JP7375108B2 - スタック型ssd半導体デバイス - Google Patents
スタック型ssd半導体デバイス Download PDFInfo
- Publication number
- JP7375108B2 JP7375108B2 JP2022083475A JP2022083475A JP7375108B2 JP 7375108 B2 JP7375108 B2 JP 7375108B2 JP 2022083475 A JP2022083475 A JP 2022083475A JP 2022083475 A JP2022083475 A JP 2022083475A JP 7375108 B2 JP7375108 B2 JP 7375108B2
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- Prior art keywords
- solid state
- state drive
- semiconductor
- enclosure
- chip carrier
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H05K1/00—Printed circuits
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- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H—ELECTRICITY
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
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Description
Claims (17)
- ソリッドステートドライブであって、
チップキャリア媒体と、
前記チップキャリア媒体に実装された1つ以上の半導体メモリダイと、
第1の表面及び第2の表面を有する半導体コントローラダイであって、前記半導体コントローラダイの前記第1の表面は、前記チップキャリア媒体に実装されている、半導体コントローラダイと、
第3の表面及び第4の表面を有するヒートスプレッダブロックであって、前記ヒートスプレッダブロックの前記第3の表面は、前記半導体コントローラダイの前記第2の表面上に実装されており、前記ヒートスプレッダブロックは、前記半導体コントローラダイから熱を除去するように構成されている、ヒートスプレッダブロックと、
少なくとも前記1つ以上の半導体メモリダイ及び前記半導体コントローラダイの周りのエンクロージャであって、前記ヒートスプレッダブロックの前記第4の表面は、前記エンクロージャの表面で露出している、エンクロージャと、
前記エンクロージャの表面上の、前記ヒートスプレッダブロックの前記第4の表面と接触している熱伝導性フィルムであって、前記エンクロージャの前記表面上の前記熱伝導性フィルムは、前記ヒートスプレッダブロックから熱を除去するように構成されている、熱伝導性フィルムと、を備え、
前記熱伝導性フィルムは、電磁干渉に対して前記ソリッドステートドライブを遮蔽するために導電性でもある、ソリッドステートドライブ。 - 前記チップキャリア媒体は、基板である、請求項1に記載のソリッドステートドライブ。
- 前記チップキャリア媒体は、プリント回路基板である、請求項1に記載のソリッドステートドライブ。
- 前記1つ以上の半導体メモリダイ及び前記半導体コントローラダイは、前記プリント回路基板の表面に直接的に実装されている、請求項3に記載のソリッドステートドライブ。
- プリント回路基板を更に備え、前記チップキャリア媒体は、基板であり、前記1つ以上の半導体メモリダイ及び前記半導体コントローラダイは、前記基板の第1の表面に直接的に実装されており、前記基板の前記第1の表面に対向する前記基板の第2の表面は、前記プリント回路基板に直接的に実装されている、請求項1に記載のソリッドステートドライブ。
- 前記1つ以上の半導体メモリダイは、互いにスタックされている、請求項5に記載のソリッドステートドライブ。
- 前記エンクロージャの前記表面は、平面表面を含み、前記ヒートスプレッダブロックの前記第4の表面は、前記平面表面に形成された凹部内に存在し、前記熱伝導性フィルムは、前記ヒートスプレッダブロックの前記第4の表面に対して、前記凹部内に存在する、請求項1に記載のソリッドステートドライブ。
- 前記エンクロージャは、前記エンクロージャの前記表面から角度付きで延在する側面を更に含み、前記熱伝導性フィルムは、前記側面のうちの1つ以上に更に提供される、請求項1に記載のソリッドステートドライブ。
- 前記チップキャリア媒体は、第1の表面及び第2の表面を含み、
前記1つ以上の半導体メモリダイは、前記チップキャリア媒体の前記第1の表面に実装された1つ以上の半導体メモリダイの第1の群を含み、
前記半導体コントローラダイは、前記チップキャリア媒体の前記第1の表面に実装された第1の半導体コントローラダイを含み、
前記エンクロージャは、前記チップキャリア媒体の前記第1の表面に固着された第1のエンクロージャを含み、
前記ソリッドステートドライブは、
前記チップキャリア媒体の前記第2の表面に実装された1つ以上の半導体メモリダイの第2の群と、
前記チップキャリア媒体の前記第2の表面に実装された第2の半導体コントローラダイと、
