JP7361533B2 - 表示装置 - Google Patents
表示装置 Download PDFInfo
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- JP7361533B2 JP7361533B2 JP2019152845A JP2019152845A JP7361533B2 JP 7361533 B2 JP7361533 B2 JP 7361533B2 JP 2019152845 A JP2019152845 A JP 2019152845A JP 2019152845 A JP2019152845 A JP 2019152845A JP 7361533 B2 JP7361533 B2 JP 7361533B2
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 10
- 229910052733 gallium Inorganic materials 0.000 description 10
- 229910052738 indium Inorganic materials 0.000 description 10
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 10
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 5
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
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- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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Images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Description
図1および図2を用いて、本発明の一実施形態に係る表示装置について説明する。
図1は、本発明の一実施形態に係る表示装置10の概略断面図である。
図2Aおよび図2Bを用いて、光学調整層136の構成について説明する。
図5を用いて、本実施形態に係る表示装置10の光学調整層136の変形例について説明する。
図6を用いて、本実施形態に係る表示装置10の光学調整層136の変形例について説明する。
図7を用いて、本実施形態に係る表示装置10の光学調整層136の変形例について説明する。
図8~図10を用いて、本発明の一実施形態に係る表示装置20について説明する。
図8は、本発明の一実施形態に係る表示装置20に用いる回路基板21のレイアウト構成を示すブロック図である。
図9は、本発明の一実施形態に係る表示装置20の一画素の等価回路である。画素は、発光素子230、第1トランジスタ261、第2トランジスタ262、第3トランジスタ263、第4トランジスタ264、および第5トランジスタ265、ならびに第1容量266および第2容量267を含む。また、走査配線241、信号配線242、電流供給配線243、発光制御走査配線244、初期化走査配線245、初期化配線246、リセット走査配線247、およびリセット配線248を含む。
図10を用いて、本発明の一実施形態に係る表示装置20の光学調整層236について説明する。
図11を用いて、本実施形態に係る表示装置20の光学調整層236の変形例について説明する。
図12を用いて、本実施形態に係る表示装置20の光学調整層236の変形例について説明する。
図13を用いて、本実施形態に係る表示装置20の光学調整層236の変形例について説明する。
図14を用いて、本発明の一実施形態に係る表示装置30について説明する。
図15を用いて、本発明の一実施形態に係る表示装置40について説明する。
図16を用いて、本実施形態に係る表示装置40の光学調整層436の変形例について説明する。
図17を用いて、本実施形態に係る表示装置40の光学調整層436の変形例について説明する。
図18A~図18Eを用いて、本発明の一実施形態に係る表示装置10の作製方法について説明する。
Claims (15)
- 発光素子と、
前記発光素子上の光学調整層と、を含み、
前記光学調整層は、
反射膜および前記反射膜上の透光壁と、
前記反射膜の側面および前記透光壁の側面と接する透光膜と、を含み、
前記透光壁の側面は、テーパーを有し、
前記透光壁の屈折率は、前記透光膜の屈折率よりも大きい表示装置。 - 前記透光壁の形状は、円錐台、多角錐台、円錐、または多角錐のいずれかである請求項1に記載の表示装置。
- 前記反射膜の下面の面積は、前記発光素子の上面の面積よりも小さい請求項1または請求項2に記載の表示装置。
- 発光素子と、
前記発光素子上の光学調整層と、を含み、
前記光学調整層は、
第1反射膜および前記第1反射膜上の第1透光壁を含む第1構造体と、
第2反射膜および前記第2反射膜上の第2透光壁を含む第2構造体と、
前記第1構造体の側面および前記第2構造体の側面と接する透光膜と、を含み、
前記第1構造体は、前記発光素子と重畳しない領域に設けられ、
前記第2構造体は、前記発光素子と重畳する領域に設けられ、
前記第1透光壁の屈折率および前記第2透光壁の屈折率は、前記透光膜の屈折率よりも大きい表示装置。 - 前記第1構造体の大きさは、前記第2構造体の大きさよりも大きい請求項4に記載の表示装置。
- 前記第1構造体の前記第1透光壁の側面は第1テーパー角を有し、
前記第2構造体の前記第2透光壁の側面は第2テーパー角を有し、
前記第1テーパー角は、前記第2テーパー角よりも小さい請求項4または請求項5に記載の表示装置。 - 隣接する2つの前記第1構造体の第1ピッチは、隣接する2つの前記第2構造体の第2ピッチよりも小さい請求項4乃至請求項6のいずれか一に記載の表示装置。
- 前記第1構造体の前記第1透光壁の第1形状と前記第2構造体の前記第2透光壁の第2形状とは異なる請求項4乃至請求項7のいずれか一に記載の表示装置。
- 前記第1構造体の前記第1透光壁の前記第1形状は、少なくとも前記発光素子の側面に沿って延伸する部分を含む請求項8に記載の表示装置。
- 前記第2構造体の前記第2透光壁の前記第2形状は、円錐台、多角錐台、円錐、または多角錐のいずれかである請求項8または請求項9に記載の表示装置。
- 発光素子と、
前記発光素子上の光学調整層と、を含み、
前記光学調整層は、
反射膜および前記反射膜上の第1透光壁を含む下部構造体と、
前記下部構造体上に設けられ、第2透光壁を含む上部構造体と、
前記下部構造体の側面および前記上部構造体の側面と接する透光膜と、を含み、
前記下部構造体の下面の面積は、前記上部構造体の下面の面積よりも大きく、
前記第1透光壁の屈折率および前記第2透光壁の屈折率は、前記透光膜の屈折率よりも大きい表示装置。 - 前記下部構造体の前記第1透光壁の側面は第1テーパー角を有し、
前記上部構造体の前記第2透光壁の側面は第2テーパー角を有し、
前記第1テーパー角は、前記第2テーパー角よりも小さい請求項11に記載の表示装置。 - 隣接する2つの前記下部構造体の第1ピッチは、隣接する2つの前記上部構造体の第2ピッチよりも大きい請求項11または請求項12に記載の表示装置。
- 前記下部構造体の前記第1透光壁の第1形状および前記上部構造体の前記第2透光壁の第2形状のうち少なくとも1つは、円錐台、多角錐台、円錐、または多角錐のいずれかである請求項11乃至請求項13のいずれか一に記載の表示装置。
- 前記発光素子は、発光ダイオードである請求項1乃至請求項14のいずれか一に記載の表示装置。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2010138697A1 (en) | 2009-05-27 | 2010-12-02 | Gary Wayne Jones | High efficiency and long life optical spectrum conversion device and process |
WO2011145247A1 (ja) | 2010-05-18 | 2011-11-24 | シャープ株式会社 | 表示装置 |
WO2012043172A1 (ja) | 2010-10-01 | 2012-04-05 | シャープ株式会社 | 蛍光体基板、およびこれを用いた表示装置、照明装置 |
WO2015159943A1 (ja) | 2014-04-17 | 2015-10-22 | シャープ株式会社 | 液晶表示装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2010138697A1 (en) | 2009-05-27 | 2010-12-02 | Gary Wayne Jones | High efficiency and long life optical spectrum conversion device and process |
WO2011145247A1 (ja) | 2010-05-18 | 2011-11-24 | シャープ株式会社 | 表示装置 |
WO2012043172A1 (ja) | 2010-10-01 | 2012-04-05 | シャープ株式会社 | 蛍光体基板、およびこれを用いた表示装置、照明装置 |
WO2015159943A1 (ja) | 2014-04-17 | 2015-10-22 | シャープ株式会社 | 液晶表示装置 |
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