JP7390808B2 - シリコン基板エッチング溶液 - Google Patents

シリコン基板エッチング溶液 Download PDF

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Publication number
JP7390808B2
JP7390808B2 JP2019116521A JP2019116521A JP7390808B2 JP 7390808 B2 JP7390808 B2 JP 7390808B2 JP 2019116521 A JP2019116521 A JP 2019116521A JP 2019116521 A JP2019116521 A JP 2019116521A JP 7390808 B2 JP7390808 B2 JP 7390808B2
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JP
Japan
Prior art keywords
silicon
silicon substrate
etching solution
substrate etching
etching
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Active
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JP2019116521A
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English (en)
Japanese (ja)
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JP2020004965A (ja
Inventor
ユ・ホソン
ムン・ヨンスン
イ・ジュンウン
チャン・ピョンファ
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OCI Holdings Co Ltd
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OCI Co Ltd
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Publication of JP2020004965A publication Critical patent/JP2020004965A/ja
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Publication of JP7390808B2 publication Critical patent/JP7390808B2/ja
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • C09K13/04Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • C09K13/04Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
JP2019116521A 2018-06-28 2019-06-24 シリコン基板エッチング溶液 Active JP7390808B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180074581A KR102460326B1 (ko) 2018-06-28 2018-06-28 실리콘 기판 식각 용액
KR10-2018-0074581 2018-06-28

Publications (2)

Publication Number Publication Date
JP2020004965A JP2020004965A (ja) 2020-01-09
JP7390808B2 true JP7390808B2 (ja) 2023-12-04

Family

ID=69028751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019116521A Active JP7390808B2 (ja) 2018-06-28 2019-06-24 シリコン基板エッチング溶液

Country Status (3)

Country Link
JP (1) JP7390808B2 (ko)
KR (1) KR102460326B1 (ko)
CN (1) CN110655924B (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006249160A (ja) 2005-03-09 2006-09-21 Konishi Kagaku Ind Co Ltd スルホン化ポリオルガノシルセスキオキサン及びその製造方法
JP2013128109A (ja) 2011-12-16 2013-06-27 Sk Hynix Inc エッチング組成物及びこれを利用した半導体素子の製造方法
WO2017095022A1 (ko) 2015-12-04 2017-06-08 솔브레인 주식회사 식각용 조성물 및 이를 이용한 반도체 소자의 제조방법
US20170321121A1 (en) 2016-05-04 2017-11-09 Oci Company Ltd. Etching solution capable of suppressing particle appearance

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3989666A (en) * 1974-12-02 1976-11-02 Dow Corning Corporation Crosslinker-platinum catalyst-inhibitor and method of preparation thereof
US7169323B2 (en) * 2002-11-08 2007-01-30 3M Innovative Properties Company Fluorinated surfactants for buffered acid etch solutions
KR101320416B1 (ko) * 2011-12-29 2013-10-22 솔브레인 주식회사 식각액 조성물 및 이를 이용한 습식 식각방법
US9868902B2 (en) * 2014-07-17 2018-01-16 Soulbrain Co., Ltd. Composition for etching
KR101539373B1 (ko) * 2014-07-17 2015-07-27 솔브레인 주식회사 식각용 조성물 및 이를 이용한 반도체 소자의 제조방법
KR20160010267A (ko) * 2014-07-17 2016-01-27 솔브레인 주식회사 식각용 조성물 및 이를 이용한 반도체 소자의 제조방법
US9976037B2 (en) * 2015-04-01 2018-05-22 Versum Materials Us, Llc Composition for treating surface of substrate, method and device
KR101728951B1 (ko) * 2015-06-25 2017-04-21 오씨아이 주식회사 실리콘 질화막 식각 용액
KR101733289B1 (ko) * 2015-06-26 2017-05-08 오씨아이 주식회사 실리콘 질화막 식각 용액
KR102545802B1 (ko) * 2015-12-04 2023-06-21 솔브레인 주식회사 식각용 조성물 및 이를 이용한 반도체 소자의 제조방법
KR102079043B1 (ko) * 2016-05-27 2020-02-20 오씨아이 주식회사 실리콘 질화막 식각 용액

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006249160A (ja) 2005-03-09 2006-09-21 Konishi Kagaku Ind Co Ltd スルホン化ポリオルガノシルセスキオキサン及びその製造方法
JP2013128109A (ja) 2011-12-16 2013-06-27 Sk Hynix Inc エッチング組成物及びこれを利用した半導体素子の製造方法
WO2017095022A1 (ko) 2015-12-04 2017-06-08 솔브레인 주식회사 식각용 조성물 및 이를 이용한 반도체 소자의 제조방법
US20170321121A1 (en) 2016-05-04 2017-11-09 Oci Company Ltd. Etching solution capable of suppressing particle appearance

Also Published As

Publication number Publication date
CN110655924A (zh) 2020-01-07
KR102460326B1 (ko) 2022-10-31
KR20200001731A (ko) 2020-01-07
CN110655924B (zh) 2022-11-04
JP2020004965A (ja) 2020-01-09

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