JP7427049B2 - 基板処理装置及び基板処理システム - Google Patents
基板処理装置及び基板処理システム Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 208
- 238000012545 processing Methods 0.000 title claims description 126
- 238000000034 method Methods 0.000 claims description 120
- 230000008569 process Effects 0.000 claims description 96
- 238000001514 detection method Methods 0.000 claims description 27
- 230000005540 biological transmission Effects 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 230000005674 electromagnetic induction Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 30
- 238000010586 diagram Methods 0.000 description 26
- 210000002381 plasma Anatomy 0.000 description 22
- 239000000969 carrier Substances 0.000 description 17
- 239000010453 quartz Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 6
- 230000006837 decompression Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000004696 Poly ether ether ketone Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920002530 polyetherether ketone Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
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Description
形状を有することができる。
20 容器
21 第1容器
22 第2容器
W 基板
N ノッチ
R リング部材
FZ フラットゾーン
RZ ラウンドゾーン
G アライン溝
30 リングキャリア
31 胴体
32 開口
33 アラインホール
34 ガイド突起
35 第1ガイド突起
35F 第1フラット部
35R 第1ラウンド部
36 第2ガイド突起
36F 第2フラット部
36R 第2ラウンド部
110 ロードポート
111 安着部
112 整列ピン
113 送信部材
PL 外部電源ライン
114 変換部材
115 スイッチ部材
116 ハウジング
117 内部空間
118 検出部材
200 整列ユニット
210 チャック
220 照射部
230 受光部
310 ロードロックチャンバ
311 ハウジング
312 内部空間
313 ベントホール
314 減圧ホール
320 支持棚
510 処理容器
511 処理空間
512 搬入口
514 排気ホール
520 ゲートバルブ
530 排気ライン
540 電源ユニット
542 電源
544 整合機
550 支持ユニット
552 チャック
554 絶縁板
556 クオーツリング
R リング部材
560 第1リフトピンモジュール
570 第2リフトピンモジュール
580 バッフル板
582 バッフルホール
590 ガス供給ユニット
592 ガス供給源
594 ガス供給ライン
610 胴体
611 開閉センサー
612 収納空間
620 ドア
630 ヘッド
640 棚部
641 第1位置センサー
642 第2位置センサー
650 充電モジュール
651 充電部
652 支持部
653 ガイド部
654 駆動部
654a 駆動源
654b 駆動伝達源
654c アーム
660 バッテリー部
700 制御機
Claims (18)
- 基板を処理する装置において、
ロードポートを有するインデックス部と、及び
前記インデックス部から基板の返送を受けて前記基板を処理する工程処理部を含み、
前記ロードポートは、
内部空間を有するハウジングと、
前記ハウジングの上部に配置され、基板型センサーを収納する容器が置かれる安着部と、及び
前記容器に設置される電源装置を無線充電方式で充電する充電ユニットを含み、
前記充電ユニットは、
前記安着部に提供され、前記電源装置に電力を伝達する送信部材を含み、
前記安着部は、
前記安着部に置かれる前記容器の位置を整列する少なくとも一つ以上の整列ピンを含み、
前記送信部材は、
上部から眺める時、前記整列ピンと重畳されない位置に設置される
ことを特徴とする基板処理装置。 - 前記充電ユニットは、
前記内部空間に提供され、外部電源ラインと前記送信部材との間に提供される変換部材と、及び
前記外部電源ラインの電源が前記送信部材で選択的に伝達されるようにするスイッチ部材をさらに含むことを特徴とする請求項1に記載の基板処理装置。 - 前記変換部材は、
前記外部電源ラインが伝達する交流電源を直流電源に変換することを特徴とする請求項2に記載の基板処理装置。 - 前記充電ユニットは、
前記安着部に前記容器が安着されたかの如何を検出する検出部材をさらに含み、
前記スイッチ部材は、
前記検出部材が前記容器が前記安着部に安着されたことを検出する場合、前記外部電源ラインの電源が前記送信部材に伝達されるようにオン(On)になることを特徴とする請求項2乃至請求項3のうちで何れか一つに記載の基板処理装置。 - 前記充電ユニットは、
前記安着部に前記容器が安着されたかの如何を検出する検出部材をさらに含み、
前記スイッチ部材は、
