WO2020080043A1 - 制御モジュールおよび半導体装置 - Google Patents

制御モジュールおよび半導体装置 Download PDF

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Publication number
WO2020080043A1
WO2020080043A1 PCT/JP2019/037175 JP2019037175W WO2020080043A1 WO 2020080043 A1 WO2020080043 A1 WO 2020080043A1 JP 2019037175 W JP2019037175 W JP 2019037175W WO 2020080043 A1 WO2020080043 A1 WO 2020080043A1
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Prior art keywords
control module
pattern region
pattern
region
viewed
Prior art date
Application number
PCT/JP2019/037175
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
幸太郎 柴田
秀喜 澤田
Original Assignee
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by ローム株式会社 filed Critical ローム株式会社
Priority to DE212019000114.9U priority Critical patent/DE212019000114U1/de
Priority to CN201980067476.8A priority patent/CN112840547B/zh
Priority to JP2020552989A priority patent/JP7413273B2/ja
Publication of WO2020080043A1 publication Critical patent/WO2020080043A1/ja

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/0045—Converters combining the concepts of switch-mode regulation and linear regulation, e.g. linear pre-regulator to switching converter, linear and switching converter in parallel, same converter or same transistor operating either in linear or switching mode
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Definitions

  • the present disclosure relates to a control module that controls operations of a plurality of switching elements and a semiconductor device that includes the control module.
  • a power module is known in which multiple switching elements are electrically connected.
  • the switching element is, for example, a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) or an IGBT (Insulated Gate Bipolar Transistor).
  • a control signal from the control module is input to the control terminal (gate terminal in the case of MOSFET) of each switching element to switch between ON (conduction state) and OFF (interruption state).
  • Patent Document 1 discloses a power conversion device including a power module and a control module (a printed circuit board on which a controller is mounted). In this power converter, the control module is arranged above the power module.
  • the main object of the present disclosure is to provide a more preferable control module and a semiconductor device including the control module in controlling a power module including a plurality of switching elements.
  • a control module provided by the first aspect of the present disclosure is a control module that controls operations of a first switching element and a second switching element, and includes a plurality of electronic components, operating power of the control module, and an input signal. And a circuit board on which the plurality of electronic components and the connector are mounted, the circuit board including a first pattern area in which a first wiring pattern is formed, and a second wiring.
  • One side of the second direction which is located on one side of the first direction orthogonal to each other and which is orthogonal to both the thickness direction and the first direction with respect to the second connecting portion when viewed in the thickness direction.
  • first pattern region and the second pattern region are respectively viewed in the thickness direction, the first edge on one side in the first direction and the second edge on the other side in the first direction.
  • An edge, a third edge on one side in the second direction, and a fourth edge on the other side in the second direction, and the first edge of the first pattern region is the The second edge of the first pattern region is located on one side in the first direction with respect to the first edge of the second pattern region.
  • the pattern region is located on one side in the first direction with respect to the second edge, and the third edge of the first pattern region is in the second direction with respect to the third edge of the second pattern region.
  • the third pattern region includes a joining region for joining the connector, and is located between the first pattern region and the second pattern region when viewed in the thickness direction.
  • the joining region is arranged between the first connecting portion and the second connecting portion in each of the first direction and the second direction.
  • a semiconductor device provided by the second aspect of the present disclosure includes a control module provided by the first aspect, and a power module having the first switching element and the second switching element.
  • a more preferable control module can be provided for controlling the power module. Further, a semiconductor device including the control module can be provided.
  • FIG. 1 is a schematic diagram showing a circuit configuration of a semiconductor device according to a first embodiment.
  • FIG. 3 is a circuit diagram of an upper arm drive circuit according to the first embodiment.
  • FIG. 3 is a circuit diagram of a lower arm drive circuit according to the first embodiment.
  • 3 is a circuit diagram of a common circuit according to the first embodiment.
  • FIG. It is a perspective view showing a power module concerning a 1st embodiment.
  • FIG. 3 is a component layout diagram on the circuit board according to the first embodiment.
  • FIG. 3 is a wiring layout diagram on the circuit board according to the first embodiment.
  • FIG. 3 is an exploded perspective view of the circuit board according to the first embodiment.
  • FIG. 3 is a plan view showing a first wiring layer according to the first embodiment.
  • FIG. 3 is a plan view showing a second wiring layer according to the first embodiment.
  • FIG. 4 is a plan view showing a third wiring layer according to the first embodiment.
  • FIG. 6 is a plan view showing a fourth wiring layer according to the first embodiment.
  • FIG. 6 is a plan view showing a fifth wiring layer according to the first embodiment.
  • FIG. 6 is a plan view showing a sixth wiring layer according to the first embodiment.
  • It is a schematic diagram showing a circuit configuration of a semiconductor device according to a second embodiment. It is a circuit diagram of an upper arm drive circuit according to the second embodiment. It is a circuit diagram of a lower arm drive circuit according to the second embodiment. It is a circuit diagram of a common circuit according to the second embodiment.
  • FIG. 7 is a circuit diagram (partially extracted) of an upper arm drive circuit according to a third embodiment.
  • FIG. 9 is a circuit diagram (partially extracted) of a lower arm drive circuit according to a third embodiment. It is a component layout diagram on a circuit board concerning a 3rd embodiment.
  • control module and the semiconductor device of the present disclosure will be described below with reference to the drawings.
  • same or similar components will be assigned the same reference numerals and explanations thereof will be omitted.
  • the terms “first”, “second”, “third” and the like in the present disclosure are merely used as labels, and do not necessarily mean that those objects are permuted.
  • the control module of the present disclosure controls the power module.
  • the power module is used for a power converter such as an inverter or a converter.
  • a semiconductor device including a power module and a control module will be described as an example.
  • FIG. 1 is a schematic diagram showing the semiconductor device A1. As shown in FIG. 1, the semiconductor device A1 includes a power module PM and a control module CM1.
  • the power module PM is controlled by the control module CM1 and converts, for example, DC power into AC power.
  • the power module PM is not limited to a DC / AC inverter that converts DC power into AC power, but an AC / DC converter that converts AC power into DC power, and a DC / AC converter that converts DC power into DC power (step down or step up). It may be a DC converter.
  • the power module PM includes a switching circuit SW, as shown in FIG.
  • the circuit configuration of the power module PM shown in FIG. 1 is an example.
  • the switching circuit SW includes two switching elements Q1 and Q2 as shown in FIG. A diode may be connected in antiparallel to each of the switching elements Q1 and Q2.
  • the switching elements Q1 and Q2 are MOSFETs, for example, as shown in FIG.
  • the switching elements Q1 and Q2 are not limited to MOSFETs, but may be other transistors such as IGBTs and bipolar transistors.
  • the constituent material of each switching element Q1, Q2 is, for example, SiC (silicon carbide).
  • the constituent material is not limited to SiC, and may be Si (silicon), GaN (gallium nitride), GaAs (gallium arsenide), or the like.
  • the switching elements Q1 and Q2 each include an input signal terminal, an output signal terminal, and a control signal terminal.
  • the switching elements Q1 and Q2 are MOSFETs, the input signal terminal is the drain terminal, the output signal terminal is the source terminal, and the control signal terminal is the gate terminal.
  • the input signal terminal of the switching element Q1 is connected to the terminal P.
  • the terminal P is connected to a connection line on the high potential side of an external DC power supply (not shown).
  • the output signal terminal of the switching element Q1 is connected to the input signal terminal of the switching element Q2.
  • the connection point between the output signal terminal of the switching element Q1 and the input signal terminal of the switching element Q2 is connected to the two terminals O1 and O2.
  • the two terminals O1 and O2 may be, for example, one terminal or three or more terminals.
  • the output signal terminal of the switching element Q2 is connected to the terminal N.
  • the terminal N is connected to a connection line on the low potential side of an external DC power supply. Therefore, in the switching circuit SW, the switching element Q1 is an upper arm and the switching element Q2 is a lower arm, which are connected in series.
  • the control signal terminals of the switching elements Q1 and Q2 are connected to the control module CM1.
  • the control module CM1 controls the operation of the power module PM, particularly the switching elements Q1 and Q2.
  • the control module CM1 operates by the electric power supplied from the external power supply DC shown in FIG.
  • the control module CM1 includes an upper arm drive circuit 10A, a lower arm drive circuit 20A, and a common circuit 30A.
  • the upper arm drive circuit 10A controls the operation of the switching element Q1 which is the upper arm.
  • the upper arm drive circuit 10A switches the switching element Q1 between ON (conduction state) and OFF (interruption state) by inputting a control signal to the control signal terminal of the switching element Q1.
  • the lower arm drive circuit 20A controls the operation of the switching element Q2, which is the lower arm.
  • the lower arm drive circuit 20A switches the switching element Q2 between ON (conduction state) and OFF (interruption state) by inputting a control signal to the control signal terminal of the switching element Q2.
  • the common circuit 30A is a circuit portion commonly used by the upper arm drive circuit 10A and the lower arm drive circuit 20A in the control module CM1.
  • FIG. 2 to 4 are diagrams for explaining the circuit configuration of the control module CM1.
  • FIG. 2 shows a circuit configuration example of the upper arm drive circuit 10A.
  • FIG. 3 shows a circuit configuration example of the lower arm drive circuit 20A.
  • FIG. 4 shows a circuit configuration example of the common circuit 30A.
  • the upper arm drive circuit 10A has, as its functional configuration, an insulated power supply section 11, a gate driver section 12, a drive assist section 13, a surge protection section 14, a short-circuit protection section 15, and a secondary side power supply section 16. And a voltage protection unit 17.
  • the lower arm drive circuit 20A has, as its functional configuration, an insulated power supply unit 21, a gate driver unit 22, a drive assist unit 23, a surge protection unit 24, a short-circuit protection unit 25, and a secondary power supply unit 26. And a voltage protection unit 27.
  • the insulated power supply units 11 and 21 generate electric power for operating the upper arm drive circuit 10A and the lower arm drive circuit 20A, respectively.
  • the insulating power supply unit 11 includes an insulating transformer 111 and a power supply IC 112
  • the insulating power supply unit 21 includes an insulating transformer 211 and a power supply IC 212.
  • Each of the isolation transformers 111 and 211 performs transformation and also isolates the input side and the output side.
  • the power supply ICs 112 and 212 are respectively arranged on the input side (left side of FIGS. 2 and 3) of the isolation transformers 111 and 211, and the insulation power supply units 11 and 21 control the voltage.
  • the gate driver sections 12 and 22 generate control signals for operating the switching element Q1 of the upper arm and the switching element Q2 of the lower arm, respectively.
  • the gate driver unit 12 includes a control IC 121
  • the gate driver unit 22 includes a control IC 221.
  • the control ICs 121 and 221 are both dedicated ICs for controlling the operations of the switching elements Q1 and Q2. Both the control ICs 121 and 221 are insulated inside. Therefore, the control ICs 121 and 221 are insulation type gate driver ICs. Further, the control ICs 121 and 221 have a built-in mirror clamp circuit. If the mirror clamp circuit is not built in, the mirror clamp circuit may be provided outside the control ICs 121 and 221.
  • the drive assisting units 13 and 23 assist the gate driver units 12 and 22, respectively, and assist the driving of the switching elements Q1 and Q2.
  • the drive assisting units 13 and 23 convert the control signals generated by the gate driver units 12 and 22 into signals suitable for input to the control signal terminals of the switching elements Q1 and Q2, respectively. Then, the converted signal is output to the switching elements Q1 and Q2.
  • the drive assisting section 13 includes a current limiting circuit 131, transistors 132 and 133, and a plurality of bias capacitors 134 and 135.
  • the drive assisting section 23 includes a current limiting circuit 231, transistors 232 and 233, and a plurality of bias capacitors 234. 235 is included.
  • the current limiting circuits 131 and 231 are connected to the control signal terminals of the switching elements Q1 and Q2.
  • Each of the current limiting circuits 131 and 231 is configured by a combination of a plurality of diodes and a plurality of resistors, as shown in FIGS.
  • the current limiting circuits 131 and 231 adjust the switching speeds of the switching elements Q1 and Q2 by adjusting the resistance values of the plurality of resistors. In the examples of FIGS. 2 and 3, by using diodes, each switching speed when the switching elements Q1 and Q2 are on and off can be individually adjusted.
