JP7374910B2 - 結合mems共振器 - Google Patents
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- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
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- H03H2009/02488—Vibration modes
- H03H2009/02496—Horizontal, i.e. parallel to the substrate plane
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- H—ELECTRICITY
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- H03H9/24—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
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- H03H9/2447—Beam resonators
- H03H9/2452—Free-free beam resonators
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- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
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- H03H9/2405—Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
- H03H9/2447—Beam resonators
- H03H9/2463—Clamped-clamped beam resonators
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/462—Microelectro-mechanical filters
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- Microelectronics & Electronic Packaging (AREA)
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- Analytical Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
次に、本発明の実施形態、およびそれらの利点を、添付の図面を参照してより詳細に説明する。
〔選択された実施形態の説明〕
Claims (21)
- ・ 支持構造と、
・ 前記支持構造に懸架された共振器要素と、
・ 前記共振器要素を共振モードで励起するアクチュエータと、を備え、
・ 前記共振器要素は、幅方向に隣接する複数のビーム形状の部分要素を備え、前記部分要素の各々は、長さと、幅と、1より大きい長さ対幅アスペクト比を有し、前記部分要素の長さ方向に、面内長さ伸張共振モードで共振するように構成され、
・ 前記共振器要素を集団共振モードで励起するために、前記部分要素の各々は、長さ方向におけるその両端で、前記部分要素の前記面内長さ伸張共振モードの非節点に結合された1つ以上の接続要素によって少なくとも1つの他の部分要素に結合される、
微小電子機械共振器であって、前記共振器要素は、前記共振器要素の幅方向における両側面において、前記部分要素の前記共振モードの節点から前記支持構造に懸架される、微小電子機械共振器。 - 前記部分要素の少なくとも2つは、当該部分要素の幅方向に互いに結合され、
前記接続要素は、前記部分要素の間にあり当該部分要素の長さ方向に延在する細長いトレンチに接する、少なくとも2つの基本的に剛性の接続要素を含む、請求項1に記載の微小電子機械共振器。 - 前記部分要素の少なくとも2つは、2より大きい長さ対幅アスペクト比を有し、次数が2以上のオーバートーン共振モードで共振するように構成される、請求項1または2に記載の微小電子機械共振器。
- 次数が2以上のオーバートーン共振モードで共振するように構成された前記部分要素は、長さ方向で前記接続要素によって画定される複数の細長いトレンチによって、当該部分要素の幅方向に離間され、前記トレンチの数は、前記部分要素が共振するように構成されたオーバートーンモードの次数と同じまたはそれより大きい、請求項3に記載の微小電子機械共振器。
- 前記部分要素の少なくとも2つは、前記部分要素間の隙間にまたがる可撓性接続要素によって、当該部分要素の長さ方向に互いに結合される、請求項1から4のいずれかに記載の微小電子機械共振器。
- 前記部分要素の各々は矩形形状を有し、前記部分要素はそれらの幅および/または長さ方向に互いに離れて配置され、前記接続要素によって離間される、請求項1から5のいずれかに記載の微小電子機械共振器。
- 前記接続要素は、前記部分要素と共に、単一のドープされたシリコン結晶体で形成された受動素子である、請求項1から6のいずれかに記載の微小電子機械共振器。
- 前記アクチュエータは、前記共振器要素上に形成された圧電体の層からなる、請求項1から7のいずれかに記載の微小電子機械共振器。
- 少なくとも3、例えば3から50の前記部分要素を備える、請求項1から8のいずれかに記載の微小電子機械共振器。
- 幅方向に結合された少なくとも2つの部分要素と、長さ方向に結合された少なくとも2つの部分要素とを備える、請求項1から9のいずれかに記載の微小電子機械共振器。
