JP7328848B2 - ダイボンディング装置および半導体装置の製造方法 - Google Patents

ダイボンディング装置および半導体装置の製造方法 Download PDF

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JP7328848B2
JP7328848B2 JP2019171820A JP2019171820A JP7328848B2 JP 7328848 B2 JP7328848 B2 JP 7328848B2 JP 2019171820 A JP2019171820 A JP 2019171820A JP 2019171820 A JP2019171820 A JP 2019171820A JP 7328848 B2 JP7328848 B2 JP 7328848B2
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bonding
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JP2021048375A (ja
JP2021048375A5 (enExample
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孝 山上
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Fasford Technology Co Ltd
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JP2019171820A 2019-09-20 2019-09-20 ダイボンディング装置および半導体装置の製造方法 Active JP7328848B2 (ja)

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KR102706412B1 (ko) * 2021-11-24 2024-09-11 세메스 주식회사 다이 본딩 장치 및 다이 본딩 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246793A (ja) 2001-02-16 2002-08-30 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2003142882A (ja) 2001-11-02 2003-05-16 Matsushita Electric Ind Co Ltd 電子部品実装ラインにおける基板搬送装置および基板搬送方法
JP2008210824A (ja) 2007-02-23 2008-09-11 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2012038755A (ja) 2010-08-03 2012-02-23 Fuji Mach Mfg Co Ltd 基板印刷システム
JP2019160948A (ja) 2018-03-12 2019-09-19 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246793A (ja) 2001-02-16 2002-08-30 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2003142882A (ja) 2001-11-02 2003-05-16 Matsushita Electric Ind Co Ltd 電子部品実装ラインにおける基板搬送装置および基板搬送方法
JP2008210824A (ja) 2007-02-23 2008-09-11 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
JP2012038755A (ja) 2010-08-03 2012-02-23 Fuji Mach Mfg Co Ltd 基板印刷システム
JP2019160948A (ja) 2018-03-12 2019-09-19 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法

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