，R1为空气的特性阻抗，j为虚数单位，r为泡棉单位长度声波传播时的衰减量，d为泡棉的厚度。当
Figure PCTCN2020132719-appb-000002
时，中高频时公式(1)可简化为下面的公式(2)：
Figure PCTCN2020132719-appb-000003
当耳垫仅有外层时，入射声波p 1i在经过介质时发生反射和透射，反射波返回区间Ⅰ为p 1r，透射波p 2t在区间Ⅱ中传播，同等两倍厚度的外层的TL为：
Figure PCTCN2020132719-appb-000004
当
Figure PCTCN2020132719-appb-000005
时，公式(3)简化为如下公式(4)
Figure PCTCN2020132719-appb-000006
通过公式(2)和(4)可知内层和外层的双层结构相比较单层结构的传递损失即隔声量在中高频有明显优势。
经研究，材料的隔声能力与吸声系数正相关，即TL越大，隔声能力越强，吸声系数越大。通过阻抗管对原材料的吸声系数进行测试(参考标准ISO 10534-1)，得到了与理论相符的结论。如图4(c)所示，内层和外层的双层结构中间夹杂一定厚度的空气层，相比单纯将皮厚度增加一倍，在中高频的吸噪声能力上有着明显的优势。因此，本申请实施例提供了一种降噪耳垫具有内层和外层双层结构并且在内层和外层之间设有第一介质层，以降低外部环境中的噪声对耳机的音质的影响。本申请实施例还提供了一种包含所述降噪耳垫的耳机。随着耳垫层数的增加，其隔音能力也会提升，尤其在中高频率范围内。本申请实施例以内层和外层双层结构的耳垫为例，也适用于多余双层结构的耳垫，如三层或更多层。
如图5所示，为本申请实施例三提供的耳罩部件局部俯视图。耳垫为环状的结构。可选的，耳垫可以为圆形的，椭圆形的或者方形的环状结构。如图5所示，环状的耳垫29围绕在障板25上的声音输出口251的边缘，耳垫29的环状中间可以为中空的腔体也可为由层状的膜附着于中间的腔体内，使得声波可以通过声音输出口到达用户的耳朵的 同时避免用户的耳朵直接与障板接触，从而提高用户的视听感受的同时增强舒适感。
图6(a)-(d)为本申请实施例耳垫的剖面图。本申请实施例耳垫按结构分可分为外层296，内层297，外层和内层之间的第一介质层298，以及内层包覆的第二介质层299。其中，外层296，内层297，第一介质层298，第二介质层299为由外向内层层包覆的结构。内层和外层分别为环状结构。可选的，所述内层为一层，两层或两层以上，其中每相邻两层之间隔有的介质层为第三介质层。所述第一介质或第三介质层可以为空气，海绵，羊毛等。所述第三戒指的声阻抗与内层和外层的声阻抗不同。可选的，所述内层和外层的材质为真皮，poly urethane皮革(PU皮革)，蛋白皮，仿蛋白皮，或布等。内层和外层的材质可以相同也可以不同。由于外层与人的皮肤相接触，因此优选的为亲肤类的材料，而内层不直接与人的皮肤相接触，因此不必要为亲肤类的材料。
如图6(a)所示，为本发明的实施例四的耳垫，耳垫的外层分为外层第一部分2961和外层第二部分2962。可选的外层可以分为多于两部分。其中，外层第一部分和外层第二部分的外层连接处2963可设置在耳垫的内径皮侧或表皮侧。处于对美感的考虑，连接处通常设置在内侧。处于对舒适感的考虑，连接处可以设置在外侧。根据外层连接处2963的位置不同，外层第一部分2961和外层第二部分2962所覆盖的区域也会相应的不同。当外层连接处2963位于内径皮侧时，外层第一部分2961覆盖的区域包括耳垫的底部，表皮侧以及顶部；外层的第二部分2962覆盖的区域包括内径皮侧和底部。当外层连接处2963位于表皮侧时，外层第一部分2961覆盖的区域包括垫的底部和表皮侧；外层第二部分2962覆盖的区域包括顶部，内径皮侧和底部。
