JP7409493B2 - 信号伝送線路及び信号伝送線路の製造方法 - Google Patents

信号伝送線路及び信号伝送線路の製造方法 Download PDF

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Publication number
JP7409493B2
JP7409493B2 JP2022521774A JP2022521774A JP7409493B2 JP 7409493 B2 JP7409493 B2 JP 7409493B2 JP 2022521774 A JP2022521774 A JP 2022521774A JP 2022521774 A JP2022521774 A JP 2022521774A JP 7409493 B2 JP7409493 B2 JP 7409493B2
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Prior art keywords
laminate
conductor layer
transmission line
signal transmission
signal
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Japanese (ja)
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JPWO2021229991A1 (https=
JPWO2021229991A5 (https=
Inventor
雄史 添田
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/081Microstriplines
    • H01P3/082Multilayer dielectric
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/085Triplate lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/088Stacked transmission lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
  • Insulated Conductors (AREA)
JP2022521774A 2020-05-12 2021-04-14 信号伝送線路及び信号伝送線路の製造方法 Active JP7409493B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020083980 2020-05-12
JP2020083980 2020-05-12
PCT/JP2021/015484 WO2021229991A1 (ja) 2020-05-12 2021-04-14 信号伝送線路及び信号伝送線路の製造方法

Publications (3)

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JPWO2021229991A1 JPWO2021229991A1 (https=) 2021-11-18
JPWO2021229991A5 JPWO2021229991A5 (https=) 2023-01-10
JP7409493B2 true JP7409493B2 (ja) 2024-01-09

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JP2022521774A Active JP7409493B2 (ja) 2020-05-12 2021-04-14 信号伝送線路及び信号伝送線路の製造方法

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US (1) US12272856B2 (https=)
JP (1) JP7409493B2 (https=)
CN (1) CN219107749U (https=)
WO (1) WO2021229991A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007201263A (ja) 2006-01-27 2007-08-09 Alps Electric Co Ltd フレキシブル基板の取付構造
WO2013094471A1 (ja) 2011-12-22 2013-06-27 株式会社村田製作所 高周波信号線路及び電子機器
JP5741781B1 (ja) 2013-08-02 2015-07-01 株式会社村田製作所 高周波信号伝送線路及び電子機器
JP2016164882A (ja) 2016-03-22 2016-09-08 株式会社村田製作所 積層型多芯ケーブル
JP2016201370A (ja) 2012-08-09 2016-12-01 株式会社村田製作所 高周波信号伝送線路及び電子機器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53127170U (https=) * 1977-03-18 1978-10-09
JPS62269401A (ja) 1986-05-16 1987-11-21 Mitsubishi Electric Corp サスペンデツド線路
JPH1098315A (ja) * 1996-07-15 1998-04-14 Matsushita Electric Ind Co Ltd 誘電体積層デバイス、その製造方法及び移動体通信装置
EP0820115B1 (en) 1996-07-15 2004-05-12 Matsushita Electric Industrial Co., Ltd. Dielectric laminated device and its manufacturing method
JP2000201008A (ja) 1999-01-05 2000-07-18 Alps Electric Co Ltd マイクロストリップライン
JP6285638B2 (ja) * 2013-04-25 2018-02-28 日本メクトロン株式会社 プリント配線板およびプリント配線板製造方法
US9583836B2 (en) * 2013-11-12 2017-02-28 Murata Manufacturing Co., Ltd. High-frequency transmission line and antenna device
JP5811306B1 (ja) * 2013-12-12 2015-11-11 株式会社村田製作所 信号伝送部品および電子機器
JP2015139051A (ja) 2014-01-21 2015-07-30 日立金属株式会社 アンテナ装置
CN208608339U (zh) 2016-01-27 2019-03-15 株式会社村田制作所 信号传输线路
WO2020130010A1 (ja) * 2018-12-20 2020-06-25 株式会社村田製作所 伝送線路部材

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007201263A (ja) 2006-01-27 2007-08-09 Alps Electric Co Ltd フレキシブル基板の取付構造
WO2013094471A1 (ja) 2011-12-22 2013-06-27 株式会社村田製作所 高周波信号線路及び電子機器
JP2016201370A (ja) 2012-08-09 2016-12-01 株式会社村田製作所 高周波信号伝送線路及び電子機器
JP5741781B1 (ja) 2013-08-02 2015-07-01 株式会社村田製作所 高周波信号伝送線路及び電子機器
JP2016164882A (ja) 2016-03-22 2016-09-08 株式会社村田製作所 積層型多芯ケーブル

Also Published As

Publication number Publication date
JPWO2021229991A1 (https=) 2021-11-18
US12272856B2 (en) 2025-04-08
CN219107749U (zh) 2023-05-30
US20230038684A1 (en) 2023-02-09
WO2021229991A1 (ja) 2021-11-18

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