JP7398623B2 - レーザ加工ヘッド及びこれを備えたレーザ加工システム - Google Patents

レーザ加工ヘッド及びこれを備えたレーザ加工システム Download PDF

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Publication number
JP7398623B2
JP7398623B2 JP2023510928A JP2023510928A JP7398623B2 JP 7398623 B2 JP7398623 B2 JP 7398623B2 JP 2023510928 A JP2023510928 A JP 2023510928A JP 2023510928 A JP2023510928 A JP 2023510928A JP 7398623 B2 JP7398623 B2 JP 7398623B2
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Japan
Prior art keywords
laser beam
laser
light
laser processing
processing head
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JP2023510928A
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English (en)
Japanese (ja)
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JPWO2022209930A5 (https=
JPWO2022209930A1 (https=
Inventor
恒之 大口
渉 高橋
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2023510928A 2021-04-02 2022-03-17 レーザ加工ヘッド及びこれを備えたレーザ加工システム Active JP7398623B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021063722 2021-04-02
JP2021063722 2021-04-02
PCT/JP2022/012128 WO2022209930A1 (ja) 2021-04-02 2022-03-17 レーザ加工ヘッド及びこれを備えたレーザ加工システム

Publications (3)

Publication Number Publication Date
JPWO2022209930A1 JPWO2022209930A1 (https=) 2022-10-06
JPWO2022209930A5 JPWO2022209930A5 (https=) 2023-10-20
JP7398623B2 true JP7398623B2 (ja) 2023-12-15

Family

ID=83459110

Family Applications (1)

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JP2023510928A Active JP7398623B2 (ja) 2021-04-02 2022-03-17 レーザ加工ヘッド及びこれを備えたレーザ加工システム

Country Status (5)

Country Link
US (1) US20230415260A1 (https=)
EP (1) EP4316725B1 (https=)
JP (1) JP7398623B2 (https=)
CN (1) CN117120207A (https=)
WO (1) WO2022209930A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117047261B (zh) * 2023-09-04 2025-06-27 深圳公大激光有限公司 一种环形斑激光加工系统
CN119927483A (zh) * 2024-04-24 2025-05-06 深圳市创客工场科技有限公司 激光加工设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018097018A1 (ja) 2016-11-22 2018-05-31 パナソニックＩｐマネジメント株式会社 レーザ加工装置及びレーザ加工方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10296468A (ja) * 1997-04-24 1998-11-10 Nikon Corp レーザ加工装置
JP2001018086A (ja) * 1999-07-01 2001-01-23 Nec Corp レーザ加工装置および方法
JP2001196665A (ja) * 2000-01-13 2001-07-19 Hamamatsu Kagaku Gijutsu Kenkyu Shinkokai 二波長レーザ加工光学装置およびレーザ加工方法
JP5033693B2 (ja) 2008-03-25 2012-09-26 株式会社アマダ ファイバレーザ加工機における集光直径の変換制御方法及びその装置
WO2012173008A1 (ja) * 2011-06-15 2012-12-20 株式会社日本製鋼所 レーザ処理装置およびレーザ処理方法
JP5802109B2 (ja) * 2011-10-26 2015-10-28 浜松ホトニクス株式会社 光変調制御方法、制御プログラム、制御装置、及びレーザ光照射装置
JP5909463B2 (ja) 2013-05-27 2016-04-26 京楽産業．株式会社 遊技機
EP3051811A4 (en) * 2013-09-26 2017-03-22 Nikon Corporation Image pickup element and image pickup device
JP6515999B2 (ja) * 2015-03-30 2019-05-22 株式会社ニコン 撮像素子および撮像装置
JP6659617B2 (ja) * 2017-04-12 2020-03-04 株式会社デンソー 光検出器
DE102018128266A1 (de) * 2018-11-12 2020-05-14 Eos Gmbh Electro Optical Systems Verfahren und Vorrichtung zum Bestrahlen eines Materials mit einem Energiestrahl
DE102019109795B4 (de) * 2019-04-12 2023-11-30 Precitec Gmbh & Co. Kg Vorrichtung und Verfahren zum Bestimmen einer Fokuslage sowie zugehöriger Laserbearbeitungskopf
JP2020199517A (ja) * 2019-06-07 2020-12-17 ファナック株式会社 レーザ加工システム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018097018A1 (ja) 2016-11-22 2018-05-31 パナソニックＩｐマネジメント株式会社 レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
EP4316725A1 (en) 2024-02-07
US20230415260A1 (en) 2023-12-28
EP4316725B1 (en) 2025-07-30
EP4316725A4 (en) 2024-10-23
JPWO2022209930A1 (https=) 2022-10-06
WO2022209930A1 (ja) 2022-10-06
CN117120207A (zh) 2023-11-24

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