  • Each of the current limiting circuits 131 and 231 is not limited to a configuration in which a plurality of diodes and a plurality of resistors are combined, and may be configured by only a plurality of resistors or a single resistor.
  • the current limiting circuits 131 and 231 are gate resistors of the switching elements Q1 and Q2.
  • the transistors 132 and 133 are elements for switching the switching element Q1 on and off.
  • the transistors 132 and 133 are so-called pre-drivers.
  • the transistors 132 and 133 are controlled by the control IC 121 to be switched on and off.
  • Transistors 132 and 133 are, for example, bipolar transistors as shown in FIG. 2, but are not limited to these and may be other transistors.
  • the transistors 232 and 233 are elements for switching the switching element Q2 on and off.
  • the transistors 232 and 233 are so-called pre-drivers.
  • the control IC 221 controls switching of the transistors 232 and 233 between on and off.
  • Transistors 232 and 233 are, for example, bipolar transistors as shown in FIG. 3, but are not limited thereto and may be other transistors.
  • the transistor 232 is on and the transistor 233 is off, the potential of the control signal terminal of the switching element Q2 is raised to raise the control voltage (gate voltage). As a result, the switching element Q2 is turned on.
  • the transistor 232 is off and the transistor 233 is on, the potential of the control signal terminal of the switching element Q2 is lowered and the control voltage (gate voltage) is lowered. As a result, the switching element Q2 is turned off.
  • the bias capacitors 134 and 234 supply the current on the positive bias side, respectively.
  • the bias capacitors 135 and 235 each supply a current on the negative bias side.
  • the transistor 132 is on and the transistor 133 is off as described above. At this time, a current flows from the output signal terminal of the switching element Q1 to the control signal terminal of the switching element Q1 through the bias capacitor 134, the transistor 132, and the current limiting circuit 131 (the upper diode and the plurality of resistors in FIG. 2). Flows.
  • the transistor 132 is off and the transistor 133 is on, as described above. At this time, from the control signal terminal of the switching element Q1 to the output signal terminal of the switching element Q1 through the current limiting circuit 131 (the lower diode and the plurality of resistors in FIG. 2), the transistor 133, and the bias capacitor 135. An electric current flows. The same applies to the drive assist unit 23.
  • the surge protectors 14 and 24 are for protecting the control signal terminals of the switching elements Q1 and Q2 from surge voltage.
  • the short circuit protection units 15 and 25 are for short circuit protection in the switching elements Q1 and Q2, respectively.
  • the short-circuit protection unit 15 includes two diodes 151 as shown in FIG. 2, and the short-circuit protection unit 25 includes two diodes 251 as shown in FIG.
  • a voltage obtained by dividing the terminal voltage on the anode side of the two diodes 151 by the two resistors R1 is input to the SCPIN terminal of the control IC 121.
  • a voltage obtained by dividing the terminal voltage on the anode side of the two diodes 251 by the two resistors R2 is input to the SCPIN terminal of the control IC 221.
  • the short-circuit protection units 15 and 25 are for the control ICs 121 and 221 to perform voltage detection type short-circuit detection. For example, when a short circuit occurs in the switching elements Q1 and Q2, a large current flows through the switching elements Q1 and Q2. At this time, the terminal voltage on the anode side of the short-circuit protection units 15 and 25 rises. Therefore, the control ICs 121 and 221 can detect the overcurrent of the switching elements Q1 and Q2, that is, the short circuit by monitoring the value of the voltage input to the SCPIN terminal.
  • the secondary side power supply units 16 and 26 are provided in the subsequent stages (right side of FIGS. 2 and 3) of the insulated power supply units 11 and 21.
  • the secondary power supply units 16 and 26 respectively convert the outputs of the insulated power supply units 11 and 21 into appropriate voltages.
  • the secondary power supply unit 16 includes an LDO 161 as shown in FIG. 2, and the secondary power supply unit 26 includes an LDO 261 as shown in FIG. Both LDO 161, 261 are low dropout linear regulators.
  • Each of the voltage protection units 17 and 27 monitors an overvoltage, an undervoltage, etc. to protect the power supply. When the overvoltage and the low voltage occur, the voltage protection units 17 and 27 force the gate driver units 12 and 22 to forcibly shut down the control ICs 121 and 221.
  • the voltage protection unit 17 includes a plurality of comparators 171 as shown in FIG. 2, and the voltage protection unit 27 includes a plurality of comparators 271 as shown in FIG.
  • the common circuit 30A is a circuit portion commonly used by the upper arm drive circuit 10A and the lower arm drive circuit 20A in the control module CM1.
  • FIG. 4 shows a detailed circuit configuration of the common circuit 30A.
  • the common circuit 30A includes an input filter unit 31, a primary power supply unit 32, a logic circuit unit 33, and a thermistor output unit 34.
  • the input filter unit 31 stabilizes the DC voltage VCC supplied from the external power supply DC.
  • the primary-side power supply unit 32 is arranged at the subsequent stage of the input filter unit 31 (right side in FIG. 4).
  • the primary side power supply unit 32 converts the output of the input filter unit 31 into an appropriate voltage.
  • the primary power supply unit 32 includes an LDO 321 as shown in FIG.
  • the LDO 321 is a low dropout linear regulator.
  • the LDO 321 functions as a power supply for the logic circuit unit 33 and the like.
  • the logic circuit unit 33 receives an enable signal, a fault signal from the upper arm drive circuit 10A, a fault signal from the lower arm drive circuit 20A, and the like.
  • the logic circuit unit 33 stops the lower arm drive circuit 20A based on the input signal, for example, when the upper arm drive circuit 10A is in an abnormal state. The reverse is also true.
  • the thermistor output unit 34 is for inputting a signal from an externally attached thermistor via the terminals TH1 and TH2 to detect an abnormal temperature state.
  • the plurality of terminals CP in FIGS. 2 to 4 are external terminals for inputting the operating power of the control module CM1 and the input signal to the control module CM1 to the control module CM1.
  • the plurality of terminals CP are a part of the connector CNT1 described later.
  • FIGS. 5 to 14 are views for explaining the device structure of the semiconductor device A1 according to the first embodiment.
  • three directions orthogonal to each other are defined as an x direction, ay direction, and az direction.
  • one of the x directions is the x1 direction and the other of the x directions is the x2 direction.
  • one of the y directions is the y1 direction
  • the other y direction is the y2 direction
  • one z direction is the z1 direction
  • the other z direction is the z2 direction.
  • the z direction is the thickness direction of the semiconductor device A1.
  • the z1 direction may be referred to as the bottom and the z2 direction may be referred to as the top.
  • FIG. 5 is a perspective view showing the device structure of the power module PM.
  • the power module PM includes a plurality of power terminals 51, a plurality of signal terminals 52, a case 53, and a top plate 54 in its device structure. Switching elements Q1 and Q2 are incorporated in the power module PM.
  • the plurality of power terminals 51 include two power supply terminals 511 and 512 and two output terminals 513 and 514.
  • the two power supply terminals 511 and 512 are connected to a DC power supply (not shown) arranged outside the semiconductor device A1.
  • the two power supply terminals 511 and 512 are supported by the case 53. Both the power supply terminals 511 and 512 are made of a thin metal plate such as copper. The surface of the metal thin plate may be plated with nickel (Ni).
  • the power supply terminal 511 is a positive electrode (P terminal) of the power module PM.
  • the power supply terminal 512 is the negative electrode (N terminal) of the power module PM.
  • the two power supply terminals 511 and 512 are arranged apart from each other in the y direction. Each of the power supply terminals 511 and 512 has the same shape.
  • each of the power supply terminals 511 and 512 is exposed to the outside of the power module PM, and a connection hole penetrating in the z direction is provided in a portion orthogonal to the z direction. Fastening members such as bolts are inserted into the connection holes.
  • the power supply terminal 511 is connected to the input signal terminal of the switching element Q1 inside the power module PM, and the power supply terminal 512 is connected to the output signal terminal of the switching element Q2 inside the power module PM. .
  • the power supply terminal 511 corresponds to the terminal P in the circuit configuration shown in FIG. 1, and the power supply terminal 512 corresponds to the terminal N in the circuit configuration shown in FIG.
  • the two output terminals 513 and 514 are connected to a load such as a motor arranged outside the semiconductor device A1.
  • the two output terminals 513 and 514 are supported by the case 53.
  • the constituent material of each of the output terminals 513 and 514 is the same thin metal plate as that of the power supply terminals 511 and 512.
  • the surface of the metal thin plate may be nickel-plated.
  • the two output terminals 513 and 514 are located on the opposite side of the power supply terminals 511 and 512 in the x direction.
  • the two output terminals 513 and 514 are arranged apart from each other in the y direction.
  • the two output terminals 513 and 514 may have a single structure that is not divided into a plurality.
  • the two output terminals 513 and 514 have the same shape.
  • each of the output terminals 513 and 514 is exposed to the outside of the power module PM, and a connection hole penetrating in the z direction is provided in a portion orthogonal to the z direction. Fastening members such as bolts are inserted into the connection holes. Further, the output terminals 513 and 514 are both electrically connected to the connection point between the output signal terminal of the switching element Q1 and the input signal terminal of the switching element Q2.
  • the output terminal 513 corresponds to the terminal O1 in the circuit configuration shown in FIG. 1, and the output terminal 514 corresponds to the terminal O2 in the circuit configuration shown in FIG.
  • the plurality of signal terminals 52 are input terminals or output terminals of various signals for controlling the switching elements Q1 and Q2 of the power module PM.
  • the plurality of signal terminals 52 include a pair of control signal terminals 521A and 521B, a pair of element current detection terminals 522A and 522B, a pair of output signal terminals 523A and 523B, a power supply current detection terminal 524, and two thermistor terminals 525. There is.
  • the pair of control signal terminals 521A and 521B are one element of the external connection terminals of the power module PM.
  • the pair of control signal terminals 521A and 521B are connected to the control module CM1.
  • the pair of control signal terminals 521A and 521B are supported by the case 53. Part of each of the pair of control signal terminals 521A and 521B is exposed to the outside of the power module PM, and the exposed part projects from the top plate 54 in the z2 direction.
  • the pair of control signal terminals 521A and 521B are metal rods made of copper, for example.
  • the surface of the metal rod is tin (Sn) plated. Nickel plating may be applied between the surface of the metal rod and the tin plating.
  • the control signal terminal 521A is electrically connected to the control signal terminal (gate terminal) of the switching element Q1, and the control signal terminal 521B is electrically connected to the control signal terminal (source terminal) of the switching element Q2.
  • the control signal terminal 521A corresponds to the terminal G1 in the circuit configuration shown in FIG. 1, and the control signal terminal 521B corresponds to the terminal G2 in the circuit configuration shown in FIG.
  • the pair of element current detection terminals 522A and 522B are one element of the external connection terminals of the power module PM.
  • the pair of element current detection terminals 522A and 522B are connected to the control module CM1.
  • the pair of element current detection terminals 522A and 522B are supported by the case 53. Both the pair of element current detection terminals 522A and 522B protrude in the z direction toward the side where the pair of control signal terminals 521A and 521B protrude.
  • Both the pair of element current detection terminals 522A and 522B are made of a metal rod made of the same constituent material as that of the pair of control signal terminals 521A and 521B.
  • Both the pair of element current detection terminals 522A and 522B have the same shape as the pair of control signal terminals 521A and 521B.
  • the element current detection terminal 522A is electrically connected to the output signal terminal (source terminal) of the switching element Q1
  • the element current detection terminal 522B is electrically connected to the output signal terminal (source terminal) of the switching element Q2.
  • the element current detection terminal 522A corresponds to the terminal S1 in the circuit configuration shown in FIG. 1
  • the element current detection terminal 522B corresponds to the terminal S2 in the circuit configuration shown in FIG.
  • the pair of output signal terminals 523A and 523B are one element of the external connection terminals of the power module PM.
  • the pair of output signal terminals 523A and 523B are connected to the control module CM1.
  • the pair of output signal terminals 523A and 523B are supported by the case 53. Both the pair of output signal terminals 523A and 523B project in the z direction toward the side where the pair of control signal terminals 521A and 521B project.
  • Both the pair of output signal terminals 523A and 523B are composed of a metal rod made of the same constituent material as that of the pair of control signal terminals 521A and 521B.
