JP7341115B2 - 樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法 - Google Patents

樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法 Download PDF

Info

Publication number
JP7341115B2
JP7341115B2 JP2020194737A JP2020194737A JP7341115B2 JP 7341115 B2 JP7341115 B2 JP 7341115B2 JP 2020194737 A JP2020194737 A JP 2020194737A JP 2020194737 A JP2020194737 A JP 2020194737A JP 7341115 B2 JP7341115 B2 JP 7341115B2
Authority
JP
Japan
Prior art keywords
resin
resin powder
plunger
hole
collecting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020194737A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022083345A (ja
Inventor
秀男 市橋
和己 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2020194737A priority Critical patent/JP7341115B2/ja
Priority to KR1020237014072A priority patent/KR20230074253A/ko
Priority to PCT/JP2021/042284 priority patent/WO2022113853A1/ja
Priority to CN202180062257.8A priority patent/CN116113529A/zh
Priority to TW110143338A priority patent/TWI802094B/zh
Publication of JP2022083345A publication Critical patent/JP2022083345A/ja
Application granted granted Critical
Publication of JP7341115B2 publication Critical patent/JP7341115B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1753—Cleaning or purging, e.g. of the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Pistons, Piston Rings, And Cylinders (AREA)
JP2020194737A 2020-11-24 2020-11-24 樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法 Active JP7341115B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020194737A JP7341115B2 (ja) 2020-11-24 2020-11-24 樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法
KR1020237014072A KR20230074253A (ko) 2020-11-24 2021-11-17 수지 분말 수집용 부재, 플런저 유니트, 수지 성형 장치 및 수지 성형품의 제조 방법
PCT/JP2021/042284 WO2022113853A1 (ja) 2020-11-24 2021-11-17 樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法
CN202180062257.8A CN116113529A (zh) 2020-11-24 2021-11-17 树脂粉末收集用部件、活塞单元、树脂成型装置和树脂成型品的制造方法
TW110143338A TWI802094B (zh) 2020-11-24 2021-11-22 樹脂粉末收集用部件、活塞單元、樹脂成型裝置和樹脂成型品的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020194737A JP7341115B2 (ja) 2020-11-24 2020-11-24 樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法

Publications (2)

Publication Number Publication Date
JP2022083345A JP2022083345A (ja) 2022-06-03
JP7341115B2 true JP7341115B2 (ja) 2023-09-08

Family

ID=81754587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020194737A Active JP7341115B2 (ja) 2020-11-24 2020-11-24 樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法

Country Status (5)

Country Link
JP (1) JP7341115B2 (zh)
KR (1) KR20230074253A (zh)
CN (1) CN116113529A (zh)
TW (1) TWI802094B (zh)
WO (1) WO2022113853A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009056769A (ja) 2007-09-03 2009-03-19 Towa Corp 電子部品の樹脂封止成形方法及び金型
JP2020088079A (ja) 2018-11-21 2020-06-04 Ｔｏｗａ株式会社 プランジャの交換方法、プランジャユニット及び樹脂成形装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4836901B1 (zh) 1967-01-12 1973-11-07
JPH06328496A (ja) * 1993-05-26 1994-11-29 Mitsubishi Materials Corp トランスファ成形用金型
JPH1034694A (ja) * 1996-07-19 1998-02-10 Hitachi Ltd モールド金型清浄装置
JP6560498B2 (ja) * 2015-01-27 2019-08-14 Ｔｏｗａ株式会社 樹脂封止方法及び樹脂成形品の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009056769A (ja) 2007-09-03 2009-03-19 Towa Corp 電子部品の樹脂封止成形方法及び金型
JP2020088079A (ja) 2018-11-21 2020-06-04 Ｔｏｗａ株式会社 プランジャの交換方法、プランジャユニット及び樹脂成形装置

Also Published As

Publication number Publication date
TWI802094B (zh) 2023-05-11
CN116113529A (zh) 2023-05-12
WO2022113853A1 (ja) 2022-06-02
JP2022083345A (ja) 2022-06-03
TW202233386A (zh) 2022-09-01
KR20230074253A (ko) 2023-05-26

Similar Documents

Publication Publication Date Title
KR101659690B1 (ko) 수지 밀봉 장치 및 수지 밀봉 방법
CN107672103B (zh) 树脂成型装置及树脂成型品制造方法
KR101705978B1 (ko) 수지 성형 장치 및 수지 성형 방법
KR101710235B1 (ko) 전자 부품의 제조 장치 및 제조 방법
TWI720488B (zh) 樹脂成形裝置及樹脂成形品的製造方法
KR101998942B1 (ko) 수지 성형 장치 및 수지 성형 방법
JP7341115B2 (ja) 樹脂粉収集用部材、プランジャユニット、樹脂成形装置及び樹脂成形品の製造方法
KR970020382A (ko) 전자부품의 수지밀봉 성형장치
CN107756707B (zh) 树脂成形装置及树脂成形品制造方法
JP7430149B2 (ja) 樹脂成形装置および樹脂成形品の製造方法
JP7360369B2 (ja) 樹脂成形装置、及び樹脂成形品の製造方法
JP7441511B2 (ja) 樹脂封止装置及びその清掃方法
JP2022155897A (ja) 樹脂封止装置
JP4162474B2 (ja) 樹脂成形用金型への供給方法、樹脂成形用金型からの取出方法、供給機構、及び、取出機構
JP7430125B2 (ja) 成形型、樹脂成形装置、及び樹脂成形品の製造方法
JP7447050B2 (ja) 成形型、樹脂成形装置及び樹脂成形品の製造方法
KR101854007B1 (ko) 반도체 소자 몰딩 장치
JP7341105B2 (ja) 樹脂成形装置、及び樹脂成形品の製造方法
JP7430144B2 (ja) クリーニング機構、樹脂成形装置及び樹脂成形品の製造方法
JP7468906B2 (ja) 樹脂封止装置
KR20230015449A (ko) 클리닝 기구, 수지 성형 장치 및 수지 성형품의 제조 방법
JP2024044401A (ja) 樹脂供給装置、樹脂成形装置、及び樹脂成形品の製造方法
JP4347932B2 (ja) 樹脂封止装置
CN115605333A (zh) 树脂成形装置、盖板及树脂成形品的制造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221205

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230523

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230706

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230801

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230829

R150 Certificate of patent or registration of utility model

Ref document number: 7341115

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150