JP7413273B2 - 制御モジュールおよび半導体装置 - Google Patents
制御モジュールおよび半導体装置 Download PDFInfo
- Publication number
- JP7413273B2 JP7413273B2 JP2020552989A JP2020552989A JP7413273B2 JP 7413273 B2 JP7413273 B2 JP 7413273B2 JP 2020552989 A JP2020552989 A JP 2020552989A JP 2020552989 A JP2020552989 A JP 2020552989A JP 7413273 B2 JP7413273 B2 JP 7413273B2
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- JP
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- Prior art keywords
- pattern
- control module
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- Prior art date
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Links
- 239000004065 semiconductor Substances 0.000 title claims description 43
- 238000002955 isolation Methods 0.000 claims description 17
- 238000009413 insulation Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 88
- 238000001514 detection method Methods 0.000 description 68
- 101000685663 Homo sapiens Sodium/nucleoside cotransporter 1 Proteins 0.000 description 39
- 102100023116 Sodium/nucleoside cotransporter 1 Human genes 0.000 description 39
- 238000010586 diagram Methods 0.000 description 29
- 230000007257 malfunction Effects 0.000 description 16
- 239000003990 capacitor Substances 0.000 description 15
- 239000002184 metal Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 101000821827 Homo sapiens Sodium/nucleoside cotransporter 2 Proteins 0.000 description 13
- 102100021541 Sodium/nucleoside cotransporter 2 Human genes 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000001012 protector Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 230000004043 responsiveness Effects 0.000 description 4
- 238000004904 shortening Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/0045—Converters combining the concepts of switch-mode regulation and linear regulation, e.g. linear pre-regulator to switching converter, linear and switching converter in parallel, same converter or same transistor operating either in linear or switching mode
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
- Rectifiers (AREA)
- Dc-Dc Converters (AREA)
- Power Conversion In General (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018194163 | 2018-10-15 | ||
JP2018194163 | 2018-10-15 | ||
JP2019008171 | 2019-01-22 | ||
JP2019008171 | 2019-01-22 | ||
JP2019161239 | 2019-09-04 | ||
JP2019161239 | 2019-09-04 | ||
PCT/JP2019/037175 WO2020080043A1 (ja) | 2018-10-15 | 2019-09-24 | 制御モジュールおよび半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020080043A1 JPWO2020080043A1 (ja) | 2021-09-02 |
JP7413273B2 true JP7413273B2 (ja) | 2024-01-15 |
Family
ID=70284470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020552989A Active JP7413273B2 (ja) | 2018-10-15 | 2019-09-24 | 制御モジュールおよび半導体装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7413273B2 (de) |
CN (1) | CN112840547B (de) |
DE (1) | DE212019000114U1 (de) |
WO (1) | WO2020080043A1 (de) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010088195A (ja) | 2008-09-30 | 2010-04-15 | Hitachi Automotive Systems Ltd | 電力変換装置 |
JP2015029403A (ja) | 2013-07-05 | 2015-02-12 | パナソニックIpマネジメント株式会社 | 半導体装置 |
JP2016082110A (ja) | 2014-10-20 | 2016-05-16 | ローム株式会社 | ゲートドライバユニットおよびパワーモジュール |
JP2017208912A (ja) | 2016-05-17 | 2017-11-24 | アイシン・エィ・ダブリュ株式会社 | インバータ制御基板 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4857017B2 (ja) * | 2006-04-27 | 2012-01-18 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
JP2017108521A (ja) | 2015-12-09 | 2017-06-15 | 株式会社Soken | 電力変換装置 |
JP6544222B2 (ja) * | 2015-12-11 | 2019-07-17 | 住友電気工業株式会社 | 半導体モジュール及び半導体モジュールユニット |
-
2019
- 2019-09-24 WO PCT/JP2019/037175 patent/WO2020080043A1/ja active Application Filing
- 2019-09-24 CN CN201980067476.8A patent/CN112840547B/zh active Active
- 2019-09-24 JP JP2020552989A patent/JP7413273B2/ja active Active
- 2019-09-24 DE DE212019000114.9U patent/DE212019000114U1/de active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010088195A (ja) | 2008-09-30 | 2010-04-15 | Hitachi Automotive Systems Ltd | 電力変換装置 |
JP2015029403A (ja) | 2013-07-05 | 2015-02-12 | パナソニックIpマネジメント株式会社 | 半導体装置 |
JP2016082110A (ja) | 2014-10-20 | 2016-05-16 | ローム株式会社 | ゲートドライバユニットおよびパワーモジュール |
JP2017208912A (ja) | 2016-05-17 | 2017-11-24 | アイシン・エィ・ダブリュ株式会社 | インバータ制御基板 |
Also Published As
Publication number | Publication date |
---|---|
DE212019000114U1 (de) | 2020-04-21 |
WO2020080043A1 (ja) | 2020-04-23 |
CN112840547A (zh) | 2021-05-25 |
JPWO2020080043A1 (ja) | 2021-09-02 |
CN112840547B (zh) | 2023-08-22 |
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