  • the shape of the pair of output signal terminals 523A and 523B is the same as the shape of the pair of control signal terminals 521A and 521B.
  • the output signal terminal 523A is electrically connected to the output signal terminal (source terminal) of the switching element Q1
  • the output signal terminal 523B is electrically connected to the output signal terminal (source terminal) of the switching element Q2.
  • the output signal terminal 523A corresponds to the terminal SS1 in the circuit configuration shown in FIG. 1
  • the output signal terminal 523B corresponds to the terminal SS2 in the circuit configuration shown in FIG.
  • the power supply current detection terminal 524 is an element of the external connection terminal of the power module PM.
  • the power supply current detection terminal 524 is connected to the control module CM1.
  • the power supply current detection terminal 524 is supported by the case 53.
  • the power supply current detection terminal 524 projects in the z direction toward the side where the pair of control signal terminals 521A and 521B project.
  • the power supply current detection terminal 524 is composed of a metal rod made of the same constituent material as the pair of control signal terminals 521A and 521B.
  • the shape of the power supply current detection terminal 524 is the same as the shape of the pair of control signal terminals 521A and 521B.
  • the power supply current detection terminal 524 is electrically connected to the input signal terminal (drain terminal) of the switching element Q1.
  • the power supply current detection terminal 524 corresponds to the terminal DS1 in the circuit configuration shown in FIG.
  • the two thermistor terminals 525 are one element of the external connection terminals of the power module PM.
  • the two thermistor terminals 525 are connected to the control module CM1.
  • the two thermistor terminals 525 are supported by the case 53. Both the two thermistor terminals 525 project in the z direction toward the side where the pair of control signal terminals 521A and 521B project.
  • Both of the two thermistor terminals 525 are composed of a metal rod made of the same constituent material as the pair of control signal terminals 521A and 521B.
  • the shapes of the two thermistor terminals 525 are the same as the shapes of the pair of control signal terminals 521A and 521B.
  • the two thermistor terminals 525 correspond to the terminals TH1 and TH2 in the circuit configuration shown in FIG.
  • the case 53 is a container that covers the switching elements Q1 and Q2.
  • the case 53 is an electrically insulating member, and is made of, for example, a synthetic resin such as PPS (polyphenylene sulfide) that has an electrically insulating property and is excellent in heat resistance.
  • PPS polyphenylene sulfide
  • the top plate 54 closes the internal area of the power module PM formed by the case 53.
  • the top plate 54 is made of synthetic resin having electric insulation.
  • the control module CM1 is mounted on the top plate 54.
  • control signal terminal 521A, the device current detection terminal 522A, and the output signal terminal 523A are arranged in the x direction as shown in FIG. 5, and are arranged on the y1 direction side in plan view. . These terminals are adjacent. Further, the control signal terminal 521A, the device current detection terminal 522A, and the output signal terminal 523A are located on the x1 direction side with respect to the center of the power module PM in the x direction in plan view.
  • control signal terminal 521B, the device current detection terminal 522B, and the output signal terminal 523B are arranged in the x direction as shown in FIG. 5, and are arranged on the y2 direction side in plan view. . These terminals are adjacent.
  • the control signal terminal 521B, the element current detection terminal 522B, and the output signal terminal 523B are located on the x2 direction side with respect to the center of the power module PM in the x direction in plan view.
  • the control signal terminal 521A and the control signal terminal 521B are arranged approximately in point symmetry with respect to the center point P1 of the power module PM in plan view, as shown in FIG.
  • the element current detection terminal 522A and the element current detection terminal 522B are arranged approximately in point symmetry with respect to the center point P1 of the power module PM in plan view, as shown in FIG.
  • the output signal terminals 523A and 523B are arranged in point symmetry with respect to the center point P1 of the power module PM in plan view.
  • the center point P1 is an intersection of a center line passing through the midpoints of both ends in the x direction of the power module PM and a center line passing through the midpoints of both ends in the y direction.
  • the power supply current detection terminal 524 is arranged on the y1 direction side and also on the x1 direction side of the power module PM, as shown in FIG.
  • the two thermistor terminals 525 are arranged on the y1 direction side and the x2 direction side of the power module PM.
  • the two thermistor terminals 525 are adjacent to each other.
  • the control signal terminal 521A, the element current detection terminal 522A, the output signal terminal 523A, the power supply current detection terminal 524, and the two thermistor terminals 525 overlap each other when viewed in the x direction.
  • the control module CM1 includes a circuit board 60, a connector CNT1, and a plurality of electronic components in its device structure.
  • the plurality of electronic components and the connector CNT1 are mounted on the circuit board 60.
  • the plurality of electronic components include a first component group, a second component group, and a third component group.
  • the first component group is a set of electronic components that form the upper arm drive circuit 10A shown in FIG. Therefore, the operation of the switching element Q1 is controlled by the first component group.
  • the second component group is a set of electronic components that configure the lower arm drive circuit 20A shown in FIG. Therefore, the operation of the switching element Q2 is controlled by the second component group.
  • the third component group is a set of electronic components that form the common circuit 30A shown in FIG.
  • FIG. 6 and 7 are plan views showing the device structure of the control module CM1.
  • FIG. 6 shows a component layout on the circuit board 60.
  • FIG. 7 shows a wiring layout on the circuit board 60.
  • a plurality of electronic components and the connector CNT1 are shown by imaginary lines (broken lines).
  • the connector CNT1 is a hardware interface for inputting its operating power and input signal to the control module CM1.
  • the connector CNT1 is mounted on the surface of the circuit board 60 on the z2 direction side.
  • the outer shape of the connector CNT1 is a substantially rectangular parallelepiped. As shown in FIG. 6, the connector CNT1 is arranged such that the long side direction of the connector CNT1 and the short side direction of the circuit board 60 are substantially the same.
  • the connector CNT1 has a rectangular shape extending in the y direction in a plan view.
  • the connector CNT1 is mounted so that external terminals are connected from the z2 direction side. Therefore, the insertion port of the connector CNT1 faces upward (z2 direction).
  • the connector CNT1 overlaps the center line LCx of the circuit board 60 in the x direction in a plan view and the center line LCy of the circuit board 60 in the y direction in a plan view. Further, the connector CNT1 overlaps the intersection P2 of the two diagonal lines LD1 and LD2 of the circuit board 60 in a plan view.
  • the circuit board 60 has a rectangular shape in plan view, and the center line LCx and the center line LCy pass through the intersection P2 of the two diagonal lines LD1 and LD2 of the circuit board 60 in plan view. Therefore, the connector CNT1 is arranged in the center of the circuit board 60 in a plan view.
  • the first component group and the second component group are arranged approximately point-symmetrically with respect to the connector CNT1.
  • the insulated power supply unit 11 is arranged on the x1 direction side and the y2 direction side of the circuit board 60 in a plan view.
  • the gate driver unit 12 is arranged next to the insulated power supply unit 11 in the x2 direction.
  • the voltage protection unit 17, the drive assist unit 13, and the surge protection unit 14 are arranged in this order.
  • a secondary power supply unit 16 is arranged on the y1 direction side of the insulated power supply unit 11.
  • the insulated power supply unit 21 is arranged on the x2 direction side and the y1 direction side of the circuit board 60 in a plan view.
  • a gate driver unit 22 is arranged next to the insulated power supply unit 21 in the x1 direction.
  • a drive assisting portion 23 and a surge protecting portion 24 are arranged in this order on the y2 direction side of the gate driver portion 22.
  • a secondary power supply unit 26 and a voltage protection unit 27 are arranged in this order on the y2 direction side of the insulated power supply unit 21.
  • the short-circuit protection units 15 and 25 are arranged on the x1 direction side and the y1 direction side of the circuit board 60 in a plan view.
  • the circuit board 60 has a substantially rectangular shape in plan view, as shown in FIGS. 6 and 7.
  • the circuit board 60 has a pair of first end edges 60a each extending in the x direction and a pair of second end edges 60b each extending in the y direction in a plan view. Each first edge 60a is longer than each second edge 60b.
  • the circuit board 60 is a rectangle extending in the x direction.
  • the circuit board 60 is a multilayer board.
  • the circuit board 60 includes a plurality of wiring layers Ly that are stacked on each other with an insulating layer interposed therebetween.
  • the circuit board 60 includes the first wiring layer Ly1, the second wiring layer Ly2, the third wiring layer Ly3, the fourth wiring layer Ly4, the fifth wiring layer Ly5, and the sixth wiring layer Ly6.
  • FIG. 8 is an exploded perspective view of the wiring layers Ly1 to Ly6 showing the multilayer structure of the circuit board 60. Although illustration is omitted, an insulating layer is sandwiched between each of the wiring layers Ly1 to Ly6.
  • the first wiring layer Ly1 is a surface layer on the z2 direction side of the circuit board 60.
  • the sixth wiring layer Ly6 is a surface layer on the z1 direction side of the circuit board 60.
  • FIG. 9 is a plan view showing the first wiring layer Ly1.
  • wirings are patterned as shown in FIG. 9, for example.
  • FIG. 10 is a plan view showing the second wiring layer Ly2.
  • the wiring is patterned, for example, as shown in FIG.
  • FIG. 11 is a plan view showing the third wiring layer Ly3.
  • wirings are patterned as shown in FIG. 11, for example.
  • FIG. 12 is a plan view showing the fourth wiring layer Ly4.
  • wiring is patterned, for example, as shown in FIG.
  • FIG. 13 is a plan view showing the fifth wiring layer Ly5.
  • the wiring is patterned, for example, as shown in FIG.
  • FIG. 14 is a plan view showing the sixth wiring layer Ly6.
  • wirings are patterned as shown in FIG. 14, for example.
  • the circuit board 60 includes a plurality of terminal connecting portions 70, a first pattern region 81, a second pattern region 82, a third pattern region 83, a first insulating region 91 and a second insulating region. Includes 92.
  • each of the plurality of terminal connecting portions 70 penetrates the circuit board 60 in the z direction, and each signal terminal 52 of the power module PM is inserted therethrough.
  • the plurality of terminal connection parts 70 are a pair of control signal connection parts 71A and 71B, a pair of element current detection connection parts 72A and 72B, a pair of output signal connection parts 73A and 73B, and a power supply current detection connection part. 74 and two thermistor connections 75.
  • the control signal connecting portion 71A, the element current detecting connecting portion 72A and the output signal connecting portion 73A are collectively referred to as an upper arm terminal connecting portion 70A.
  • the control signal connecting portion 71B, the element current detecting connecting portion 72B, and the output signal connecting portion 73B are collectively referred to as a lower arm terminal connecting portion 70B.
  • the control signal terminal 521A is inserted into the control signal connection portion 71A, and the control signal connection portion 71A is electrically connected to the control signal terminal (gate terminal) of the switching element Q1.
  • the control signal connection portion 71A is formed in the first pattern area 81. It conducts to the first pattern region 81.
  • the control signal terminal 521B is inserted into the control signal connection portion 71B, and the control signal connection portion 71B is electrically connected to the control signal terminal (gate terminal) of the switching element Q2. Further, the control signal connection part 71B is electrically connected to the second pattern region 82.
  • 71 A of control signal connection parts are located in a x1 direction and a y1 direction rather than the control signal connection part 71B in planar view.
  • the element current detection connection portion 72A has the element current detection terminal 522A inserted therein, and conducts to the output signal terminal (source terminal) of the switching element Q1. Further, the device current detection connection 72A is electrically connected to the first pattern region 81. The element current detection terminal 522B is inserted into the element current detection connection portion 72B, and the element current detection connection portion 72B is electrically connected to the output signal terminal (source terminal) of the switching element Q2. Further, the element current detection connection portion 72B is electrically connected to the second pattern region 82. The element current detection connection portion 72A is located in the x1 direction and the y1 direction more than the element current detection connection portion 72B in a plan view.
  • the output signal connection portion 73A has the output signal terminal 523A inserted therein and is electrically connected to the output signal terminal (source terminal) of the switching element Q1. Further, the output signal connection portion 73A is electrically connected to the first pattern region 81. The output signal terminal 523B is inserted into the output signal connection portion 73B, and the output signal connection portion 73B is electrically connected to the output signal terminal (source terminal) of the switching element Q2. The output signal connection portion 73B is electrically connected to the second pattern region 82.
