JP7424167B2 - 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 - Google Patents

樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 Download PDF

Info

Publication number
JP7424167B2
JP7424167B2 JP2020063137A JP2020063137A JP7424167B2 JP 7424167 B2 JP7424167 B2 JP 7424167B2 JP 2020063137 A JP2020063137 A JP 2020063137A JP 2020063137 A JP2020063137 A JP 2020063137A JP 7424167 B2 JP7424167 B2 JP 7424167B2
Authority
JP
Japan
Prior art keywords
resin composition
resin
group
mass
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020063137A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021161205A (ja
Inventor
秀 池平
啓之 阪内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2020063137A priority Critical patent/JP7424167B2/ja
Priority to TW110111002A priority patent/TWI888519B/zh
Priority to KR1020210040588A priority patent/KR20210122174A/ko
Priority to CN202110339761.XA priority patent/CN113462276B/zh
Publication of JP2021161205A publication Critical patent/JP2021161205A/ja
Priority to JP2023148495A priority patent/JP7647825B2/ja
Application granted granted Critical
Publication of JP7424167B2 publication Critical patent/JP7424167B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2020063137A 2020-03-31 2020-03-31 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置 Active JP7424167B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020063137A JP7424167B2 (ja) 2020-03-31 2020-03-31 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
TW110111002A TWI888519B (zh) 2020-03-31 2021-03-26 樹脂組成物、樹脂組成物之硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置
KR1020210040588A KR20210122174A (ko) 2020-03-31 2021-03-29 수지 조성물, 수지 조성물의 경화물, 수지 시트, 프린트 배선판, 반도체 칩 패키지 및 반도체 장치
CN202110339761.XA CN113462276B (zh) 2020-03-31 2021-03-30 树脂组合物、树脂组合物的固化物、树脂片材、印刷配线板、半导体芯片封装和半导体装置
JP2023148495A JP7647825B2 (ja) 2020-03-31 2023-09-13 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020063137A JP7424167B2 (ja) 2020-03-31 2020-03-31 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023148495A Division JP7647825B2 (ja) 2020-03-31 2023-09-13 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

Publications (2)

Publication Number Publication Date
JP2021161205A JP2021161205A (ja) 2021-10-11
JP7424167B2 true JP7424167B2 (ja) 2024-01-30

Family

ID=77868426

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020063137A Active JP7424167B2 (ja) 2020-03-31 2020-03-31 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
JP2023148495A Active JP7647825B2 (ja) 2020-03-31 2023-09-13 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023148495A Active JP7647825B2 (ja) 2020-03-31 2023-09-13 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

Country Status (3)

