JP7332187B2 - 抗菌タイルおよびその製造方法 - Google Patents
抗菌タイルおよびその製造方法 Download PDFInfo
- Publication number
- JP7332187B2 JP7332187B2 JP2021172030A JP2021172030A JP7332187B2 JP 7332187 B2 JP7332187 B2 JP 7332187B2 JP 2021172030 A JP2021172030 A JP 2021172030A JP 2021172030 A JP2021172030 A JP 2021172030A JP 7332187 B2 JP7332187 B2 JP 7332187B2
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- Prior art keywords
- zinc oxide
- antibacterial
- glaze
- tile
- manufacturing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000000844 anti-bacterial effect Effects 0.000 title claims description 65
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 69
- 230000000845 anti-microbial effect Effects 0.000 claims description 44
- 239000011787 zinc oxide Substances 0.000 claims description 28
- 239000000725 suspension Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000004599 antimicrobial Substances 0.000 claims description 14
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 13
- 239000002002 slurry Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 238000010304 firing Methods 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 8
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims description 8
- 239000001569 carbon dioxide Substances 0.000 claims description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 229920006395 saturated elastomer Polymers 0.000 claims description 3
- 239000002689 soil Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000000701 coagulant Substances 0.000 claims 1
- 238000007641 inkjet printing Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 238000010298 pulverizing process Methods 0.000 claims 1
- 238000010020 roller printing Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 239000005751 Copper oxide Substances 0.000 description 9
- 229910000431 copper oxide Inorganic materials 0.000 description 9
- 239000004576 sand Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 241000894006 Bacteria Species 0.000 description 8
- 239000004927 clay Substances 0.000 description 6
- 230000005484 gravity Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000001954 sterilising effect Effects 0.000 description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- 241000700605 Viruses Species 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000011435 rock Substances 0.000 description 4
- 238000004659 sterilization and disinfection Methods 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- UOURRHZRLGCVDA-UHFFFAOYSA-D pentazinc;dicarbonate;hexahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Zn+2].[Zn+2].[Zn+2].[Zn+2].[Zn+2].[O-]C([O-])=O.[O-]C([O-])=O UOURRHZRLGCVDA-UHFFFAOYSA-D 0.000 description 3
- 239000011941 photocatalyst Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 2
- 239000005750 Copper hydroxide Substances 0.000 description 2