  • the output signal connecting portion 73A is located in the x1 direction and the y1 direction more than the output signal connecting portion 73B in a plan view.
  • the power supply current detection connection unit 74 has the power supply current detection terminal 524 inserted therein and conducts to the input signal terminal (drain terminal) of the switching element Q1.
  • the power supply current detection connection portion 74 is arranged on the circuit board 60 in the x1 direction and in the y1 direction in a plan view. As shown in FIG. 6, the short-circuit protection parts 15 and 25 are arranged near the power supply current detection connection part 74. Since a high voltage can be applied to the power supply current detection connection portion 74, the diodes 151 and 251 forming the short-circuit protection portions 15 and 25 having relatively high withstand voltage are used.
  • Each of the two thermistor connecting portions 75 has one thermistor terminal 525 inserted therein.
  • the two thermistor connecting portions 75 are electrically connected to the third pattern region 83.
  • the two thermistor connecting portions 75 are arranged in the x direction.
  • the two thermistor connecting portions 75 are arranged on the circuit board 60 closer to the x2 direction and closer to the y1 direction.
  • control signal connection portion 71A the element current detection connection portion 72A, the output signal connection portion 73A, the power supply current detection connection portion 74, and the two thermistor connection portions 75 are overlapped when viewed in the x direction.
  • the upper arm terminal connection portion 70A (control signal connection portion 71A, element current detection connection portion 72A and output signal connection portion 73A) is arranged along the first edge 60a of the circuit board 60 on the y1 direction side.
  • the lower arm terminal connection portion 70B (control signal connection portion 71B, element current detection connection portion 72B, and output signal connection portion 73B) is arranged along the first edge 60a of the circuit board 60 on the y2 direction side.
  • control signal connection part 71A, the element current detection connection part 72A, and the output signal connection part 73A are adjacent to each other in the x direction.
  • the element current detection connection portion 72A and the output signal connection portion 73A are arranged on the opposite sides of the control signal connection portion 71A.
  • the element current detection connection portion 72A is located on the x2 direction side of the control signal connection portion 71A, and the output signal connection portion 73A is located on the x1 direction side of the control signal connection portion 71A.
  • the control signal connection 71A, the device current detection connection 72A, and the output signal connection 73A are located on the x1 direction side of the center line LCx of the circuit board 60 in the x direction.
  • control signal connection 71B, the element current detection connection 72B, and the output signal connection 73B are adjacent to each other in the x direction.
  • the element current detection connection portion 72B and the output signal connection portion 73B are arranged on opposite sides of the control signal connection portion 71B.
  • the element current detection connection portion 72B is located on the x1 direction side of the control signal connection portion 71B
  • the output signal connection portion 73B is located on the x2 direction side of the control signal connection portion 71B.
  • the control signal connection portion 71B, the element current detection connection portion 72B, and the output signal connection portion 73B are located on the x2 direction side of the center line LCx of the circuit board 60 in the x direction.
  • the first pattern area 81, the second pattern area 82, and the third pattern area 83 are separated from each other in a plan view.
  • a first wiring pattern is formed in the first pattern area 81.
  • a second wiring pattern is formed in the second pattern area 82.
  • a third wiring pattern is formed in the third pattern area 83.
  • the first pattern area 81, the second pattern area 82, and the third pattern area 83 extend over each of the wiring layers Ly1 to Ly6, and the first wiring pattern, the second wiring pattern, and the third wiring pattern include each wiring layer Ly1. To Ly6, respectively.
  • the first wiring pattern, the second wiring pattern, and the third wiring pattern are electrically connected by, for example, a via provided in each insulating layer.
  • the first wiring pattern, the second wiring pattern, and the third wiring pattern are solid patterns in the sixth wiring layer Ly6 shown in FIG. 14, for example.
  • the solid pattern (the first wiring pattern, the second wiring pattern, and the third wiring pattern in the sixth wiring layer Ly6) may or may not be ground-connected.
  • Each of the first wiring pattern, the second wiring pattern, and the third wiring pattern does not have to be one continuous object in each of the wiring layers Ly1 to Ly6, and includes a plurality of metal layers separated from each other. Good.
  • the fourth wiring layer Ly4 shown in FIG. 12 the first wiring pattern, the second wiring pattern, and the third wiring pattern are divided into a plurality of metal layers, and the electric paths are patterned by these metal layers. ing.
  • a part of the first component group is arranged in the first pattern area 81.
  • a part of the first component group is electrically connected to the first wiring pattern.
  • the first pattern region 81 is located on the x1 direction side and the y1 direction side of the circuit board 60 in a plan view. As shown in FIG. 7, the first pattern region 81 includes a first end edge 811, a second end edge 812, a third end edge 813 and a fourth end edge 814.
  • the first edge 811 is an edge on the x1 direction side in plan view.
  • the second edge 812 is an edge on the x2 direction side in plan view.
  • the third edge 813 is an edge on the y1 direction side in plan view.
  • the fourth edge 814 is an edge on the y2 direction side in plan view.
  • a part of the second component group is arranged in the second pattern area 82. Part of this second component group is electrically connected to the second wiring pattern.
  • the second pattern region 82 is formed on the x2 direction side and the y2 direction side of the circuit board 60 in a plan view. As shown in FIG. 7, the second pattern region 82 includes a first end edge 821, a second end edge 822, a third end edge 823 and a fourth end edge 824.
  • the first edge 821 is an edge on the x1 direction side in plan view.
  • the second end edge 822 is an end edge on the x2 direction side in plan view.
  • the third edge 823 is an edge on the y1 direction side in plan view.
  • the fourth edge 824 is an edge on the y2 direction side in plan view.
  • the third pattern area 83 a part of the first part group, a part of the second part group, and the third part group are arranged. Part of the first component group, part of the second component group, and the third component group are electrically connected to the third wiring pattern.
  • the third pattern region 83 extends in the direction along the diagonal line LD1 of the circuit board 60. As shown in FIG. 7, the third pattern area 83 includes a first portion 831, a second portion 832, and a third portion 833.
  • the first portion 831 is a portion arranged in the y2 direction with respect to the fourth edge 814 of the first pattern region 81.
  • the first portion 831 has a dimension in the x direction larger than that in the y direction.
  • the first portion 831 overlaps the second pattern region 82 when viewed in the x direction.
  • the first portion 831 is located on the x1 direction side and the y2 direction side of the circuit board 60 in a plan view.
  • the second portion 832 is a portion arranged in the y1 direction with respect to the third edge 823 of the second pattern region 82.
  • the second portion 832 has a larger dimension in the x direction than in the y direction.
  • the second portion 832 overlaps the first pattern area 81 when viewed in the x direction.
  • the second portion 832 is located on the x2 direction side and the y2 direction side of the circuit board 60 in a plan view.
  • the second power source unit 32, the logic circuit unit 33, and the thermistor output unit 34 are mounted on the second unit 832.
  • the third part 833 is a part connected to the first part 831 and the second part 832.
  • the third portion 833 has a dimension in the y direction larger than a dimension in the x direction.
  • the third portion 833 is located at each central portion in the x direction and the y direction of the circuit board 60 in a plan view.
  • the third portion 833 includes a bonding area 834.
  • the joining region 834 is a region where the connector CNT1 is joined.
  • the bonding region 834 overlaps the third portion 833 in plan view.
  • the bonding region 834 overlaps the intersection P2 of the two diagonal lines LD1 and LD2 of the circuit board 60 in a plan view.
  • the center of the bonding region 834 and the intersection P2 of the diagonal lines LD1 and LD2 substantially coincide with each other.
  • the first edge 811 of the first pattern area 81 is located on the x1 direction side of the first edge 821 of the second pattern area 82.
  • the second edge 812 of the first pattern area 81 is located on the x1 direction side of the second edge 822 of the second pattern area 82.
  • the third edge 813 of the first pattern region 81 is located on the y1 direction side of the third edge 823 of the second pattern region 82.
  • the fourth edge 814 of the first pattern area 81 is located on the y1 direction side of the fourth edge 824 of the second pattern area 82.
  • the upper arm terminal connection portion 70A overlaps the first pattern area 81 in plan view as shown in FIG.
  • the upper arm terminal connecting portion 70A is arranged closer to the second end edge 812 in the x direction of the first pattern region 81 in plan view.
  • the upper arm terminal connection portion 70A is arranged in the first pattern region 81 in the y direction toward the third end edge 813 in the plan view.
  • the lower arm terminal connection portion 70B overlaps the second pattern area 82 in plan view.
  • the lower arm terminal connecting portion 70B is arranged closer to the first edge 821 in the x direction of the second pattern region 82 in plan view.
  • the lower arm terminal connection portion 70B is arranged in the second pattern region 82 in the y direction near the fourth end edge 824 in a plan view.
  • the second edge 812 of the first pattern area 81 is located in the x1 direction from the first edge 821 of the second pattern area 82 in a plan view.
  • the second edge 812 of the first pattern region 81 is located on the x1 direction side of the center line LCx of the circuit board 60 in the x direction.
  • the first end edge 821 of the second pattern region 82 is located on the x2 direction side of the center line LCx of the circuit board 60 in the x direction. Therefore, the first pattern area 81 and the second pattern area 82 are formed on opposite sides of the center line LCx in the x direction.
  • the straight line connecting the centers of the bonding regions 834 in the x direction substantially matches the center line LCx in a plan view
  • the first pattern region 81 and the second pattern region 82 are The joining regions 834 are arranged on opposite sides of each other with a straight line connecting the centers in the x direction sandwiched therebetween.
  • both the fourth edge 814 of the first pattern area 81 and the third edge 823 of the second pattern area 82 overlap the third portion 833 when viewed in the x direction, and particularly, the bonding area. Overlap 834.
  • the first insulating region 91 is a region that insulates the first pattern region 81 and the third pattern region 83 from each other.
  • the first insulating region 91 is formed in each of the wiring layers Ly1 to Ly6.
  • the plurality of first insulating regions 91 formed in the wiring layers Ly1 to Ly6 overlap each other in a plan view.
  • the second insulating region 92 is a region that insulates the second pattern region 82 and the third pattern region 83 from each other.
  • the second insulating region 92 is formed in each of the wiring layers Ly1 to Ly6.
  • the plurality of second insulating regions 92 formed in each of the wiring layers Ly1 to Ly6 overlap each other in plan view.
  • the surge protector 14 is arranged near the upper arm terminal connection 70A (control signal connection 71A, element current detection connection 72A and output signal connection 73A) as shown in FIG. There is.
  • the surge protector 24 is arranged near the lower arm terminal connection 70B (control signal connection 71B, element current detection connection 72B, and output signal connection 73B), as shown in FIG.
  • the drive assisting section 13 and the drive assisting section 23 are arranged in a point symmetry with respect to the connector CNT1 (joint area 834) in plan view.
  • the isolation transformer 111 and the isolation transformer 211, and the control IC 121 and the control IC 221 are arranged approximately in point symmetry with respect to the connector CNT1 (joint region 834).
  • the drive assisting portion 13 and the surge protection portion 14 are arranged between the upper arm terminal connecting portion 70A and the control IC 121. Both the drive assisting portion 13 and the surge protection portion 14 are arranged closer to the upper arm terminal connecting portion 70A than the gate driver portion 12. As shown in FIG. 6, the surge protector 14 is arranged closer to the upper arm terminal connecting portion 70A than the drive assisting portion 13.
  • the drive assisting portion 23 and the surge protection portion 24 are arranged between the lower arm terminal connecting portion 70B and the control IC 221. Both the drive assisting portion 23 and the surge protection portion 24 are arranged closer to the lower arm terminal connecting portion 70B than the gate driver portion 22. As shown in FIG. 6, the surge protection portion 24 is arranged closer to the lower arm terminal connection portion 70B than the drive assisting portion 23.
  • the current limiting circuit 131 is arranged between the upper arm terminal connecting portion 70A and the transistors 132 and 133 in plan view as shown in FIG.
  • the bias capacitors 134 and 135 are arranged near both the current limiting circuit 131 and the transistors 132 and 133.
  • the current limiting circuit 231 is arranged between the lower arm terminal connecting portion 70B and the transistors 232 and 233 in plan view.
  • the bias capacitors 234 and 235 are arranged near both the current limiting circuit 231 and the transistors 232 and 233.
