JP7389166B2 - 基板搬送装置及びこれを備える基板処理装置 - Google Patents
基板搬送装置及びこれを備える基板処理装置 Download PDFInfo
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- JP7389166B2 JP7389166B2 JP2022063434A JP2022063434A JP7389166B2 JP 7389166 B2 JP7389166 B2 JP 7389166B2 JP 2022063434 A JP2022063434 A JP 2022063434A JP 2022063434 A JP2022063434 A JP 2022063434A JP 7389166 B2 JP7389166 B2 JP 7389166B2
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- 239000000758 substrate Substances 0.000 title claims description 313
- 238000012545 processing Methods 0.000 title claims description 18
- 239000012636 effector Substances 0.000 claims description 323
- 230000005856 abnormality Effects 0.000 claims description 34
- 238000007665 sagging Methods 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 33
- 230000032258 transport Effects 0.000 claims description 29
- 238000012546 transfer Methods 0.000 claims description 24
- 230000003028 elevating effect Effects 0.000 claims description 18
- 230000002159 abnormal effect Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 230000002452 interceptive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/021—Optical sensing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Multi-Process Working Machines And Systems (AREA)
Description
20:直進光
50:基板収納部材
100:基板搬送装置
110:エンドエフェクター
110a:エンドエフェクターの下部面
120:エンドエフェクターハンド
130:水平移動部
131:支持プレート
140:垂れ下がり感知部
141:発光部
141a:光源
142:受光部
142a:受光面
143:光量測定部
144:位置調整部
150:間隔調節部
160:回転駆動部
170:昇降部
171:昇降軸
180:基板感知部
181:送信器
182:受信器
200:基板処理装置
210:基板ボート
220:工程チューブ
r:回転軸
p:エンドエフェクター同士の間隔
g:直進光の離間距離
Claims (12)
- 第1の方向に延び、基板が支持されるエンドエフェクターと、
前記エンドエフェクターの前記第1の方向の一方の側が連結されるエンドエフェクターハンドと、
前記エンドエフェクターハンドに連結され、前記エンドエフェクターを前記第1の方向に移動させる水平移動部と、
前記エンドエフェクターの移動経路の両側にそれぞれ配置される発光部及び受光部を有し、前記エンドエフェクターの垂れ下がりを感知する垂れ下がり感知部と、
を備え、
前記垂れ下がり感知部は、前記発光部と前記受光部のうちの少なくともどちらか一方の位置を調整する位置調整部をさらに備える基板搬送装置。 - 前記エンドエフェクターは、複数から構成されて多段に配置され、
前記発光部は、複数の前記エンドエフェクターに対応する複数の光源を備える請求項1に記載の基板搬送装置。 - 前記エンドエフェクターハンドと連結され、前記複数の前記エンドエフェクター同士の間隔を調節する間隔調節部をさらに備える請求項2に記載の基板搬送装置。
- 前記垂れ下がり感知部は、
前記受光部に受光される光量を測定する光量測定部と、
測定された光量をもって前記複数の前記エンドエフェクター同士の間隔異常を判断する異常判断部をさらに備える請求項2に記載の基板搬送装置。 - 前記水平移動部は、前記第1の方向に延びて前記エンドエフェクターハンドの走行による前記エンドエフェクターの移動経路を与える支持プレートを備え、
前記発光部と前記受光部は、前記支持プレートの前記第1の方向と交わる第2の方向両側にそれぞれ支持される請求項1に記載の基板搬送装置。 - 前記支持プレートと連結されて、回転軸を中心として前記支持プレートを回転させる回転駆動部をさらに備える請求項5に記載の基板搬送装置。
- 前記支持プレートの前記第1の方向の一方の側に配設される昇降軸を備え、前記昇降軸に沿って前記回転駆動部を昇降させる昇降部をさらに備え、
前記回転軸は、前記昇降軸から前記第1の方向の他方の側へ離間される請求項6に記載の基板搬送装置。 - 前記発光部と前記受光部は、前記支持プレートの中央部ないし前記第1の方向の一方の側と対向する他方の側に配置される請求項5に記載の基板搬送装置。
- 前記垂れ下がり感知部は、前記発光部の照射角度を調整する照射角調整部をさらに備える請求項1に記載の基板搬送装置。
- 前記発光部は、水平状態の前記エンドエフェクターの下部面からの最短距離が前記エンドエフェクターの厚さの20%以上である直進光を照射する請求項1に記載の基板搬送装置。
- 請求項1~10のうちのいずれか一項に記載の基板搬送装置と、
前記エンドエフェクターに支持された前記基板が受け渡されて多段に積載される基板ボートと、
前記基板ボートが収容される内部空間を有する工程チューブと、