类似的，耳垫的内层分为内层第一部分2971和内层第二部分2972。可选的内层可以分为多于两部分。其中，内层第一部分2971和内层第二部分2972的内层连接处2973可设置在耳垫的内侧或外侧。内层连接处2973的位置可以根据外层连接处2963的位置来设计，也可以不根据外层连接处2963的位置来设计。由于内层连接处2973的位置不同，内层第一部分2971和内层第二部分2972所覆盖的区域也会相应的不同。当内层连接处2973位于内径皮侧时，内层第一部分2971覆盖的区域包括耳垫的底部，表皮侧以及顶部；内层第二部分2972覆盖的区域包括内径皮侧和底部。当内层连接处2973位于表皮侧时，内层第一部分2971覆盖的区域包括垫的底部和表皮侧；内层第二部分2972覆盖的区域包括顶部，内径皮侧和底部。其中，外层第一部分2961和外层第二部分2962可以通过车缝，粘粘或热压等方式连接。同样的，内层第一部分2971和内层第二部分2972也可以通过车缝，粘粘或热压等方式连接。根据上述声波传播的原理所示，位于内层和外层之间的第一介质层的声阻抗与耳垫的外层和内层的声阻抗不同。从而使噪声在传播过程中通过多层介质再到达耳朵，不同介质间由于声阻抗不匹配，导致在介质界面的反射能力增强，从而增强耳垫的隔声，提升被动降噪的效果。具体的，第一介质层可以为空气，海绵或羊毛等其他材质以使得内层和外层不完全贴合，并且第一介质层的材料的声阻抗与内层和外层的声阻抗不同。优选的，所述内层或所述外层的声阻抗为所述第一介质层的声阻抗的10倍及10倍以上。更优选的，所述内层或所述外层的声阻抗为所述第一介质层的声阻抗的1000倍及1000倍以上。
如图2所示，支架295包括固定件2951和接触件2952。耳垫的底部292可以直接与壳体21固定也可以通过支架295与壳体固定。支架的接触件2952与耳垫的内层或者 外层相连接。如图6(a)所示，支架的接触件2952分为第一接触件29521和第二接触件29522。其中，第一接触件29521与内层第一部分2971和外层第一部分2961分别接触；第二接触件29522与内层第二部分2972和外层第二部分2962分别接触。可选的，第一接触件29521可以为一个平面或者一个台阶(两个平面)。第一接触件29521为一个平面时，所述内层第一部分2971与外层第一部分2961相固定后与第一接触件29521接触，或者内层第一部分2971和外层第一部分2961分别与第一接触件29521接触。当第一接触件29521包括一个台阶时，内层第一部分2971和外层第一部分2961分别与第一接触件29521的一个平面接触。由于内层第一部分2971和外层第一部分2961所接触的平面有高度差，该高度差可以控制内层第一部分2971和外层第一部分2961之间的间隔，即第一介质层298的厚度。经过试验验证，第一介质层的平均厚度不超过24倍的内层或外层的厚度时；第一介质层的平均厚度为0.1～10倍的内层或外层的厚度时，声能量在不同的介质交界面被反射和耗散的比例高，从而被动降噪的效果最佳。可选的，第二接触件29522可以为一个平面或者一个台阶(两个平面)。第二接触件29522可以为一个平面，所述内层第二部分与外层第二部分相固定后与第二接触件29522接触，或者内层第二部分和外层第二部分分别与第二接触件接触。当第二接触件29522包括一个台阶时，内层第二部分和外层第二部分分别与第二接触件29522的一个平面接触。由于内层第二部分和外层第二部分所接触的平面有高度差，该高度差可以控制内层第二部分和外层第二部分之间的间隔，即第一介质层的厚度。经过试验验证，第一介质层的平均厚度不超过24倍的内层或外层的厚度时，优选的，第一介质层的平均厚度为0.1～10倍的内层或外层的厚度时，声能量在不同的介质交界面被反射和耗散的比例高，从而被动降噪的效果最佳。支架的第一接触件或者支架的第一接触件与第二接触件之间的固定件与壳体21的前腔壳231，后腔241壳或者隔板27连接。图6(b)为本申请实施例五所提供的耳垫的剖面图。如图6(b)所示，支架的固定件位于第一接触件与第二接触件之间的凸起件，该凸起件上可设置卡扣等，以与壳体21相连。可选的，支架295与壳体21的连接方式除了卡合，还可以为粘合，磁铁吸附，螺钉固定等。