  • the insulating transformer 111 and the control IC 121 respectively overlap the first pattern region 81, the third pattern region 83, and the first insulating region 91 in plan view. Therefore, it is arranged so as to straddle the first pattern area 81 and the third pattern area 83. At this time, the insulating transformer 111 and the control IC 121 have one side connected to the first wiring pattern and the other side connected to the third wiring pattern with the insulated portion inside thereof interposed. Similarly, the insulating transformer 211 and the control IC 221 respectively overlap the second pattern region 82, the third pattern region 83, and the second insulating region 92 in a plan view.
  • the insulating transformer 211 and the control IC 221 have one side connected to the second wiring pattern and the other side connected to the third wiring pattern with the insulated portion inside thereof interposed.
  • the upper arm terminal connecting portion 70A is located in the x1 direction from the lower arm terminal connecting portion 70B and in the y1 direction from the lower arm terminal connecting portion 70B in plan view. Further, the first edge 811 of the first pattern area 81 is located in the x1 direction more than the first edge 821 of the second pattern area 82, and the second edge 812 of the first pattern area 81 is the second pattern. The second end edge 822 of the area 82 is located in the x1 direction, and the third end edge 813 of the first pattern area 81 is located in the y1 direction of the third end edge 823 of the second pattern area 82.
  • the fourth edge 814 of the pattern region 81 is located in the y1 direction more than the fourth edge 824 of the second pattern region 82.
  • the joining region 834 joining the connector CNT1 is located between the upper arm terminal connecting portion 70A and the lower arm terminal connecting portion 70B in each of the x direction and the y direction.
  • the control module CM1 of the present disclosure when the connector CNT1 is arranged near the edge of the circuit board 60 (either the first edge 60a or the second edge 60b), the power module shown in FIG. When used with PM, the difference in distance from the connector CNT1 to each terminal connecting portion (corresponding to the upper arm terminal connecting portion 70A and the lower arm terminal connecting portion 70B) may be large. Therefore, the bias of the wiring impedance becomes large. According to the control module CM1, when used together with the power module PM shown in FIG. 5, it is possible to effectively suppress the deviation of the wiring impedance between the upper arm drive circuit 10A and the lower arm drive circuit 20A.
  • the drive assisting portion 13 is arranged near the upper arm terminal connecting portion 70A in plan view. This makes it possible to shorten the current path that passes through the drive assisting section 13 when the switching element Q1 is on and the current path that passes through the drive assisting section 13 when the switching element Q1 is off. Therefore, in the upper arm drive circuit 10A, it is possible to suppress the operation delay of switching the switching element Q1 between on and off. In particular, when a SiC MOSFET is used as the switching element Q1, its responsiveness is high. Therefore, if the current path is long, the delay in switching the switching element Q1 between on and off becomes significant.
  • the operation delay can be suppressed and the switching time of the switching element Q1 can be shortened.
  • the control module CM1 in the drive assisting section 13, as shown in FIG. 6, the current limiting circuit 131 is arranged between the transistors 132 and 133 and the upper arm terminal connecting section 70A. This configuration is a more preferable mode for shortening the current path passing through the drive assisting portion 13.
  • the drive assisting portion 23 is arranged near the lower arm terminal connecting portion 70B in plan view. This makes it possible to shorten the current path that passes through the drive assisting section 23 when the switching element Q2 is on and the current path that passes through the drive assisting section 23 when the switching element Q2 is off. Therefore, in the lower arm drive circuit 20A, it is possible to suppress the operation delay of switching the switching element Q2 between on and off. In particular, when a SiC MOSFET is used as the switching element Q2, its responsiveness is high. Therefore, if the current path is long, the delay in the switching operation of switching element Q2 between on and off becomes significant.
  • the operation delay can be suppressed and the switching time of the switching element Q2 can be shortened.
  • the current limiting circuit 231 is arranged between the transistors 232 and 233 and the lower arm terminal connecting section 70B. By adopting this configuration, it is a more preferable aspect in shortening the current path passing through the drive assisting portion 23.
  • the surge protection unit 14 is arranged closest to the upper arm terminal connection unit 70A in the first component group. That is, the wiring distance between the surge protection portion 14 and the upper arm terminal connection portion 70A is short. In order to protect the surge voltage by the surge protection unit 14, it is desirable to shorten the wiring distance between the surge protection unit 14 and the switching element Q1. Therefore, the control module CM1 can have a preferable component arrangement for protecting the switching element Q1 from a surge voltage.
  • the surge protection portion 24 is arranged closest to the lower arm terminal connection portion 70B. That is, the wiring distance between the surge protection portion 24 and the lower arm terminal connection portion 70B is short. In order to protect the surge voltage by the surge protection unit 24, it is desirable to shorten the wiring distance between the surge protection unit 24 and the switching element Q2. Therefore, the control module CM1 can have a preferable component arrangement for protecting the switching element Q2 from the surge voltage.
  • the third pattern area 83 includes the first portion 831 and the second portion 832.
  • the first portion 831 is arranged on the y2 direction side of the fourth end edge 814 of the first pattern region 81
  • the second portion 832 is arranged on the y1 direction side of the third end edge 823 of the second pattern region 82.
  • the insulating transformer 111 and the insulating transformer 211, and the control IC 121 and the control IC 221 can be arranged in a point symmetry with respect to the connector CNT1 in plan view.
  • the first insulating regions 91 formed in the wiring layers Ly1 to Ly6 overlap each other in a plan view, and the second insulating regions 92 formed in the wiring layers Ly1 to Ly6 also. , They overlap each other in plan view.
  • the first pattern area 81, the second pattern area 82, and the third pattern area 83 are separated from each other in each of the wiring layers Ly1 to Ly6. Therefore, the first wiring pattern formed in the first pattern area 81, the second wiring pattern formed in the second pattern area 82, and the third wiring pattern formed in the third pattern area 83 are not intended. A short circuit can be suppressed.
  • FIG. 15 is a schematic diagram showing the semiconductor device A2. As shown in FIG. 15, the semiconductor device A2 includes a power module PM and a control module CM2. The semiconductor device A2 is different from the semiconductor device A1 in that a control module CM2 is provided instead of the control module CM1.
  • the control module CM2 includes an upper arm drive circuit 10B, a lower arm drive circuit 20B and a common circuit 30B in its circuit configuration.
  • FIG. 16 to 18 are diagrams for explaining the circuit configuration of the control module CM2.
  • FIG. 16 shows a circuit configuration example of the upper arm drive circuit 10B.
  • FIG. 17 shows a circuit configuration example of the lower arm drive circuit 20B.
  • FIG. 18 shows a circuit configuration example of the common circuit 30B.
  • the upper arm drive circuit 10B is different from the upper arm drive circuit 10A in that it includes a control IC 122 instead of the control IC 121, and further includes a mirror clamp section 18. Mainly different.
  • the lower arm drive circuit 20B includes a control IC 222 instead of the control IC 221 as compared with the lower arm drive circuit 20A, and further includes a mirror clamp section 28. Mainly different.
  • control ICs 122 and 222 are dedicated ICs for controlling the operations of the switching elements Q1 and Q2.
  • the control ICs 121 and 221 have a built-in mirror clamp circuit
  • the control ICs 122 and 222 do not have a built-in mirror clamp circuit
  • the mirror ICs provided outside the control ICs 122 and 222 are controlled.
  • Mirror mirror parts 18 and 28 suppress malfunction of switching elements Q1 and Q2.
  • This malfunction is, for example, a malfunctioning ON operation of the gate.
  • the gate erroneous ON operation means that the voltage (gate voltage) of the control signal terminal of the switching element Q1 of the upper arm causes ringing, or the voltage (gate voltage) of the control signal terminal of the switching element Q2 of the lower arm rises. This is a phenomenon in which the switching elements Q1 and Q2 malfunction. That is, the mirror clamp portions 18 and 28 suppress the gate erroneous ON operation.
  • the mirror clamp unit 18 includes a transistor 181
  • the mirror clamp unit 28 includes a transistor 281.
  • the transistors 181, 281 are, for example, MOSFETs.
  • the transistors 181, 281 are connected between the control signal terminals and the output signal terminals of the switching elements Q1, Q2. As shown in FIGS. 16 and 17, the transistors 181 and 281 have their gate terminals connected to the control ICs 122 and 222 (OUT2 terminals) and are turned on by the control signals input from the control ICs 122 and 222. It switches to off.
  • the voltage between the control signal terminal and the output signal terminal (gate-source) of the switching elements Q1, Q2 is substantially 0 (zero) V or
  • the bias voltage is forced to a negative value to eliminate the rise of the potential (gate potential) of the control signal terminals of the switching elements Q1 and Q2.
  • the transistor 181 is on, for example, the current flows through the path indicated by the thick arrow in FIG.
  • the transistor 281 is turned on, for example, the current in the path indicated by the thick arrow in FIG.
  • the short-circuit protection units 15 and 25 are each configured to include a resistor and a capacitor, as shown in FIGS. 16 and 17.
  • the short-circuit protection units 15 and 25 of this embodiment are configured such that the control ICs 122 and 222 perform current detection type short-circuit detection.
  • the common circuit 30B includes an input filter unit 31, a primary power supply unit 32, a logic circuit unit 33, and a thermistor output unit 34, as in the common circuit 30A.
  • the common circuit 30B has, for example, the circuit configuration shown in FIG. 18, but the functions of the input filter unit 31, the primary power supply unit 32, the logic circuit unit 33, and the thermistor output unit 34 are the same as those of the common circuit 30A. .
  • 19 to 24 are views for explaining the device structure of the semiconductor device A2 according to the second embodiment.
  • the control module CM2 includes, in its device structure, a circuit board 61, a connector CNT2, and a plurality of electronic components.
  • the connector CNT2 and the plurality of electronic components are mounted on the circuit board 61.
  • the plurality of electronic components in the device structure of the control module CM2 include a first component group, a second component group, and a third component group.
  • the first component group is a set of electronic components that form the upper arm drive circuit 10B shown in FIG.
  • the second component group is a set of electronic components that form the lower arm drive circuit 20B shown in FIG.
  • the third component group is a set of electronic components that form the common circuit 30B shown in FIG.
  • FIG. 19 and 20 are plan views showing the device structure of the control module CM2.
  • FIG. 19 shows a component layout on the circuit board 61. In FIG. 19, the component layout is indirectly shown by showing pads for mounting a plurality of electronic components.
  • FIG. 20 shows a wiring layout on the circuit board 61. In FIG. 20, pads and connectors CNT2 for mounting a plurality of electronic components are shown by imaginary lines (broken lines).
  • the connector CNT2 is the same as the connector CNT1 of the first embodiment. However, as shown in FIG. 19, the connector CNT2 is arranged such that the long side direction of the connector CNT2 and the long side direction of the circuit board 61 are substantially the same. As shown in FIG. 19, the connector CNT2 has a rectangular shape extending in the x direction in a plan view.
  • the circuit board 61 is a multilayer board.
  • the circuit board 61 includes a first wiring layer Ly1, a second wiring layer Ly2, a third wiring layer Ly3, and a fourth wiring layer Ly4.
  • the circuit board 61 has a four-layer structure.
  • the first wiring layer Ly1, the second wiring layer Ly2, the third wiring layer Ly3, and the fourth wiring layer Ly4 are laminated with an insulating layer interposed therebetween.
  • the first wiring layer Ly1 is a surface layer on the z2 direction side of the circuit board 61.
  • the fourth wiring layer Ly4 is a surface layer on the z1 direction side of the circuit board 61.
  • FIG. 21 is a plan view showing the first wiring layer Ly1.
  • Wirings are patterned on the first wiring layer Ly1 as shown in FIG.
  • FIG. 22 is a plan view showing the second wiring layer Ly2.
  • Wirings are patterned on the second wiring layer Ly2 as shown in FIG.
  • FIG. 23 is a plan view showing the third wiring layer Ly3.
  • Wirings are patterned on the third wiring layer Ly3 as shown in FIG.
  • FIG. 24 is a plan view showing the fourth wiring layer Ly4.
  • Wirings are patterned on the fourth wiring layer Ly4 as shown in FIG.
  • the first wiring pattern, the second wiring pattern, and the third wiring pattern are solid patterns, for example, in the fourth wiring layer Ly4, as shown in FIG. This solid pattern (the first wiring pattern, the second wiring pattern, and the third wiring pattern in the fourth wiring layer Ly4) may or may not be connected to the ground.
