JP7362431B2 - 成膜装置、ターゲットユニットの取り外し方法、及びターゲットユニットの取り付け方法 - Google Patents

成膜装置、ターゲットユニットの取り外し方法、及びターゲットユニットの取り付け方法 Download PDF

Info

Publication number
JP7362431B2
JP7362431B2 JP2019199222A JP2019199222A JP7362431B2 JP 7362431 B2 JP7362431 B2 JP 7362431B2 JP 2019199222 A JP2019199222 A JP 2019199222A JP 2019199222 A JP2019199222 A JP 2019199222A JP 7362431 B2 JP7362431 B2 JP 7362431B2
Authority
JP
Japan
Prior art keywords
unit
target
support shaft
magnetic force
target unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019199222A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021070852A (ja
Inventor
行生 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Tokki Corp
Original Assignee
Canon Tokki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Tokki Corp filed Critical Canon Tokki Corp
Priority to JP2019199222A priority Critical patent/JP7362431B2/ja
Priority to KR1020200140477A priority patent/KR20210052301A/ko
Priority to CN202011190180.6A priority patent/CN112746252B/zh
Publication of JP2021070852A publication Critical patent/JP2021070852A/ja
Application granted granted Critical
Publication of JP7362431B2 publication Critical patent/JP7362431B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
JP2019199222A 2019-10-31 2019-10-31 成膜装置、ターゲットユニットの取り外し方法、及びターゲットユニットの取り付け方法 Active JP7362431B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019199222A JP7362431B2 (ja) 2019-10-31 2019-10-31 成膜装置、ターゲットユニットの取り外し方法、及びターゲットユニットの取り付け方法
KR1020200140477A KR20210052301A (ko) 2019-10-31 2020-10-27 성막 장치, 타겟 유닛의 분리 방법, 및 타겟 유닛의 부착 방법
CN202011190180.6A CN112746252B (zh) 2019-10-31 2020-10-30 成膜装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019199222A JP7362431B2 (ja) 2019-10-31 2019-10-31 成膜装置、ターゲットユニットの取り外し方法、及びターゲットユニットの取り付け方法

Publications (2)

Publication Number Publication Date
JP2021070852A JP2021070852A (ja) 2021-05-06
JP7362431B2 true JP7362431B2 (ja) 2023-10-17

Family

ID=75648845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019199222A Active JP7362431B2 (ja) 2019-10-31 2019-10-31 成膜装置、ターゲットユニットの取り外し方法、及びターゲットユニットの取り付け方法

Country Status (3)

Country Link
JP (1) JP7362431B2 (ko)
KR (1) KR20210052301A (ko)
CN (1) CN112746252B (ko)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018131644A (ja) 2017-02-13 2018-08-23 株式会社アルバック スパッタリング装置用の回転式カソードユニット

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050224343A1 (en) * 2004-04-08 2005-10-13 Richard Newcomb Power coupling for high-power sputtering
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
DE102008033902B4 (de) * 2008-07-18 2012-01-19 Von Ardenne Anlagentechnik Gmbh Endblock für eine Magnetronanordnung mit einem rotierenden Target und Vakuumbeschichtungsanlage
US8182662B2 (en) * 2009-03-27 2012-05-22 Sputtering Components, Inc. Rotary cathode for magnetron sputtering apparatus
JP2014058698A (ja) * 2010-12-15 2014-04-03 Canon Anelva Corp スパッタリング装置
KR101441481B1 (ko) * 2012-09-11 2014-09-17 주식회사 에스에프에이 회전형 캐소드 및 이를 구비한 스퍼터 장치
JP6469432B2 (ja) 2014-12-09 2019-02-13 株式会社アルバック ロータリーカソード、および、スパッタ装置
JP6469434B2 (ja) * 2014-12-11 2019-02-13 株式会社アルバック ロータリーカソード、および、スパッタ装置
JP6580113B2 (ja) * 2017-12-05 2019-09-25 キヤノントッキ株式会社 スパッタ装置及びその制御方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018131644A (ja) 2017-02-13 2018-08-23 株式会社アルバック スパッタリング装置用の回転式カソードユニット

Also Published As

Publication number Publication date
KR20210052301A (ko) 2021-05-10
JP2021070852A (ja) 2021-05-06
CN112746252B (zh) 2023-08-11
CN112746252A (zh) 2021-05-04

Similar Documents

Publication Publication Date Title
KR102404213B1 (ko) 스퍼터 장치 및 그 제어 방법
EP0596269B1 (en) Ferrofluidic seal centering ring
KR102354877B1 (ko) 스퍼터 장치 및 그 사용 방법
KR20160124201A (ko) 레이디얼 마그네틱 커플링을 갖는 회전 장치
WO2016136121A1 (ja) マグネトロンスパッタリング装置用の回転式カソードユニット
JP7362431B2 (ja) 成膜装置、ターゲットユニットの取り外し方法、及びターゲットユニットの取り付け方法
WO2010115189A1 (en) Rotary magnetron
CN107533966B (zh) 带静压密封件的马达
JP2008125272A (ja) 発電機
JP2007303316A (ja) モータポンプ
JP2017002348A (ja) スパッタリング装置用の回転式カソードユニット
CN109778127B (zh) 溅射装置
JP5701683B2 (ja) 軸封装置
JP2020026794A (ja) 真空ポンプを製造するための方法
CN116057200B (zh) 旋转式阴极单元用驱动块
JP2000150986A (ja) エキシマレーザ装置
KR200263603Y1 (ko) 산업기계의동력제어장치
JP2023008195A (ja) 発電システム
JP2010058254A (ja) 工作機械用の回転テーブル装置におけるシール機構
CN116372801A (zh) 一种承载组件和化学机械抛光系统
JP2010223383A (ja) ロータリージョイント
JP2006109657A (ja) モータシステム
JPH10304603A (ja) 気密分離型駆動装置
JP2003269622A (ja) 磁性流体シール装置
KR20080070883A (ko) 고속 회전체의 회전자 구조

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221013

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20230427

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230509

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230630

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230926

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231004

R150 Certificate of patent or registration of utility model

Ref document number: 7362431

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150