Country Link
JP (2) JP7424167B2 (enrdf_load_stackoverflow)
KR (1) KR20210122174A (enrdf_load_stackoverflow)
CN (1) CN113462276B (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118076697A (zh) * 2021-10-14 2024-05-24 味之素株式会社 树脂组合物
KR20240137592A (ko) * 2022-02-03 2024-09-20 아지노모토 가부시키가이샤 수지 조성물
JP7521560B2 (ja) * 2022-08-02 2024-07-24 味の素株式会社 樹脂シート
JP2025123063A (ja) * 2024-02-09 2025-08-22 味の素株式会社 樹脂組成物
CN118599460B (zh) * 2024-08-07 2024-10-29 武汉市三选科技有限公司 一种晶片黏结薄膜、存储器芯片及其制备方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013030998A1 (ja) 2011-08-31 2013-03-07 日立化成工業株式会社 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス
JP2013104029A (ja) 2011-11-16 2013-05-30 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
JP2013253220A (ja) 2012-05-11 2013-12-19 Air Water Inc エポキシ樹脂の硬化剤、製法、およびその用途
JP2015017247A (ja) 2013-06-12 2015-01-29 味の素株式会社 樹脂組成物
JP2016027097A (ja) 2014-06-30 2016-02-18 味の素株式会社 樹脂組成物
JP2017043767A (ja) 2015-08-24 2017-03-02 信越化学工業株式会社 熱硬化性樹脂組成物
JP2017179279A (ja) 2016-03-31 2017-10-05 味の素株式会社 樹脂組成物
JP2019044128A (ja) 2017-09-06 2019-03-22 味の素株式会社 樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6766360B2 (ja) 2016-01-15 2020-10-14 住友ベークライト株式会社 樹脂組成物
JP6927717B2 (ja) 2016-03-31 2021-09-01 積水化学工業株式会社 絶縁材料及び電子部品
JP2017179185A (ja) 2016-03-31 2017-10-05 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP6891427B2 (ja) 2016-09-09 2021-06-18 住友ベークライト株式会社 樹脂シート
JP7102093B2 (ja) * 2016-09-28 2022-07-19 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
JP2018083893A (ja) 2016-11-24 2018-05-31 日立化成株式会社 封止材用固形樹脂組成物及びそれを用いた再配置ウエハー、半導体パッケージ、その製造方法
JP7067140B2 (ja) * 2017-03-29 2022-05-16 味の素株式会社 樹脂組成物
JP2019173009A (ja) 2018-03-28 2019-10-10 積水化学工業株式会社 硬化体、樹脂材料及び多層プリント配線板
JP7424743B2 (ja) * 2018-09-04 2024-01-30 味の素株式会社 樹脂組成物、樹脂インク、樹脂インク層、樹脂シート及び半導体チップパッケージ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013030998A1 (ja) 2011-08-31 2013-03-07 日立化成工業株式会社 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス
JP2013104029A (ja) 2011-11-16 2013-05-30 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
JP2013253220A (ja) 2012-05-11 2013-12-19 Air Water Inc エポキシ樹脂の硬化剤、製法、およびその用途
JP2015017247A (ja) 2013-06-12 2015-01-29 味の素株式会社 樹脂組成物
JP2016027097A (ja) 2014-06-30 2016-02-18 味の素株式会社 樹脂組成物
JP2017043767A (ja) 2015-08-24 2017-03-02 信越化学工業株式会社 熱硬化性樹脂組成物
JP2017179279A (ja) 2016-03-31 2017-10-05 味の素株式会社 樹脂組成物
JP2019044128A (ja) 2017-09-06 2019-03-22 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
TW202202575A (zh) 2022-01-16
KR20210122174A (ko) 2021-10-08
JP2023160985A (ja) 2023-11-02
CN113462276B (zh) 2024-06-21
JP7647825B2 (ja) 2025-03-18
CN113462276A (zh) 2021-10-01
JP2021161205A (ja) 2021-10-11

Similar Documents

Publication Publication Date Title
JP7405182B2 (ja) 樹脂組成物
JP7102093B2 (ja) 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
JP6787210B2 (ja) 樹脂組成物
JP7046477B2 (ja) 樹脂組成物
JP7444212B2 (ja) 樹脂組成物
JP7424167B2 (ja) 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
JP7444154B2 (ja) 樹脂組成物
JP6897026B2 (ja) 樹脂組成物
TWI851739B (zh) 樹脂薄片、電路基板及半導體晶片封裝
JP7067656B2 (ja) 樹脂組成物
JP7420012B2 (ja) 樹脂組成物
JP7424168B2 (ja) 樹脂組成物、樹脂ペースト、硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置
JP7131593B2 (ja) 樹脂組成物
JP6947251B2 (ja) 樹脂組成物
TWI888519B (zh) 樹脂組成物、樹脂組成物之硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置
JP7416118B2 (ja) 樹脂組成物
JP7533670B2 (ja) 樹脂組成物
JP7067594B2 (ja) 樹脂組成物

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221102

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20221102

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221206

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230221

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230413

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20230613

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230913

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20231030

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231219

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240101

R150 Certificate of patent or registration of utility model

Ref document number: 7424167

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150