  • the circuit board 61 includes a plurality of terminal connecting portions 70, a first pattern region 81, a second pattern region 82, a third pattern region 83, a first insulating region 91, and a second insulating region. 92 and a third insulating region 93 are included.
  • the plurality of terminal connecting portions 70 of the circuit board 61 are configured similarly to the plurality of terminal connecting portions 70 of the circuit board 60.
  • the upper arm terminal connecting portion 70A is arranged in the central portion in the x direction of the first pattern area 81 in plan view as shown in FIG.
  • the upper arm terminal connection portion 70A is arranged in the first pattern region 81 in the y direction toward the third end edge 813 in the plan view.
  • the lower arm terminal connection portion 70B is arranged in the central portion of the second pattern region 82 in the x direction in plan view.
  • the lower arm terminal connection portion 70B is arranged in the second pattern region 82 in the y direction near the fourth end edge 824 in a plan view.
  • the third insulating region 93 has a fan shape in plan view.
  • the third insulating region 93 is a part of a circle centered on the power supply current detection connecting portion 74 in a plan view.
  • the third insulating region 93 is provided to ensure the insulation of the power supply current detection connecting portion 74. Since the power supply current detection connecting portion 74 is disposed in the circuit board 61 in the x1 direction and in the y1 direction in the plan view, the third insulating region 93 is in the plan view in the circuit board. Of 61, they are arranged in the x1 direction and in the y1 direction.
  • the third insulating region 93 is formed in each of the wiring layers Ly1 to Ly4.
  • the plurality of third insulating regions 93 formed in each of the wiring layers Ly1 to Ly4 overlap each other in a plan view.
  • the third pattern area 83 of the circuit board 61 is different from the third pattern area 83 of the circuit board 60 in the following points. That is, in the third pattern region 83, the first portion 831 has a larger dimension in the y direction than the dimension in the x direction, and the second portion 832 has a larger dimension in the y direction than the dimension in the x direction. The size of 833 is larger in the x direction than in the y direction. Further, a part of the first component group is mounted on the first part 831, and a part of the second component group, the primary power supply part 32, and the thermistor output part 34 are mounted on the second part 832. The input filter unit 31, the logic circuit unit 33, and the connector CNT2 are mounted on the third unit 833 for each part of the first component group and the second component group.
  • the positional relationship between the pattern areas 81 to 83 of the circuit board 61 differs from the positional relationship between the pattern areas 81 to 83 of the circuit board 60 in the following points. That is, the second end edge 812 of the first pattern area 81 is located in the x2 direction more than the first end edge 821 of the second pattern area 82 in a plan view. The second edge 812 of the first pattern region 81 is located on the x2 direction side of the center line LCx of the circuit board 61 in the x direction. The first end edge 821 of the second pattern region 82 is located on the x1 direction side of the center line LCx of the circuit board 61 in the x direction.
  • the center line LCx of the circuit board 61 in the x direction overlaps the pattern areas 81 to 83 in a plan view. Therefore, each of the first pattern region 81 and the second pattern region 82 is formed so as to straddle the center line LCx.
  • the pattern areas 81 to 83 partially overlap each other when viewed in the y direction.
  • the drive assisting portion 13, the mirror clamp portion 18, and the surge protecting portion 14 in the first component group are arranged close to each other and near the upper arm terminal connecting portion 70A. Further, the drive assisting portion 13, the mirror clamp portion 18, and the surge protection portion 14 are the same as the area in which the upper arm terminal connecting portion 70A is arranged, out of the four areas divided by the center line LCx and the center line LCy. It is located in.
  • the drive assisting portion 23, the mirror clamp portion 28, and the surge protecting portion 24 are arranged close to each other and near the lower arm terminal connecting portion 70B. Further, the drive assisting portion 23, the mirror clamp portion 28, and the surge protection portion 24 are the same as the area in which the lower arm terminal connecting portion 70B is arranged among the four areas divided by the center line LCx and the center line LCy. It is located in.
  • the transistor 181 and the bias capacitor 135 are adjacent to each other as shown in FIG.
  • the transistor 281 and the bias capacitor 235 are adjacent to each other as shown in FIG.
  • the drive assisting portion 13 and the drive assisting portion 23 are arranged in a point symmetry with respect to the connector CNT2 (joint area 834) in plan view.
  • the insulating transformer 111 and the insulating transformer 211, the control IC 122 and the control IC 222, and the mirror clamp portion 18 and the mirror clamp portion 28 are approximately point-symmetric with respect to the connector CNT2 (joint region 834). It is located in.
  • the joining region 834 of the present embodiment is a region where the connector CNT2 is joined.
  • control module CM2 The operational effects of the control module CM2 according to the second embodiment are as follows.
  • the upper arm terminal connection portion 70A is located in the x1 direction from the lower arm terminal connection portion 70B in plan view and is located closer to the lower arm terminal connection portion 70B than the lower arm terminal connection portion 70B. It is located in the y1 direction.
  • the first edge 811 of the first pattern area 81 is located in the x1 direction more than the first edge 821 of the second pattern area 82, and the second edge 812 of the first pattern area 81 is the second pattern.
  • the second end edge 822 of the area 82 is located in the x1 direction, and the third end edge 813 of the first pattern area 81 is located in the y1 direction of the third end edge 823 of the second pattern area 82.
  • the fourth edge 814 of the pattern region 81 is located in the y1 direction more than the fourth edge 824 of the second pattern region 82.
  • the joint region 834 for joining the connector CNT2 is located between the upper arm terminal connecting portion 70A and the lower arm terminal connecting portion 70B in each of the x direction and the y direction. Therefore, also in the control module CM2, similarly to the control module CM1, in plan view, the first component group that configures the upper arm drive circuit 10B and the second component group that configures the lower arm drive circuit 20B with reference to the connector CNT2. And can be arranged approximately symmetrically.
  • the distance difference between the wiring distance from the upper arm drive circuit 10B to the upper arm terminal connection portion 70A and the wiring distance from the lower arm drive circuit 20B to the lower arm terminal connection portion 70B can be reduced, so that the upper arm drive It is possible to suppress the bias of the wiring impedance between the circuit 10B and the lower arm drive circuit 20B.
  • the surge protection unit 14 is arranged closest to the upper arm terminal connection unit 70A in the first component group. Therefore, like the control module CM1, the control module CM2 can have a preferable component arrangement for protecting the switching element Q1 from the surge voltage.
  • the surge protection portion 24 is arranged closest to the lower arm terminal connection portion 70B. Therefore, similarly to the control module CM1, the control module CM2 can have a preferable component arrangement for protecting the switching element Q2 from the surge voltage.
  • the mirror clamp unit 18 is included.
  • the mirror clamp portion 18 is arranged near the upper arm terminal connection portion 70A. Specifically, only a part of the drive assisting portion 13 and the surge protection portion 14 are arranged between the mirror clamp portion 18 and the upper arm terminal connecting portion 70A. Further, the transistor 181 of the mirror clamp unit 18 and the bias capacitor 135 are arranged adjacent to each other. With this configuration, the current path (see the thick arrow in FIG. 16) when the transistor 181 is on can be shortened. The shorter the current path is, the more preferable it is for suppressing the malfunction of the switching element Q1 by the mirror clamp section 18. Therefore, the control module CM2 can have a preferable component arrangement for suppressing the malfunction of the switching element Q1.
  • the mirror clamp portion 28 is arranged near the lower arm terminal connection portion 70B. Specifically, only a part of the drive assisting portion 23 and the surge protection portion 24 are arranged between the mirror clamp portion 28 and the lower arm terminal connecting portion 70B.
  • the transistor 281 of the mirror clamp unit 28 and the bias capacitor 235 are arranged adjacent to each other. With this configuration, the current path (see the thick arrow in FIG. 17) when the transistor 281 is on can be shortened. The shorter the current path is, the more preferable it is for suppressing the malfunction of the switching element Q2 by the mirror clamp section 28. Therefore, the control module CM2 can have a preferable component arrangement for suppressing the malfunction of the switching element Q2.
  • control module CM2 uses the control ICs 122 and 222 in which the mirror clamp circuit is not incorporated, but the present invention is not limited to this, and the mirror clamp circuit is incorporated like the control module CM1.
  • the control ICs 121 and 221 may be used. In this case, the control module CM2 may not include the mirror clamp units 18 and 28.
  • the distance between the mirror clamp circuit and the switching element Q1 depends on the distance between the control IC 121 and the upper arm terminal connecting portion 70A. Therefore, in the control module CM2, the distance between the mirror clamp circuit (mirror clamp portion 18) and the switching element Q1 (upper arm terminal connection portion 70A) can be shortened by using the control IC 122 and the mirror clamp portion 18. It is preferable for suppressing malfunction of the switching element Q1.
  • the switching element Q1 is a SiC-MOSFET, the responsiveness of switching between on and off is high, so it is not possible to shorten the distance between the mirror clamp part 18 and the switching element Q1 (upper arm terminal connection part 70A). It is preferable for suppressing malfunction of the switching element Q1.
  • the distance between the mirror clamp circuit and the switching element Q2 depends on the distance between the control IC 221 and the lower arm terminal connecting portion 70B. Therefore, in the control module CM2, the distance between the mirror clamp circuit (mirror clamp portion 28) and the switching element Q2 (lower arm terminal connection portion 70B) can be shortened by using the control IC 222 and the mirror clamp portion 28. It is preferable for suppressing the malfunction of the switching element Q2.
  • the switching element Q2 is a SiC-MOSFET, the responsiveness of switching between ON and OFF is high, so it is not possible to shorten the distance between the mirror clamp section 28 and the switching element Q2 (lower arm terminal connecting section 70B). It is preferable for suppressing the malfunction of the switching element Q2.
  • a semiconductor device A3 according to the third embodiment of the present disclosure will be described with reference to FIGS. 25 to 27.
  • the semiconductor device A3 includes a power module PM and a control module CM3. Therefore, the semiconductor device A3 differs from the semiconductor device A1 in that the semiconductor device A3 includes the control module CM3 instead of the control module CM1.
  • the control module CM3 includes an upper arm drive circuit 10C, a lower arm drive circuit 20C and a common circuit 30C in its circuit configuration.
  • the configuration of the common circuit 30C is similar to that of the common circuit 30A.
  • the schematic diagram of the circuit configuration of the semiconductor device A3 is the same as the schematic diagram (see FIG. 1) of the circuit configuration of the semiconductor device A1.
  • FIG. 25 shows an example of the circuit configuration of the upper arm drive circuit 10C, showing an example of the circuit configuration in which the essential parts are extracted.
  • FIG. 26 shows an example of the circuit configuration of the lower arm drive circuit 20C, and shows an example of the circuit configuration in which essential parts are extracted. Parts of the upper arm drive circuit 10C and the lower arm drive circuit 20C not shown in FIGS. 25 and 26 are basically the same as those of the upper arm drive circuit 10A and the lower arm drive circuit 20A.
  • the control module CM3 differs from the control module CM1 in that it includes control ICs 122 and 222 instead of the control ICs 121 and 221. That is, the control module CM3 is equipped with the control ICs 122 and 222 (external mirror clamp drive type control IC), as in the control module CM2. Since the control module CM3 uses the control ICs 122 and 222, the upper arm drive circuit 10C is provided with the mirror clamp section 18 as shown in FIG. 25, and the lower arm drive circuit 20C is provided with the mirror clamp section 28 as shown in FIG. Contains.
  • the configurations of the mirror clamp parts 18 and 28 of the present embodiment are similar to those of the mirror clamp parts 18 and 28 in the control module CM2.
  • the control module CM3 includes a circuit board 62, a connector CNT1, and a plurality of electronic components in its device structure.
  • the connector CNT1 and the plurality of electronic components are mounted on the circuit board 62.
  • the multiple electronic components in the device structure of the control module CM3 include a first component group, a second component group, and a third component group.
  • the first component group is a set of electronic components that form the upper arm drive circuit 10C shown in FIG.
  • the second component group is a set of electronic components that configure the lower arm drive circuit 20C shown in FIG.
  • the third component group is a set of electronic components that form the common circuit 30C.
  • FIG. 27 is a plan view showing the device structure of the control module CM3.