其中，耳垫的内层或外层与支架的第一接触件或第二接触件相连可以通过热压或者粘粘的方式。内层第一部分与外层第一部分相连，或者内层第二部分与外层第二部分相连可通过粘粘，热压或车缝的方式。
其中，内层第一部分和内层第二部分所围成的内部区域内填充第二介质层。可选的，第二介质层为海绵，空气或羊毛等声阻抗与内层和外层的不同的。优选的，所述内层或所述外层的声阻抗为所述第一介质层的声阻抗的10倍及10倍以上。更优选的，所述内层或所述外层的声阻抗为所述第一介质层的声阻抗的1000倍及1000倍以上。
可选的，图6(c)为本申请实施例五所提供的耳垫的剖面图。如图6(c)所示，第二接触件29522可以为两个台阶(三个平面)，第一接触件29521可以为一个平面。其中，第一接触件29521与外层第一部分2961接触；第二接触件分别与内层第一部分2971，内层第二部分2972，以及外层第二部分2962接触。由于内层第二部分和外层第二部分所接触的平面有高度差，该高度差可以控制内层第二部分和外层第二部分之间的间隔，即第一介质层的厚度。同样的，内层第一部分和外层第一部分之间的间隔可以通过支架的第一接触件和第二接触件与内层第一部分相连的平面之间的距离调节。如上所述，经 过试验验证，第一介质层的平均厚度不超过24倍的内层或外层的厚度时，优选的，第一介质层的平均厚度为0.1～10倍的内层或外层的厚度时，声能量在不同的介质交界面被反射和耗散的比例高，从而被动降噪的效果最佳。
可选的，第二接触件可以为两个台阶(三个平面)，第一接触件可以为一个平面。其中，第一接触件与外层第二部分接触；第二接触件分别与内层第一部分，内层第二部分，以及外层第一部分接触。由于内层的第一部分和外层的第一部分所接触的平面有高度差，该高度差可以控制内层第一部分和外层第一部分之间的间隔，即第一介质层的厚度。同样的，内层第二部分和外层第二部分之间的间隔可以通过支架的第一接触件和第二接触件与内层第二部分相连的平面之间的距离调节。如上所述，经过试验验证，第一介质层的平均厚度不超过24倍的内层或外层的厚度时；优选的，第一介质层的平均厚度为0.1～10倍的内层或外层的厚度时，声能量在不同的介质交界面被反射和耗散的比例高，从而被动降噪的效果最佳。
可选的，第一接触件可以为两个台阶(三个平面)，第二接触件可以为一个平面。其中，第一接触件与外层第一部分，内层第二部分，外层第二部分接触；第二接触件与内层第一部分接触。由于外层的第二部分和内层的第二部分所接触的平面有高度差，该高度差可以控制内层第二部分和外层第二部分之间的间隔，即第一介质层的厚度。同样的，内层第一部分和外层第一部分之间的间隔可以通过支架的第一接触件与外层第一部分相连的平面和第二接触件之间的距离调节。如上所述，经过试验验证，第一介质层的平均厚度为0.1～10倍的内层或外层的厚度时，声能量在不同的介质交界面被反射和耗散的比例高，从而被动降噪的效果最佳。
可选的，第一接触件可以为两个台阶(三个平面)，第二接触件可以为一个平面。其中，第一接触件与外层第一部分，内层第一部分，外层第二部分接触；第二接触件与内层第二部分接触。由于外层的第一部分和内层的第一部分所接触的平面有高度差，该高度差可以控制内层第一部分和外层第一部分之间的间隔，即第一介质层的厚度。同样的，内层第二部分和外层第二部分之间的间隔可以通过支架的第一接触件与外层第二部分相连的平面和第二接触件之间的距离调节。如上所述，经过试验验证，第一介质层的平均厚度为0.1～10倍的内层或外层的厚度时，声能量在不同的介质交界面被反射和耗散的比例高，从而被动降噪的效果最佳。