- 241000588724 Escherichia coli Species 0.000 description 2
- 241000191967 Staphylococcus aureus Species 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 229910001956 copper hydroxide Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000011534 incubation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 102000004169 proteins and genes Human genes 0.000 description 2
- 108090000623 proteins and genes Proteins 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000530268 Lycaena heteronea Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KMWBBMXGHHLDKL-UHFFFAOYSA-N [AlH3].[Si] Chemical compound [AlH3].[Si] KMWBBMXGHHLDKL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000001580 bacterial effect Effects 0.000 description 1
- 244000052616 bacterial pathogen Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000017531 blood circulation Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- VODBHXZOIQDDST-UHFFFAOYSA-N copper zinc oxygen(2-) Chemical compound [O--].[O--].[Cu++].[Zn++] VODBHXZOIQDDST-UHFFFAOYSA-N 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- PGTIPSRGRGGDQO-UHFFFAOYSA-N copper;oxozinc Chemical compound [Zn].[Cu]=O PGTIPSRGRGGDQO-UHFFFAOYSA-N 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011081 inoculation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- -1 peroxide ions Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000003805 procoagulant Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 239000010959 steel Substances 0.000 description 1
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- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
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- C01G3/02—Oxides; Hydroxides
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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Description
抗菌タイルに使用されている抗菌材料は、セラミック釉薬であって、1000~1600°Cで焼成した後、優れた抗菌能力と遠赤外線放射のような特性を保持している。
本発明は、基体と、前記基体を覆う化粧土層と、前記化粧土層を覆うベース釉薬層と、前記ベース釉薬層を覆う抗菌釉薬層と、を有する抗菌タイルである。
そして、表面釉薬と抗菌材料とを100:5-10の重量比で混合して抗菌性の釉薬を作る。次に、水と前記抗菌性の釉薬とを5-6:4-5の重量比で混合し、さらに粉砕する。このとき、抗菌釉薬の比重は1.30~1.50に調整される。抗菌釉薬がベース釉薬層に点在、噴霧または注ぎ掛けられることでベース釉薬層の上に抗菌釉薬層が設けられる。
なお、例えば砂というのは、極めて微細な、あるいは微細に粉砕された石の集合のことであり、天然の岩石等でもよいし、組成を特段限定しないが、一般論として、砂としては、ケイ素に富む珪質の岩石やケイ素およびアルミニウムに富む珪長質の岩石由来のものが例として挙げられる。ただし、苦鉄質や石灰質の岩石由来の砂を排除しない。酸化銅懸濁液に細粒砂のゾルを加えて、沈殿、濾過、乾燥、粉砕、か焼などの工程で砂でコーティングするようにしてもよい。あるいはナノ酸化亜鉛粉末と同じようにシリカ(シリカゾル)でコーティングしてもよい。
粒径(平均粒径、平均粒子サイズ)は、数回サンプリングしたものを顕微鏡で確認し、統計的処理により粒径(平均粒径、平均粒子サイズ)を求めるようにしてもよいし、光散乱法(レーザー回折・散乱法)で求めるようにしてもよいだろう。
本発明の抗菌タイルの製造方法は、タイル本体を提供し、抗菌釉薬を形成し、そして焼成する工程を含む。
タイル本体を提供するステップには以下が含まれる。
土壌材料を粉砕してスラリーにし、熱風でスラリーを粉末に乾燥させ、成形機により粉末を基体とする。化粧土層を形成するために、基体の表面に化粧用の釉薬(化粧土)を点在させるか、噴霧するか、または、注ぐ(かける)。そして、釉薬スラリーを化粧土層に点在させたり、噴霧したり、注いだり(かけたり)して、ベース釉薬を形成する。次に、表面釉薬と抗菌材料を100:5-10の重量比で混合して、抗菌釉薬を形成する。次に、水と抗菌釉薬を5-6:4-5の重量比で混合し、粉砕し、ベース釉薬層に抗菌釉薬を点在させるか、噴霧するか、注ぐ(かける)。さらに、タイルと抗菌釉薬は、焼成温度で抗菌タイルに素早く焼成される。