  • FIG. 27 shows a component layout on the circuit board 62 in the control module CM3.
  • the circuit board 62 is different from the circuit board 60 in that the control ICs 122 and 222 are mounted instead of the control ICs 121 and 221 as shown in FIG. 27, and the mirror clamp portions 18 and 28 are mounted. The difference is that The other configuration of the circuit board 62 is similar to that of the circuit board 60.
  • the mirror clamp part 18 is arranged between the surge protection part 14 and the drive assisting part 13 in the y direction, and a plurality of the current limiting circuits 131 of the drive assisting part 13 in the x direction. Between the resistors (specifically, between the plurality of resistors that act when the switching element Q1 is on and the plurality of resistors that act when the switching element Q1 is off).
  • the mirror clamp unit 28 is arranged between the surge protection unit 24 and the drive assisting unit 23 in the y direction, and a plurality of the current limiting circuits 231 of the drive assisting unit 23 are disposed in the x direction. Between the resistors (specifically, between the plurality of resistors that act when the switching element Q2 is on and the plurality of resistors that act when the switching element Q2 is off).
  • control module CM3 The operational effects of the control module CM3 according to the third embodiment are as follows.
  • the upper arm terminal connecting portion 70A is located in the x1 direction from the lower arm terminal connecting portion 70B in a plan view, and is located further than the lower arm terminal connecting portion 70B. It is located in the y1 direction. Further, the first edge 811 of the first pattern area 81 is located in the x1 direction more than the first edge 821 of the second pattern area 82, and the second edge 812 of the first pattern area 81 is the second pattern. The second end edge 822 of the area 82 is located in the x1 direction, and the third end edge 813 of the first pattern area 81 is located in the y1 direction of the third end edge 823 of the second pattern area 82.
  • the fourth edge 814 of the pattern region 81 is located in the y1 direction more than the fourth edge 824 of the second pattern region 82.
  • the joining region 834 joining the connector CNT1 is located between the upper arm terminal connecting portion 70A and the lower arm terminal connecting portion 70B in each of the x direction and the y direction. Therefore, also in the control module CM3, similarly to the control module CM1, in plan view, the first component group forming the upper arm drive circuit 10C and the second component group forming the lower arm drive circuit 20C with reference to the connector CNT1. And can be arranged approximately symmetrically.
  • the distance difference between the wiring distance from the upper arm drive circuit 10C to the upper arm terminal connection portion 70A and the wiring distance from the lower arm drive circuit 20C to the lower arm terminal connection portion 70B can be reduced. It is possible to suppress the deviation of the wiring impedance between the circuit 10C and the lower arm drive circuit 20C.
  • the surge protection unit 14 is arranged closest to the upper arm terminal connection unit 70A in the first component group. Therefore, similarly to the control module CM1, the control module CM3 can have a preferable component arrangement for protecting the switching element Q1 from the surge voltage.
  • the surge protection portion 24 is arranged closest to the lower arm terminal connection portion 70B. Therefore, like the control module CM1, the control module CM3 can have a preferable component arrangement for protecting the switching element Q2 from the surge voltage.
  • the mirror clamp portion 18 is arranged closer to the upper arm terminal connection portion 70A than the control module CM2. Therefore, the control module CM3 can be arranged more favorably than the control module CM2 in suppressing malfunction of the switching element Q1.
  • the mirror clamp portion 28 is arranged closer to the lower arm terminal connection portion 70B than the control module CM2. Therefore, the control module CM3 can be arranged more favorably than the control module CM2 in suppressing malfunction of the switching element Q2.
  • a semiconductor device A4 according to the fourth embodiment of the present disclosure will be described with reference to FIGS. 28 to 31.
  • the semiconductor device A4 of the fourth embodiment includes a power module PM and a control module CM4.
  • the semiconductor device A4 is different from the semiconductor device A1 in that a control module CM4 is provided instead of the control module CM1.
  • the control module CM4 includes an upper arm drive circuit 10D, a lower arm drive circuit 20D and a common circuit 30D in its circuit configuration.
  • the common circuit 30D is the same as the common circuit 30A.
  • FIG. 28 shows an example of the circuit configuration of the upper arm drive circuit 10D.
  • the upper arm drive circuit 10D mainly differs from the upper arm drive circuit 10A (first embodiment) in the following points.
  • the drive assisting unit 13 does not include the transistors 132 and 133, and the functions of these transistors 132 and 133 are built in the control IC 121. That is, the drive assisting unit 13 does not have a pre-driver function, the control IC 121 has a built-in drive function, and the control IC 121 outputs a control signal to the switching element Q1. Further, the drive assisting portion 13 of the upper arm drive circuit 10D does not include the plurality of bias capacitors 134 and 135, and the current limiting circuit 131 does not include a diode. Further, the upper arm drive circuit 10D includes a mirror clamp unit 18 including a transistor 181 like the upper arm drive circuits 10B and 10C.
  • FIG. 29 shows an example of the circuit configuration of the lower arm drive circuit 20D.
  • the lower arm drive circuit 20D mainly differs from the lower arm drive circuit 20A (first embodiment) in the following points.
  • the drive assisting section 23 does not include the transistors 232 and 233, and the functions of these transistors 232 and 233 are built in the control IC 221. That is, the drive assisting unit 23 does not have a pre-driver function, the control IC 221 has a built-in drive function, and the control IC 221 outputs a control signal to the switching element Q2.
  • the drive assisting unit 23 of the lower arm drive circuit 20D does not include the plurality of bias capacitors 234 and 235, and the current limiting circuit 231 does not include a diode.
  • the lower arm drive circuit 20D includes a mirror clamp unit 28 including a transistor 281 like the lower arm drive circuits 20B and 20C.
  • the control module CM4 includes a circuit board 63, a plurality of electronic components, and a connector CNT1 in its device structure.
  • the plurality of electronic components and the connector CNT1 are mounted on the circuit board 63.
  • the plurality of electronic components in the device structure of the control module CM4 include a first component group, a second component group, and a third component group.
  • the first component group is a set of electronic components that form the upper arm drive circuit 10D shown in FIG.
  • the second component group is a set of electronic components that form the lower arm drive circuit 20D shown in FIG.
  • the third component group is a set of electronic components that form the common circuit 30D.
  • FIG. 30 and 31 are plan views showing the device structure of the control module CM4.
  • FIG. 30 shows a component layout on the circuit board 63.
  • FIG. 31 shows a wiring layout on the circuit board 63.
  • a plurality of electronic components and the connector CNT1 are shown by imaginary lines (broken lines).
  • the surge protection portion 14 of the first component group is arranged closest to the upper arm terminal connection portion 70A.
  • the drive assisting portion 13 and the gate driver portion 12 are arranged in the y direction with the surge protection portion 14 in between and the upper arm terminal connecting portion 70A.
  • the drive assisting portion 13 is located between the upper arm terminal connecting portion 70A and the gate driver portion 12. Therefore, the upper arm terminal connecting portion 70A, the drive assisting portion 13, and the gate driver portion 12 are arranged in this order in the y direction.
  • the mirror clamp unit 18 operates in the x direction with a plurality of resistors of the current limiting circuit 131 of the drive assisting unit 13 (a plurality of resistors that act when the switching element Q1 is on and a plurality of resistors that act when the switching element Q1 is off. It is sandwiched between multiple resistors).
  • the mirror clamp portion 18 is located near the upper arm terminal connection portion 70A.
  • the surge protection unit 24 is arranged closest to the lower arm terminal connection unit 70B in the second component group.
  • the drive assisting portion 23 and the gate driver portion 22 are arranged in the y direction with the surge protection portion 24 in between and the lower arm terminal connecting portion 70B.
  • the drive assisting portion 23 is located between the lower arm terminal connecting portion 70B and the gate driver portion 22. Therefore, the lower arm terminal connection portion 70B, the drive assisting portion 23, and the gate driver portion 22 are arranged in this order in the y direction.
  • the mirror clamp unit 28 applies to a plurality of resistors of the current limiting circuit 231 of the drive assisting unit 23 in the x direction (a plurality of resistors that act when the switching element Q2 is on, and a plurality of resistors when the switching element Q2 is off). Sandwiched between multiple working resistors).
  • the mirror clamp portion 28 is located near the lower arm terminal connection portion 70B.
  • the surge protector 14 and the surge protector 24 are arranged in a substantially point symmetrical manner with respect to the connector CNT1.
  • the drive assisting portion 13 and the drive assisting portion 23, the mirror clamp portion 18 and the mirror clamp portion 28, and the gate driver portion 12 and the gate driver portion 22 are substantially the same with respect to the connector CNT1. They are arranged symmetrically.
  • the circuit board 63 is a multilayer board.
  • the circuit board 63 includes a plurality of wiring layers that are laminated via insulating layers.
  • the circuit board 63 has a first pattern area 81, a second pattern area 82, a third pattern area 83, a first insulating area 91, a second insulating area 92, and Each arrangement of the third insulating regions 93 is different. Due to this difference in arrangement, the arrangement of the plurality of electronic components is appropriately changed.
  • the first pattern region 81, the second pattern region 82, the third pattern region 83, the first insulating region 91, the second insulating region 92, and the third insulating region 93 are formed across a plurality of wiring layers. .
  • the first edge 811 of the first pattern area 81 is located on the x1 direction side of the first edge 821 of the second pattern area 82.
  • the second edge 812 of the first pattern area 81 is located on the x1 direction side of the second edge 822 of the second pattern area 82.
  • the third edge 813 of the first pattern region 81 is located on the y1 direction side of the third edge 823 of the second pattern region 82.
  • the fourth edge 814 of the first pattern region 81 is located at substantially the same position as the fourth edge 824 of the second pattern region 82 in the y direction. The positional relationship between the two fourth end edges 814 and 824 is different from that of each of the control modules CM1 to CM3 according to the first to third embodiments.
  • the first insulating region 91 is connected from the first edge 60a on the y1 direction side to the first edge 60a on the y2 direction side.
  • the second insulating region 92 is connected from the second end edge 60b on the x2 direction side to the first end edge 60a on the y2 direction side.
  • control module CM4 The operational effects of the control module CM4 according to the fourth embodiment are as follows.
  • the upper arm terminal connecting portion 70A is located in the x1 direction from the lower arm terminal connecting portion 70B in the plan view, and is located in the y1 direction from the lower arm terminal connecting portion 70B. Is located in. Further, the first edge 811 of the first pattern area 81 is located in the x1 direction more than the first edge 821 of the second pattern area 82, and the second edge 812 of the first pattern area 81 is the second pattern. The second end edge 822 of the region 82 is located in the x1 direction, and the third end edge 813 of the first pattern region 81 is located in the y1 direction of the third end edge 823 of the second pattern region 82.
  • the joining region 834 joining the connector CNT1 is located between the upper arm terminal connecting portion 70A and the lower arm terminal connecting portion 70B in each of the x direction and the y direction.
  • the first component group that configures the upper arm drive circuit 10D and the second component group that configures the lower arm drive circuit 20D are approximately based on the connector CNT1. It becomes possible to arrange symmetrically.
  • the control module CM4 is preferable in controlling the power module PM.
  • the surge protection unit 14 is arranged closest to the upper arm terminal connection unit 70A in the first component group.
  • the control module CM4 like the control module CM1
  • the surge protection unit 24 is arranged closest to the lower arm terminal connection unit 70B in the second component group.
  • the control module CM4 like the control module CM1
  • the upper arm terminal connecting portion 70A, the drive assisting portion 13 and the gate driver portion 12 are arranged in this order in the y direction.
  • the current path from the gate driver section 12 to the upper arm terminal connecting section 70A through the drive assisting section 13 can be shortened. That is, the transmission time of the control signal from the output from the gate driver unit 12 to the input to the control signal terminal (gate terminal) of the switching element Q1 via the upper arm terminal connection unit 70A can be shortened. Thereby, the operation delay of the switching element Q1 can be suppressed.
  • the lower arm terminal connecting portion 70B, the drive assisting portion 23, and the gate driver portion 22 are arranged in this order in the y direction.
  • the current path from the gate driver section 22 to the lower arm terminal connection section 70B through the drive assisting section 23 can be shortened. That is, the transmission time of the control signal from the gate driver unit 22 to the control signal terminal (gate terminal) of the switching element Q2 via the lower arm terminal connection unit 70B can be shortened. Thereby, the operation delay of the switching element Q2 can be suppressed.