を備える基板処理装置。 - 前記基板搬送装置は、複数枚の前記基板が収容された基板収納部材と前記基板ボートとの間において前記基板収納部材と前記基板ボートとの間に前記基板を運ぶ請求項11に記載の基板処理装置。
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KR1020210047251A KR102563297B1 (ko) | 2021-04-12 | 2021-04-12 | 기판이송장치 및 이를 포함하는 기판 처리장치 |
KR10-2021-0047251 | 2021-04-12 |
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JP2022162541A JP2022162541A (ja) | 2022-10-24 |
JP7389166B2 true JP7389166B2 (ja) | 2023-11-29 |
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US (1) | US20220328340A1 (ja) |
JP (1) | JP7389166B2 (ja) |
KR (1) | KR102563297B1 (ja) |
CN (1) | CN115206855A (ja) |
TW (1) | TWI807764B (ja) |
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US20230113673A1 (en) * | 2021-10-12 | 2023-04-13 | Applied Materials, Inc. | Factory interface robots usable with integrated load locks |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008235841A (ja) | 2007-03-23 | 2008-10-02 | Tokyo Electron Ltd | 基板移載装置及び基板移載方法並びに記憶媒体 |
JP2015167250A (ja) | 2009-03-13 | 2015-09-24 | 川崎重工業株式会社 | エンドエフェクタを備えたロボット及びその運転方法 |
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JP3172900B2 (ja) * | 1993-02-19 | 2001-06-04 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理装置及び基板搬送方法及び基板処理方法 |
KR100315007B1 (ko) * | 1995-11-22 | 2002-02-28 | 이시다 아키라 | 카세트내의 기판 검출 및 반송장치와 그 방법 |
WO1999038207A1 (fr) * | 1998-01-27 | 1999-07-29 | Nikon Corporation | Procede et appareil de detection de tranche |
JP4276440B2 (ja) * | 2003-01-06 | 2009-06-10 | 東京エレクトロン株式会社 | 基板検出方法及び装置並びに基板処理装置 |
JP2004296484A (ja) * | 2003-03-25 | 2004-10-21 | Hitachi Kokusai Electric Inc | 基板処理装置 |
CN101888959B (zh) * | 2007-12-05 | 2013-07-03 | 平田机工株式会社 | 基板输送装置及基板输送装置的控制方法 |
JP5715904B2 (ja) * | 2011-07-29 | 2015-05-13 | 東京エレクトロン株式会社 | 熱処理装置、及びこれに基板を搬送する基板搬送方法 |
JP2017085015A (ja) * | 2015-10-29 | 2017-05-18 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体製造装置 |
JP2020184575A (ja) | 2019-05-08 | 2020-11-12 | 三星電子株式会社Samsung Electronics Co.,Ltd. | ロボット用ハンド、ウェハ搬送用ロボット及びウェハ搬送装置 |
TWM610289U (zh) * | 2020-11-06 | 2021-04-11 | 三和技研股份有限公司 | 控制複數承接件間距之機械手臂 |
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- 2022-04-08 US US17/717,026 patent/US20220328340A1/en active Pending
- 2022-04-11 CN CN202210371652.0A patent/CN115206855A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2008235841A (ja) | 2007-03-23 | 2008-10-02 | Tokyo Electron Ltd | 基板移載装置及び基板移載方法並びに記憶媒体 |
JP2015167250A (ja) | 2009-03-13 | 2015-09-24 | 川崎重工業株式会社 | エンドエフェクタを備えたロボット及びその運転方法 |
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TW202240751A (zh) | 2022-10-16 |
KR20220141111A (ko) | 2022-10-19 |
US20220328340A1 (en) | 2022-10-13 |
JP2022162541A (ja) | 2022-10-24 |
TWI807764B (zh) | 2023-07-01 |
CN115206855A (zh) | 2022-10-18 |
KR102563297B1 (ko) | 2023-08-03 |
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