前記チップキャリア媒体の前記第2の表面に取り付けられた第2のエンクロージャであって、前記第2のエンクロージャは、少なくとも前記1つ以上の半導体メモリダイの第2の群及び前記第2の半導体コントローラダイを包囲する、第2のエンクロージャと、を更に備える、請求項1に記載のソリッドステートドライブ。 - 前記チップキャリア媒体は、第1の表面及び第2の表面を含み、
前記1つ以上の半導体メモリダイは、前記チップキャリア媒体の前記第1の表面に実装された1つ以上の半導体メモリダイの第1の群を含み、
前記半導体コントローラダイは、前記チップキャリア媒体の前記第1の表面に実装された第1の半導体コントローラダイを含み、
前記エンクロージャは、前記チップキャリア媒体の前記第1の表面に固着された第1のエンクロージャを含み、
前記ソリッドステートドライブは、
前記チップキャリア媒体の前記第1の表面に実装された1つ以上の半導体メモリダイの第2の群と、
前記チップキャリア媒体の前記第1の表面に実装された第2の半導体コントローラダイと、
前記チップキャリア媒体の前記第1の表面に取り付けられた第2のエンクロージャであって、前記第2のエンクロージャは、少なくとも前記1つ以上の半導体メモリダイの第2の群及び前記第2の半導体コントローラダイを包囲する、第2のエンクロージャと、を更に備える、請求項1に記載のソリッドステートドライブ。 - 前記チップキャリア媒体は、接触フィンガを含み、前記ソリッドステートドライブは、メモリカードとして構成されている、請求項1に記載のソリッドステートドライブ。
- 前記チップキャリア媒体は、はんだボールを含み、前記ソリッドステートドライブは、USBデバイス及びエッジコネクタカードのうちの1つとして構成されている、請求項1に記載のソリッドステートドライブ。
- ソリッドステートドライブであって、
エッジコネクタプリント回路基板であって、前記エッジコネクタプリント回路基板は、エッジコネクタソケット内で嵌合するように構成されたエッジコネクタを含む、エッジコネクタプリント回路基板と、
前記エッジコネクタプリント回路基板に直接的に表面実装された1つ以上の半導体メモリダイと、
前記エッジコネクタプリント回路基板に直接的に表面実装された半導体コントローラダイであって、前記半導体コントローラダイは、第1の表面及び第2の表面を含み、前記半導体コントローラダイの前記第1の表面は、前記エッジコネクタプリント回路基板に直接的に実装されている、半導体コントローラダイと、
前記エッジコネクタプリント回路基板に固着され、前記1つ以上の半導体メモリダイ及び前記半導体コントローラダイを包囲するエンクロージャと、
第3の表面及び第4の表面を有するヒートスプレッダブロックであって、前記ヒートスプレッダブロックの前記第3の表面は、前記半導体コントローラダイの前記第2の表面上に実装されており、前記ヒートスプレッダブロックは、前記半導体コントローラダイから熱を除去するように構成されており、前記ヒートスプレッダブロックの前記第4の表面は、前記エンクロージャの表面で露出している、ヒートスプレッダブロックと、
前記エンクロージャの表面上の、前記ヒートスプレッダブロックの前記第4の表面と接触している熱伝導性フィルムであって、前記エンクロージャの前記表面上の前記熱伝導性フィルムは、前記ヒートスプレッダブロックから熱を除去するように構成されている、熱伝導性フィルムと、を備え、
前記熱伝導性フィルムは、電磁干渉に対して前記ソリッドステートドライブを遮蔽するために導電性でもある、ソリッドステートドライブ。 - 前記エンクロージャの前記表面は、平面表面を含み、前記ヒートスプレッダブロックの前記第4の表面は、前記平面表面に形成された凹部内に存在し、前記熱伝導性フィルムは、前記ヒートスプレッダブロックの前記第4の表面に対して、前記凹部内に存在する、請求項13に記載のソリッドステートドライブ。
- 前記エッジコネクタプリント回路基板は、第1の表面と、前記第1の表面に対向する第2の表面と、を含み、前記1つ以上の半導体メモリダイ及び前記半導体コントローラダイは、前記エッジコネクタプリント回路基板の前記第1の表面に実装されており、前記ソリッドステートドライブは、前記エッジコネクタプリント回路基板の前記第2の表面上に露出した試験パッドを更に備え、前記試験パッドは、前記ソリッドステートドライブの動作を試験するために試験ピンを受容するように構成されている、請求項13に記載のソリッドステートドライブ。
- 前記1つ以上の半導体メモリダイは、1つ以上のフラッシュメモリダイ及びランダムアクセスメモリダイを含む、請求項13に記載のソリッドステートドライブ。
- ソリッドステートドライブであって、
チップキャリア媒体と、
前記チップキャリア媒体に実装された1つ以上の半導体メモリダイと、
第1の表面及び第2の表面を有する半導体コントローラダイであって、前記半導体コントローラダイの前記第1の表面は、前記チップキャリア媒体に実装されている、半導体コントローラダイと、
前記半導体コントローラダイから熱を逃すためのブロック手段と、
少なくとも前記1つ以上の半導体メモリダイ、前記半導体コントローラダイ、及び前記ブロック手段の少なくとも一部の周りのエンクロージャと、
前記エンクロージャの少なくとも一部の周りの、前記ブロック手段と連通しているフィルム手段であって、前記フィルム手段は、前記ブロック手段から前記ソリッドステートドライブを取り囲む環境に熱を逃すためのものである、フィルム手段と、を備え、
前記フィルム手段は、電磁干渉に対して前記ソリッドステートドライブを遮蔽するために導電性でもある、ソリッドステートドライブ。
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