图6(d)为本申请实施例六所提供的耳垫的剖面图。如图6(d)所示，为本发明的实施例二的耳垫。区别于实施例一中的耳垫，本实施例中的内层仅包括内层第一部分，不包括第二部分；外层仍包括外层第一部分和外层第二部分。可选的，外层可以包括多于两个部分。其中，外层第一部分，内层第一部分，以及外层第二部分的连接处可设置在耳垫的内径皮侧或表皮侧。如上所述，处于对美感的考虑，连接处通常设置在内侧。处于对舒适感的考虑，连接处可以设置在外侧。根据连接处的位置不同，外层第一部分，外层第二部分和内层第一部分所覆盖的区域也会相应的不同。当连接处位于内径皮侧时，外层的第一部分和内层的第一部分覆盖的区域包括耳垫的底部，表皮侧以及顶部；外层的第二部分覆盖的区域包括内径皮侧和底部。当连接处位于表皮侧时，外层的第一部分覆盖的区域包括耳垫的底部和表皮侧；外层的第二部分覆盖的区域包括顶部，内径皮侧和底部。
其中，外层第一部分，外层第二部分和内层第一部分通过车缝，粘粘或热压等方式连接。本实施例中，外层第一部分和内层第一部分之间所形成的间隔可以填充第一介质层。根据上述声波传播的原理所示，位于内层和外层之间的第一介质层的声阻抗与耳垫的外层和内层的声阻抗不同。从而使噪声在传播过程中通过多层介质再到达耳朵，不同介质间由于声阻抗不匹配，导致在介质界面的反射能力增强，从而增强耳垫的隔声，提升被动降噪的效果。具体的，第一介质层可以为空气，海绵或其他材质以使得内层和外层不完全贴合。经过试验验证，第一介质层的平均厚度为0.1～10倍的内层或外层的厚度时，声能量在不同的介质交界面被反射和耗散的比例高，从而被动降噪的效果最佳。
如图6(d)所示，支架的接触件分为第一接触件和第二接触件。区别于实施例一，本实施例中，第二接触件仅与外层的第二部分相连。第一接触件与内层的第一部分和外层的第一部分分别接触。可选的，第一接触件可以为一个平面或者一个台阶(两个平面)。第一接触件可以为一个平面，所述内层的第一部分与外层的第一部分相固定后与第一接触件接触，或者内层的第一部分和外层的第一部分分别与第一接触件接触。当第一接触件包括一个台阶时，内层的第一部分和外层的第一部分分别与第一接触件的一个平面接触。由于内层的第一部分和外层的第一部分所接触的平面有高度差，该高度差可以控制内层第一部分和外层第一部分之间的间隔，即第一介质层的厚度。经过试验验证，第一介质层的平均厚度为0.1～10倍的内层或外层的厚度时，声能量在不同的介质交界面被反射和耗散的比例高，从而被动降噪的效果最佳。可选的，第二接触件可以为一个平面或者一个台阶(两个平面)。所述外层第二部分与第二接触件相连。其中，内层或外层与支架的第一接触件或第二接触件相连可以通过热压或者粘粘的方式。内层第一部分与外层第一部分相连可通过粘粘的方式。支架的第一接触件或者支架的第一接触件与第二接触件之间的固定部与耳壳的前腔壳，后腔壳或者隔板连接。支架与壳体的连接方式为卡合，粘合，磁铁吸附，螺钉固定等。
图6(e)为本申请实施例七所提供的耳垫的剖面图。区别于上述实施例四至六的耳垫，本实施例七中的耳垫的支架的第一接触件和第二接触件所在的平面与耳垫的环型所在的平面相垂直。实施例四至六的耳垫的支架的第一接触件和第二接触件所在的平面与耳垫的环型所在的平面相对平行。可以理解的，根据设计的需求，支架的第一接触件和第二接触件所在的平面与耳垫的环型所在的平面可以有适当的倾斜，两个平面的位置关系不必要为绝对的垂直或者平行。实施例七中的耳垫的支架也可以如上述实施例四至六的耳垫的支架的结构相类似，如第一接触件和第二接触件与内层和外层的连接关系，第一接触件和第二接触件分别包括的平面的数量，支架的固定件的结构均可参照上述各实施例。即根据支架的第一接触件和第二接触件所在的平面与耳垫的环型所在的平面的相对位置关系，调整耳垫其他各部件与支架的连接方式。可选的，内层各部分和外层各部分可以分别连接于连接处，也可以如图6(e)所示，内层第一，第二部分和外层第一，第二部分共同连接于同一连接处2983。