この技術に精通している当業者は、本明細書に開示されている内容から本発明の他の利点および効果を容易に理解することができるだろう。また、本発明は、他の異なる特定の実施形態によって実施または適用することができ、本考案の趣旨から逸脱することなく、様々な修正および変更を行うことができる。
ここで、タイル本体を提供するステップには、以下が含まれる。すなわち、タイル本体を提供するステップは、基体を形成するステップと、化粧土を形成するステップと、ベース釉薬を形成するステップと、を含む。土壌材料を粉砕してスラリーにし、熱風でスラリーを粉末に乾燥させ、成形機により粉末を基体とする。化粧土層を形成するために、基体の表面に化粧用の釉薬(化粧土)を点在させるか、噴霧するか、または、注ぐ(かける)。そして、釉薬スラリーを化粧土層に点在させたり、噴霧したり、注いだり(かけたり)して、ベース釉薬を形成する。具体的にいうと、20-30wt%の粘土を入れ、60~70wt%の長石と5~10wt%の砂を粉砕してスラリーにし、中および高アルミナボールで10~11時間、研磨ボール(例えばスチール製)で18~19時間粉砕する。試験標準比重は1.72±0.02、残留物は1.0g±0.3g、粘度は300cps±100cps、とする。テストが不適格である場合、スラリーを排出する前に合格するように調整する。次に、スラリーはスプレー塔に汲み上げられ、高圧によってミスト(霧)状にされ、塔内の温度は570~650°Cの範囲である。スラリーの液体含水率は32~35%で、高温で瞬時に5.5~6.5%まで乾燥して粒状粒子を生成し、粉末を容器(タンク、バケツ)に輸送して保管する。粉末は高圧300~400kgf/cm2で成形され、焼くの前の曲げ抵抗は12-20kgf/cm2に調整される。そして、釉薬を塗るために垂直乾燥室に運ばれる。例として、20×20cmサイズのタイルを例とする。まず、比重1.50~1.60、重量18g~21gの釉薬(化粧土としての釉薬)を敷く。さらに、比重1.55~1.65、重量18g~21gの釉薬を先の化粧土の上に塗布する。
製造工程では、ナノ酸化亜鉛が蓄積して緻密な六方最密格子を形成する。各六方最密格子は負の電荷を帯びており、六方最密格子同士の衝突や高速回転により熱エネルギーが発生する。次に、水酸化物と過酸素イオンを生成し、これらは直接滅菌力がある。さらに、コーティングされたナノ酸化亜鉛は、88~92マイクロメートルの波長の遠赤外線放出の機能を持っており、例えば人間の血液循環を助ける。また、コーティングされたナノ銅酸化物に含まれる正に帯電した銅イオンは、より強い殺菌力を持ち、細菌細胞やウイルスのタンパク質膜に直接付着し、それらの構造を直接破壊して、滅菌と無害化の効果を達成する。コーティング技術の導入により、1000~1600°Cで焼成したナノ酸化亜鉛銅の滅菌率は、24時間で99.9%を超え、また、放射率は0.92で遠赤外線放射のような機能も備えている。
抗菌値(R)=[抗菌物質を含まないサンプル中の細菌数の平均対数値]-[抗菌物質を含むサンプル中の細菌数の平均対数値]
である。
抗菌値(R)≧2.0の場合、抗菌効果があることを意味する。
U0:抗菌剤を含まないサンプルの接種直後にテストされる細菌の数であり、それは、6.2×103~2.5×104(CFU/cm2)の間である。
Ut:24時間のインキュベーション後における抗菌物質を含まないサンプル中の細菌の数である。
At:24時間のインキュベーション後における抗菌物質を含むサンプル中の細菌の数である。
抗菌値(R)=Ut-At
なお、上記の試験は、SGS-食品研究所-高雄およびSGS-UTIS-台北に委託されたものである。
また、次の式により、抗菌値をパーセンテージ値に変換する。
[(Ut-At)/Ut]×100[%]、
大腸菌の抗菌率は次のようになる。
[(6.9×105-8.10)/6.9×105]×100=99.99[%]
黄色ブドウ球菌の抗菌率は次のようになる。
[(2.1×103-1.90)/2.1×103]×100=99.91[%]
11 基体
12 化粧土層
13 ベース釉薬層
14 抗菌釉薬層
Claims (3)
- 抗菌タイルを製造する方法であって、
タイル本体を製造するステップは、
土壌材料を粉砕してスラリーにし、熱風でスラリーを粉末に乾燥させ、成形機により粉末を基体とする基体を形成するステップと、
前記基体の表面に化粧用の釉薬を点在させるか、噴霧するか、または、注ぐことで化粧土層を形成するステップと、
前記化粧土層に釉薬を点在させるか、噴霧するか、注ぐか、インクジェット印刷するか、スクリーン印刷するか、ローラー印刷するか、のいずれかによってベース釉薬層を形成するステップと、を含み、さらに、
抗菌釉薬層を形成するステップにおいて、
表面釉薬と抗菌材料を100:5-10の重量比で混合して、抗菌釉薬を形成し、
次に、水と抗菌釉薬を5-6:4-5の重量比で混合し、粉砕し、前記ベース釉薬層に抗菌釉薬を点在させるか、噴霧するか、注ぎ、
さらに、
焼成するステップにおいて、
焼成温度1000~1600℃で前記タイル本体と前記抗菌釉薬と抗菌タイルに焼成し、
前記抗菌材料は、シリカでコーティングされた酸化亜鉛粉末を含む
ことを特徴とする抗菌タイル製造方法。 - 請求項1に記載の抗菌タイル製造方法において、
コーティングされた酸化亜鉛粉末の製造ステップは、
85°Cの水100mlに酸化亜鉛粉末6-10gを加え、マグネチックスターラーに入れて完全に攪拌し、混合して酸化亜鉛懸濁液を形成し、
酸化亜鉛懸濁液を90~95℃に加熱し、同時に飽和純二酸化炭素ガスを酸化亜鉛懸濁液に通し、設定温度90~95℃に達したら3-5時間保持して完全に反応させ、
二酸化炭素ガスの導入を停止し、酸化亜鉛懸濁液に8gのシリカゾルを加え、0.5時間保持し、
3gの凝固促進剤を加え、1-2時間沈殿させた後、酸化亜鉛懸濁液をろ過し、
酸化亜鉛懸濁液を200~250℃で乾燥させ、
そして、粉砕機を使用して、乾燥した酸化亜鉛を粉砕し、250~400℃でか焼してコーティングされた酸化亜鉛粉末を得る
ことを特徴とする抗菌タイル製造方法。 - 請求項1または請求項2に記載の抗菌タイル製造方法において、
前記コーティングされた酸化亜鉛粉末の平均粒子サイズは個数平均径で8~12ナノメートルであり、その比表面積は70~130平方メートル/gである
ことを特徴とする抗菌タイル製造方法。
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