  • the mirror clamp portion 18 is arranged near the upper arm terminal connection portion 70A. Specifically, the surge protection unit 14 is only arranged between the mirror clamp unit 18 and the upper arm terminal connection unit 70A. According to this configuration, the current path when the transistor 181 is on is short, so that the component arrangement is preferable for suppressing the malfunction of the switching element Q1.
  • the mirror clamp portion 28 is arranged near the lower arm terminal connection portion 70B. Specifically, the surge protection unit 24 is only arranged between the mirror clamp unit 28 and the lower arm terminal connection unit 70B. According to this configuration, the current path when the transistor 281 is on is short, so that the component arrangement is preferable for suppressing the malfunction of the switching element Q2.
  • the first insulating region 91 is connected from the first edge 60a on the y1 direction side to the first edge 60a on the y2 direction side.
  • the gate driver unit 12 is adjacent to the current limiting circuit 131.
  • the control IC 121 of the gate driver unit 12 is arranged so as to overlap the first insulating region 91 in a plan view. Therefore, as in the first embodiment, when the first insulating region 91 is connected from the first edge 60a on the y1 direction side to the second edge 60b on the x1 direction side, the third insulating region 93 causes The pattern area 81 may be small. Therefore, by connecting the first insulating region 91 from the first edge 60a on the y1 direction side to the first edge 60a on the y2 direction side, the control module CM4 suppresses the first pattern region 81 from becoming small. it can.
  • control module CM4 uses the control ICs 122 and 222 in which the mirror clamp circuit is not incorporated, but the present invention is not limited to this, and the mirror clamp circuit is incorporated like the control module CM1.
  • the control ICs 121 and 221 may be used. In this case, the control module CM4 may not include the mirror clamp units 18 and 28.
  • a semiconductor device A5 according to the fifth embodiment of the present disclosure will be described with reference to FIGS. 32 and 33.
  • the semiconductor device A5 of the fifth embodiment includes a power module PM and a control module CM5.
  • the semiconductor device A5 is different from the semiconductor device A4 in that a control module CM5 is provided instead of the control module CM4.
  • the control module CM5 includes an upper arm drive circuit 10E, a lower arm drive circuit 20E and a common circuit 30E in its circuit configuration.
  • the circuit configurations of the upper arm drive circuit 10E, the lower arm drive circuit 20E, and the common circuit 30E are the same as the upper arm drive circuit 10D (see FIG. 28), the lower arm drive circuit 20D (see FIG. 29), and the common circuit 30D.
  • the circuit configurations of the upper arm drive circuit 10E, the lower arm drive circuit 20E, and the common circuit 30E are the same as the upper arm drive circuit 10D (see FIG. 28), the lower arm drive circuit 20D (see FIG. 29), and the common circuit 30D.
  • the common circuit 30D are the same as
  • the control module CM5 includes a circuit board 64, a plurality of electronic components, and a connector CNT1 in its device structure.
  • the plurality of electronic components and the connector CNT1 are mounted on the circuit board 64.
  • the plurality of electronic components in the control module CM5 include a first component group, a second component group, and a third component group.
  • the first component group is a set of electronic components that form the upper arm drive circuit 10E.
  • the second component group is a set of electronic components that form the lower arm drive circuit 20E.
  • the third component group is a set of electronic components that form the common circuit 30E.
  • FIG. 32 and 33 are plan views showing the device structure of the control module CM5.
  • FIG. 32 shows a component layout on the circuit board 64.
  • FIG. 33 shows a wiring layout on the circuit board 64.
  • the plurality of electronic components and the connector CNT1 are shown by imaginary lines (broken lines).
  • control module CM5 As shown in FIG. 32, the gate driver units 12 and 22, the drive assisting units 13 and 23, the surge protection units 14 and 24, and the mirror clamp units 18 and 28 are the same as the control module CM4 (see FIG. 30). It is arranged similarly.
  • the circuit board 64 is a multilayer board.
  • the circuit board 64 includes a plurality of wiring layers that are stacked with insulating layers interposed therebetween.
  • the circuit board 64 is different from the circuit board 63 in the arrangement and shape of the second pattern region 82, the third pattern region 83, and the second insulating region 92, as shown in FIG. 33. Due to this difference in arrangement, the arrangement of the plurality of electronic components is appropriately changed.
  • the arrangement and shape of the first pattern region 81 and the first insulating region 91 are substantially the same as those of the control module CM4.
  • the first edge 811 of the first pattern area 81 is located on the x1 direction side of the first edge 821 of the second pattern area 82.
  • the second edge 812 of the first pattern area 81 is located on the x1 direction side of the second edge 822 of the second pattern area 82.
  • the third edge 813 of the first pattern area 81 is substantially the same position as the third edge 823 of the second pattern area 82 in the y direction.
  • the fourth edge 814 of the first pattern area 81 is substantially the same position as the fourth edge 824 of the second pattern area 82 in the y direction.
  • the first insulating region 91 is connected from the first edge 60a on the y1 direction side to the first edge 60a on the y2 direction side.
  • the second insulating region 92 is also connected from the first edge 60a on the y1 direction side to the first edge 60a on the y2 direction side.
  • control module CM5 according to the fifth embodiment can achieve the same effects as the control module CM4.
  • control module and the semiconductor device according to the present disclosure are not limited to the above embodiments.
  • the specific configuration of each part of the control module and the semiconductor device of the present disclosure can be variously changed in design.
  • control module and the semiconductor device include embodiments related to the following supplementary notes.
  • Appendix 1 A control module for controlling the operation of the first switching element and the second switching element, Multiple electronic components, A connector to which the operating power of the control module and an input signal are input, A circuit board on which the plurality of electronic components and the connector are mounted, The circuit board includes a first pattern area in which a first wiring pattern is formed, a second pattern area in which a second wiring pattern is formed, a third pattern area in which a third wiring pattern is formed, and the first pattern area.
  • the first pattern region, the second pattern region, and the third pattern region are separated from each other when viewed in the thickness direction of the circuit board,
  • the first connection portion is located on one side of the second direction in a first direction orthogonal to the thickness direction, and when viewed in the thickness direction, Located on one side of a second direction that is orthogonal to both the thickness direction and the first direction than the second connection portion,
  • Each of the first pattern region and the second pattern region, when viewed in the thickness direction has a first edge on one side in the first direction and a second edge on the other side in the first direction, A third end edge on one side in the second direction and a fourth end edge on the other side in the second direction are included,
  • a first edge of the first pattern region is located on one side in the first direction with respect to a first edge of the second pattern region, The second edge of the first
  • Appendix 2 The control module according to Appendix 1, wherein the fourth edge of the first pattern region is located on one side in the second direction with respect to the fourth edge of the second pattern region.
  • Appendix 3 The first connecting portion overlaps the first pattern region when viewed in the thickness direction, and is closer to the second end edge of the first pattern region in the first direction when viewed in the thickness direction. Placed in The second connecting portion overlaps the second pattern region when viewed in the thickness direction, and is closer to the first end edge of the second pattern region in the first direction when viewed in the thickness direction.
  • the control module according to appendix 1 or 2 which is disposed at.
  • the first connecting portion is arranged closer to the third edge of the first pattern region in the second direction when viewed in the thickness direction, The control module according to Appendix 3, wherein the second connection portion is arranged near the fourth end edge of the second pattern region in the second direction when viewed in the thickness direction.
  • the circuit board has a pair of board edges separated from each other in the second direction and extending in the first direction when viewed in the thickness direction, The first connecting portion is arranged along the substrate edge located on one side in the second direction, The control module according to appendix 4, wherein the second connection portion is arranged along the substrate edge located on the other side in the second direction.
  • the circuit board has a rectangular shape when viewed in the thickness direction, The control module according to appendix 5, wherein the bonding region overlaps with an intersection of diagonal lines of the circuit board when viewed in the thickness direction.
  • the circuit board extends in the first direction when viewed in the thickness direction, The control module according to appendix 6, wherein the bonding region has a rectangular shape extending in the second direction when viewed in the thickness direction.
  • the circuit board extends in the first direction when viewed in the thickness direction,
  • the third pattern region has a first portion disposed on the other side in the second direction with respect to the fourth edge of the first pattern region, and the second portion with respect to the third edge of the second pattern region. 10.
  • [Appendix 11] The control module according to appendix 10, wherein the bonding region overlaps the third portion when viewed in the thickness direction.
  • the circuit board has a first insulating region that insulates the first pattern region and the third pattern region when viewed in the thickness direction, and the second pattern region and the second insulating region when viewed in the thickness direction. 16.
  • the control module according to any one of appendices 1 to 15, including a second insulating region that insulates the third pattern region.
  • the plurality of electronic components include a first component group that controls the operation of the first switching element and a second component group that controls the operation of the second switching element, A part of the first component group is connected to the first wiring pattern, The control module according to appendix 16, wherein a part of the second component group is connected to the second wiring pattern.
  • the first component group includes a first control IC
  • the second component group includes a second control IC
  • the first control IC overlaps the first pattern region, the third pattern region, and the first insulating region when viewed in the thickness direction
  • the control module according to appendix 17, wherein the second control IC overlaps the second pattern region, the third pattern region, and the second insulating region when viewed in the thickness direction.
  • the first component group includes a first isolation transformer
  • the second component group includes a second isolation transformer, The first insulating transformer overlaps the first pattern region, the third pattern region, and the first insulating region when viewed in the thickness direction, 19.
  • the circuit board has a plurality of wiring layers that are laminated via insulating layers to each other, The first insulating region and the second insulating region are respectively formed in each of the plurality of wiring layers, The first insulating regions formed in each of the plurality of wiring layers overlap each other when viewed in the thickness direction, 20.
  • the first switching element and the second switching element are connected in series with the first switching element serving as an upper arm and the second switching element serving as a lower arm.
  • Control module A control module according to any one of appendices 1 to 21;
  • a semiconductor device comprising: a power module having the first switching element and the second switching element.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Inverter Devices (AREA)
  • Power Conversion In General (AREA)
  • Rectifiers (AREA)
  • Dc-Dc Converters (AREA)
PCT/JP2019/037175 2018-10-15 2019-09-24 制御モジュールおよび半導体装置 WO2020080043A1 (ja)

Priority Applications (3)

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DE212019000114.9U DE212019000114U1 (de) 2018-10-15 2019-09-24 Steuermodul und Halbleitervorrichtung
CN201980067476.8A CN112840547B (zh) 2018-10-15 2019-09-24 控制模块以及半导体装置
JP2020552989A JP7413273B2 (ja) 2018-10-15 2019-09-24 制御モジュールおよび半導体装置

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JP2019161239 2019-09-04
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010088195A (ja) * 2008-09-30 2010-04-15 Hitachi Automotive Systems Ltd 電力変換装置
JP2015029403A (ja) * 2013-07-05 2015-02-12 パナソニックＩｐマネジメント株式会社 半導体装置
JP2016082110A (ja) * 2014-10-20 2016-05-16 ローム株式会社 ゲートドライバユニットおよびパワーモジュール
JP2017208912A (ja) * 2016-05-17 2017-11-24 アイシン・エィ・ダブリュ株式会社 インバータ制御基板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4857017B2 (ja) * 2006-04-27 2012-01-18 日立オートモティブシステムズ株式会社 電力変換装置
JP2017108521A (ja) 2015-12-09 2017-06-15 株式会社Ｓｏｋｅｎ 電力変換装置
JP6544222B2 (ja) * 2015-12-11 2019-07-17 住友電気工業株式会社 半導体モジュール及び半導体モジュールユニット

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010088195A (ja) * 2008-09-30 2010-04-15 Hitachi Automotive Systems Ltd 電力変換装置
JP2015029403A (ja) * 2013-07-05 2015-02-12 パナソニックＩｐマネジメント株式会社 半導体装置
JP2016082110A (ja) * 2014-10-20 2016-05-16 ローム株式会社 ゲートドライバユニットおよびパワーモジュール
JP2017208912A (ja) * 2016-05-17 2017-11-24 アイシン・エィ・ダブリュ株式会社 インバータ制御基板

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DE212019000114U1 (de) 2020-04-21
CN112840547B (zh) 2023-08-22

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