前記検出部材が前記容器が前記安着部に安着されたことを検出することができない場合、前記外部電源ラインの電源が前記送信部材に伝達することを遮断するようにオフ(Off)になることを特徴とする請求項2乃至請求項3のうちで何れか一つに記載の基板処理装置。 - 基板を処理するシステムにおいて、
ロードポートを有するインデックス部と、
前記インデックス部から基板の返送を受けて前記基板を処理する工程処理部と、
前記ロードポートに置かれて、前記工程処理部に搬入される基板型センサーを収納する容器を含み、
前記容器は、
一側が開放された収納空間を有する胴体と、
前記収納空間を選択的に開閉するドアと、
前記収納空間で前記基板型センサーを支持する棚部と、及び
前記基板型センサーを充電する電力を伝達する電源装置を含み、
前記ロードポートは、
内部空間を有するハウジングと、
前記ハウジングの上部に配置され、基板型センサーを収納する容器が置かれる安着部と、及び
前記電源装置を無線充電方式で充電する充電ユニットを含み、
前記容器は、
前記棚部に支持された前記基板型センサーを充電する充電モジュールをさらに含み、
前記充電モジュールは、
前記棚部に支持された前記基板型センサーを無線充電方式で充電する
ことを特徴とする基板処理システム。 - 前記充電ユニットは、
前記安着部に提供され、前記電源装置に電力を伝達する送信部材と、
前記内部空間に提供され、外部電源ラインと前記送信部材の間に提供される変換部材と、及び
前記外部電源ラインの電力が前記送信部材で選択的に伝達されるようにするスイッチ部材を含むことを特徴とする請求項6に記載の基板処理システム。 - 前記変換部材は、
前記外部電源ラインが伝達する交流電源を直流電源に変換することを特徴とする請求項7に記載の基板処理システム。 - 前記充電ユニットは、
前記安着部に前記容器が安着されたかの如何を検出する検出部材をさらに含み、
前記スイッチ部材は、
前記検出部材が前記容器が前記安着部に安着されたことを検出する場合、前記外部電源ラインの電源が前記送信部材に伝達するようにオン(On)になることを特徴とする請求項7乃至請求項8のうちで何れか一つに記載の基板処理システム。 - 前記充電ユニットは、
前記安着部に前記容器が安着されたかの如何を検出する検出部材をさらに含み、
前記スイッチ部材は、
前記検出部材が前記容器が前記安着部に安着されたことを検出することができない場合、前記外部電源ラインの電源が前記送信部材に伝達することを遮断するようにオフ(Off)になることを特徴とする請求項7乃至請求項8のうちで何れか一つに記載の基板処理システム。 - 前記充電モジュールは、
前記棚部に支持された前記基板型センサーを電磁気誘導方式で前記充電することを特徴とする請求項6に記載の基板処理システム。 - 前記棚部、そして、前記充電モジュールは複数で提供されることを特徴とする請求項11に記載の基板処理システム。
- 前記システムは、
前記容器を保管する保管ユニットをさらに含み、
前記保管ユニットは、
前記容器が置かれる安着フレームと、
前記安着フレームに設置され、前記電源装置に電力を伝達する送信装置と、
外部電源ラインと前記送信装置の間に提供される変換装置と、及び
前記外部電源ラインの電力が前記送信装置に選択的に伝達されるようにするスイッチ装置と、を含むことを特徴とする請求項7乃至請求項8のうちで何れか一つに記載の基板処理システム。 - 基板を処理するシステムにおいて、
内部が大気圧雰囲気で維持されて第1返送ロボットが提供されるインデックスチャンバと、
前記インデックスチャンバと接続されるロードポートを有するインデックス部と、
前記インデックスチャンバと接続され、内部が大気圧雰囲気と真空圧雰囲気との間で転換されるロードロックチャンバと、
前記ロードロックチャンバと接続されて第2返送ロボットが提供される返送チャンバと、
前記返送チャンバと接続され、基板を処理する工程チャンバと、及び
前記ロードポートに置かれて、前記工程チャンバに返送される消耗性部品の返送位置を収集する基板型センサーを収納する容器を含み、
前記ロードポートは、
内部空間を有するハウジングと、
前記ハウジングの上部に配置され、前記容器が置かれる安着部と、及び
前記容器に設置される電源装置を無線充電方式で充電する充電ユニットを含む基板処理システム。 - 前記充電ユニットは、
前記安着部に提供され、前記電源装置に電力を伝達する送信部材と、
前記内部空間に提供され、外部電源ラインと前記送信部材との間に提供される変換部材と、及び
前記外部電源ラインの電力が前記送信部材に選択的に伝達されるようにするスイッチ部材を含むことを特徴とする請求項14に記載の基板処理システム。 - 前記充電ユニットは、
前記安着部に前記容器が安着されたかの如何を検出する検出部材をさらに含み、
前記スイッチ部材は、
前記検出部材が前記容器が前記安着部に安着されたことを検出する場合、前記外部電源ラインの電源が前記送信部材に伝達されるようにオン(On)になることを特徴とする請求項15に記載の基板処理システム。 - 前記充電ユニットは、
前記安着部に前記容器が安着されたかの如何を検出する検出部材をさらに含み、
前記検出部材が前記容器が前記安着部に安着されたことを検出することができない場合、前記外部電源ラインの電源が前記送信部材に伝達されることを遮断するようにオフ(Off)になることを特徴とする請求項15に記載の基板処理システム。 - 前記消耗性部品は、
前記工程チャンバに提供されるリング部材であり、
前記システムは、
制御機をさらに含み、
前記制御機は、
前記消耗性部品が前記工程チャンバ内に返送されるように前記第1返送ロボットと前記第2返送ロボットを制御し、
前記基板型センサーが前記工程チャンバ内に返送されるように前記第1返送ロボットと前記第2返送ロボットを制御し、
前記基板型センサーは、
前記消耗性部品と前記工程チャンバに提供されて基板を支持するチャックを含むイメージを獲得して前記制御機に送って、
前記制御機は、
前記イメージ内の前記消耗性部品と前記チャックとの間の間隔を測定し、測定された間隔を通じて前記消耗性部品の整列如何を判断することを特徴とする請求項14乃至請求項17のうちで何れか一つに記載の基板処理システム。
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