JP7382554B2 - レーザ加工装置及びそれを用いたレーザ加工方法 - Google Patents

レーザ加工装置及びそれを用いたレーザ加工方法 Download PDF

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Publication number
JP7382554B2
JP7382554B2 JP2021522718A JP2021522718A JP7382554B2 JP 7382554 B2 JP7382554 B2 JP 7382554B2 JP 2021522718 A JP2021522718 A JP 2021522718A JP 2021522718 A JP2021522718 A JP 2021522718A JP 7382554 B2 JP7382554 B2 JP 7382554B2
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Japan
Prior art keywords
laser
laser beam
laser processing
processing apparatus
optical
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JP2021522718A
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English (en)
Japanese (ja)
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JPWO2020241138A1 (https=
Inventor
静波 王
正敏 西尾
憲三 柴田
学 西原
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0071—Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2383—Parallel arrangements
    • H01S3/2391—Parallel arrangements emitting at different wavelengths

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2021522718A 2019-05-29 2020-04-24 レーザ加工装置及びそれを用いたレーザ加工方法 Active JP7382554B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019100185 2019-05-29
JP2019100185 2019-05-29
PCT/JP2020/017622 WO2020241138A1 (ja) 2019-05-29 2020-04-24 レーザ加工装置及びそれを用いたレーザ加工方法

Publications (2)

Publication Number Publication Date
JPWO2020241138A1 JPWO2020241138A1 (https=) 2020-12-03
JP7382554B2 true JP7382554B2 (ja) 2023-11-17

Family

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JP2021522718A Active JP7382554B2 (ja) 2019-05-29 2020-04-24 レーザ加工装置及びそれを用いたレーザ加工方法

Country Status (4)

Country Link
US (1) US12263541B2 (https=)
EP (1) EP3978183B1 (https=)
JP (1) JP7382554B2 (https=)
WO (1) WO2020241138A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7382552B2 (ja) * 2019-05-29 2023-11-17 パナソニックＩｐマネジメント株式会社 レーザ加工装置及びそれを用いたレーザ加工方法
DE102019215968A1 (de) * 2019-10-17 2021-04-22 Trumpf Laser- Und Systemtechnik Gmbh Laserschweißverfahren für Eckverbindungen von Werkstückteilen
DE102021115036A1 (de) 2021-06-10 2022-12-15 Precitec Gmbh & Co. Kg Verfahren zur Laserbearbeitung eines Werkstücks und dazugehöriges Laserbearbeitungssystem
JPWO2023149458A1 (https=) * 2022-02-02 2023-08-10
EP4501526A4 (en) * 2022-08-10 2025-07-09 Yamazaki Mazak Corp LASER DRILLING PROCESS AND LASER MACHINE
JP2024090047A (ja) * 2022-12-22 2024-07-04 フリッツ オアプケ バウシュトフグロースハンドルング ゲゼルシャフト ミット ベシュレンクター ハフトゥング レーザ溶接装置
DE102023134096A1 (de) 2023-12-06 2025-06-12 TRUMPF Laser- und Systemtechnik SE Lasereinrichtung und Verfahren zum Bearbeiten mindestens eines Werkstücks mittels mindestens eines Laserstrahls

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2777138B2 (ja) 1988-03-16 1998-07-16 株式会社ニデック 医用レーザ装置３
JP2002224867A (ja) 2001-02-01 2002-08-13 National Institute For Materials Science レーザ溶接方法
JP2005313195A (ja) 2004-04-28 2005-11-10 Miyachi Technos Corp 二波長重畳型レーザ出射ユニット及びレーザ加工装置
JP2011253866A (ja) 2010-06-01 2011-12-15 Disco Abrasive Syst Ltd 分割方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857385U (ja) * 1981-10-16 1983-04-18 株式会社東芝 レ−ザ照射装置
JPS58159514A (ja) * 1982-03-18 1983-09-21 Toshiba Corp レ−ザビ−ム空間分布形成方法
JPS5942502A (ja) * 1982-08-31 1984-03-09 Matsushita Electric Ind Co Ltd 赤外光導光路
JPS6384786A (ja) * 1986-09-26 1988-04-15 Toshiba Corp レ−ザマ−キング装置
JPH07301724A (ja) 1994-05-09 1995-11-14 Nippon Sheet Glass Co Ltd 入射位置調整機構付き光ビーム入射装置
JPH08150485A (ja) * 1994-11-28 1996-06-11 Komatsu Ltd レーザマーキング装置
JPH10314973A (ja) 1997-03-12 1998-12-02 Kawasaki Heavy Ind Ltd 複合レーザビームによるレーザ加工装置および加工法
JP3421633B2 (ja) * 2000-04-11 2003-06-30 ファナック株式会社 レーザ加工装置
US6900410B2 (en) 2001-02-01 2005-05-31 National Institute For Materials Science Laser welding processed
DE102010003750A1 (de) * 2010-04-08 2011-10-13 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Anordnung zum Verändern der Strahlprofilcharakteristik eines Laserstrahls mittels einer Mehrfachclad-Faser
JP2013055111A (ja) 2011-09-01 2013-03-21 Phoeton Corp レーザ光合成装置、レーザアニール装置およびレーザアニール方法
US10906129B2 (en) 2015-05-26 2021-02-02 Ipg Photonics Corporation Multibeam laser system and methods for welding
US11179802B2 (en) * 2016-07-14 2021-11-23 Mitsubishi Electric Corporation Laser machining head and laser machining apparatus
US10224691B2 (en) 2016-12-02 2019-03-05 TeraDiode, Inc. Laser systems utilizing fiber bundles for power delivery and beam switching
PL3553575T3 (pl) 2016-12-12 2022-05-30 Panasonic Intellectual Property Management Co., Ltd. Urządzenie sprzęgające światłowody
DE102018204814B4 (de) * 2018-03-29 2025-03-06 TRUMPF Werkzeugmaschinen SE + Co. KG Vorrichtung und Verfahren zum Erzeugen von Laserstrahlungen mit unterschiedlicher Leistung und Brillanz

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2777138B2 (ja) 1988-03-16 1998-07-16 株式会社ニデック 医用レーザ装置３
JP2002224867A (ja) 2001-02-01 2002-08-13 National Institute For Materials Science レーザ溶接方法
JP2005313195A (ja) 2004-04-28 2005-11-10 Miyachi Technos Corp 二波長重畳型レーザ出射ユニット及びレーザ加工装置
JP2011253866A (ja) 2010-06-01 2011-12-15 Disco Abrasive Syst Ltd 分割方法

Also Published As

Publication number Publication date
EP3978183B1 (en) 2024-03-06
US20220072662A1 (en) 2022-03-10
US12263541B2 (en) 2025-04-01
JPWO2020241138A1 (https=) 2020-12-03
WO2020241138A1 (ja) 2020-12-03
EP3978183A1 (en) 2022-04-06
EP3978183A4 (en) 2022-08-24

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