在本申请的描述中，需要理解的是，术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的相对位置关系为各部件按照附图所显示的角度摆放时，各部件之间的相对位置关系。各部件还可以以其他的角度摆放。
术语“第一”、“第二”“第三”仅用于区分相类似的部件或结构，并不指示各部件或结构之间的相对重要性或数量。在本申请的描述中，除非另有说明，“多个”的含义是指两个或两个以上。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，或者是可拆卸连接，或者是一体地连接；可以是直接相连，也可以是通过中间媒介间接相连。

Claims (15)

  1. 一种耳垫，其特征在于，所述耳垫为环状结构，所述耳垫包括：内层，和覆盖所述内层的外层，其中，所述内层和所述外层分别为环状结构；
    所述内层与所述外层之间隔有第一介质层；所述内层包覆第二介质层；
    所述第一介质层的声阻抗与所述内层和所述外层的声阻抗不同。
  2. 根据权利要求1所述的耳垫，其特征在于，所述耳垫还包括支架，所述支架包括接触件，所述接触件与所述内层或所述外层接触。
  3. 根据权利要求1或2所述的耳垫，其特征在于，所述内层或所述外层的声阻抗至少为所述第一介质层的声阻抗的10倍。
  4. 根据权利要求1或2所述的耳垫，其特征在于，所述内层或所述外层的声阻抗至少为所述第一介质层的声阻抗的1000倍。
  5. 根据权利要求1-4任一所述的耳垫，其特征在于，所述外层包括外层第一部分和外层第二部分，所述外层第一部分或所述外层第二部分的全部区域或部分区域覆盖所述内层。
  6. 根据权利要求1-5任一所述的耳垫，其特征在于，所述外层包括外层第一部分和外层第二部分，所述内层包括内层第一部分，所述外层第一部分覆盖所述内层第一部分。
  7. 根据权利要求1-6任一所述的耳垫，其特征在于，所述外层包括外层第一部分和外层第二部分，所述内层包括内层第一部分和内层第二部分，所述外层第一部分覆盖所述内层第一部分，所述外层第二部分覆盖所述内层第二部分。
  8. 根据权利要求1-7任一所述的耳垫，其特征在于，所述第一介质层的厚度不超过所述内层的厚度或所述外层的厚度的10倍。
  9. 根据权利要求1-8任一所述的耳垫，其特征在于，所述内层为一层，两层或两层以上，其中每相邻两层之间隔有第三介质层。
  10. 根据权利要求1-9任一所述的耳垫，其特征在于，所述第一介质层为空气或泡棉。
  11. 根据权利要求9任一所述的耳垫，其特征在于，所述第三介质层为空气或泡棉。
  12. 根据权利要求2-11任一所述的耳垫，其特征在于，所述内层或所述外层与所述支架的接触件通过热压或者粘粘的方式接触。
  13. 一种耳罩部件，其特征在于，所述耳罩部件包括壳体和权利要求1-12中任意一项中所述的耳垫，所述耳垫的底部与所述壳体固定。
  14. 一种耳罩部件，其特征在于，所述耳罩部件包括耳垫和壳体，所述耳罩部件包括权利要求1-12中任意一项中所述的耳垫，所述耳垫包括内层，外层和支架，所述内层和所述外层通过所述支架的固定件与耳机的前腔壁，后腔壁或者隔板相固定。
  15. 一种耳机，其特征在于，所述耳机包括头环以及连接在头环两端的耳机接听端，所述耳机接听端包括权利要求1至12中任意一项中所述的耳垫。
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US20220295172A1 (en) 2022-09-15
CN112887859A (zh) 2021-06-01
JP2023503669A (ja) 2023-01-31
KR20220104046A (ko) 2022-07-25
EP4054204A1 (en) 2022-09-07
EP4054204A4 (en) 2022-12-28

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