- 前記部分要素はそれぞれN以上の長さ対幅アスペクト比を有し、ここで前記Nは前記部分要素の共振モードの次数である、請求項1から10のいずれかに記載の微小電子機械共振器。
- 前記共振器要素の全体は、1未満の有効長さ対幅アスペクト比を有する、請求項1から11のいずれかに記載の微小電子機械共振器。
- 前記共振器要素のすべての部分要素は、実質的に同じ幅および/または実質的に同じ長さを有する、請求項1から12のいずれかに記載の微小電子機械共振器。
- 前記部分要素の少なくともいくつかは異なる長さを有し、異なるオーバートーン共振モードで集団で共振するように構成される、請求項1から13のいずれかに記載の微小電子機械共振器。
- 前記部分要素の少なくとも2つは、3より大きい、具体的には5より大きい長さ対幅アスペクト比を有し、次数が3以上、具体的には5以上のオーバートーン共振モードで共振するように構成される、請求項1から14のいずれかに記載の微小電子機械共振器。
- 前記共振器要素は、少なくとも2×1019cm-3、例えば少なくとも1020cm-3の平均不純物濃度でドープされたシリコン体を備える、請求項1から15のいずれかに記載の微小電子機械共振器。
- 前記共振器要素は、[100]結晶方向が前記共振器要素の長さ方向に沿って配向されているか、前記長さ方向から25度未満、具体的には15度未満ずれているシリコン結晶体を含む、請求項1から16のいずれかに記載の微小電子機械共振器。
- 前記共振器要素は、2つの部分要素間の前記支持構造に、前記部分要素の前記共振モードの節点から、好ましくは前記共振器要素の幅方向と長さ方向の両方において対称に懸架される、請求項1から17のいずれかに記載の微小電子機械共振器。
- ・ 前記部分要素の少なくともいくつかは、1より大きい長さ対幅アスペクト比を有し、幅寸法に垂直な長さ寸法に沿って互いに接している、1つ以上の基本要素により形成され、前記基本要素はそれぞれ基本共振モードに対応し、前記基本共振モードは合わさって前記部分要素の集団共振モードとなり、さらに前記共振器要素全体の集団共振モードとなり、
・ 前記基本要素は矩形配列構成で配置され、各基本要素が単一の配列位置を使用する、
請求項1から18のいずれかに記載の微小電子機械共振器。 - 前記配列構成の少なくとも1つの配列位置が前記基本要素に使用されていない、請求項19に記載の微小電子機械共振器。
- 各配列位置は1つの基本要素が使用する、請求項19に記載の微小電子機械共振器。
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FI20185112A FI128208B (en) | 2018-02-08 | 2018-02-08 | Connected MEMS resonator |
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PCT/FI2019/050086 WO2019155119A1 (en) | 2018-02-08 | 2019-02-06 | Coupled mems resonator |
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FI128436B (en) * | 2018-02-08 | 2020-05-15 | Tikitin Oy | MEMS resonator |
FI20195302A1 (en) | 2019-04-12 | 2020-10-13 | Tikitin Oy | MEMS RESONATOR |
WO2023102349A1 (en) * | 2021-11-30 | 2023-06-08 | The University Of Chicago | Inter-frequency parametric coupling and energy transfer of mechanical motion |
FI130337B (en) * | 2021-12-23 | 2023-06-27 | Kyocera Tikitin Oy | MEMS RESONATOR |
US20230264946A1 (en) * | 2022-02-21 | 2023-08-24 | Stathera Ip Holdings Inc. | Ultra-High Frequency MEMS Resonators with First and Second Order Temperature-Induced Frequency Drift Compensation |
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FI20185112A1 (en) | 2019-08-09 |
EP3750243A1 (en) | 2020-12-16 |
US20220060171A1 (en) | 2022-02-24 |
FI128208B (en) | 2019-12-31 |
EP3750243A4 (en) | 2021-11-10 |
US11196402B2 (en) | 2021-12-07 |
WO2019155119A1 (en) | 2019-08-15 |
CN111727562A (zh) | 2020-09-29 |
JP2021513243A (ja) | 2021-05-20 |
KR20200118467A (ko) | 2020-10-15 |
JP2023182831A (ja) | 2023-12-26 |
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US20200304093A1 (en) | 2020-09-24 |
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