JP7328809B2 - 検出装置、露光装置、および物品製造方法 - Google Patents

検出装置、露光装置、および物品製造方法 Download PDF

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Publication number
JP7328809B2
JP7328809B2 JP2019123134A JP2019123134A JP7328809B2 JP 7328809 B2 JP7328809 B2 JP 7328809B2 JP 2019123134 A JP2019123134 A JP 2019123134A JP 2019123134 A JP2019123134 A JP 2019123134A JP 7328809 B2 JP7328809 B2 JP 7328809B2
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Japan
Prior art keywords
detection
mark
detection unit
marks
detection device
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JP2019123134A
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English (en)
Japanese (ja)
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JP2021009230A5 (https=
JP2021009230A (ja
Inventor
渉 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2019123134A priority Critical patent/JP7328809B2/ja
Priority to SG10202005801XA priority patent/SG10202005801XA/en
Priority to TW109121143A priority patent/TWI781419B/zh
Priority to KR1020200076259A priority patent/KR102756369B1/ko
Priority to US16/914,976 priority patent/US11079692B2/en
Priority to CN202010622439.3A priority patent/CN112180696B/zh
Publication of JP2021009230A publication Critical patent/JP2021009230A/ja
Publication of JP2021009230A5 publication Critical patent/JP2021009230A5/ja
Application granted granted Critical
Publication of JP7328809B2 publication Critical patent/JP7328809B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/57—Mask-wafer alignment

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Geophysics And Detection Of Objects (AREA)
JP2019123134A 2019-07-01 2019-07-01 検出装置、露光装置、および物品製造方法 Active JP7328809B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019123134A JP7328809B2 (ja) 2019-07-01 2019-07-01 検出装置、露光装置、および物品製造方法
SG10202005801XA SG10202005801XA (en) 2019-07-01 2020-06-18 Detection apparatus, exposure apparatus, and article manufacturing method
TW109121143A TWI781419B (zh) 2019-07-01 2020-06-22 檢測裝置、曝光裝置和物品製造方法
KR1020200076259A KR102756369B1 (ko) 2019-07-01 2020-06-23 검출장치, 노광장치, 및 물품 제조방법
US16/914,976 US11079692B2 (en) 2019-07-01 2020-06-29 Detection apparatus, exposure apparatus, and article manufacturing method
CN202010622439.3A CN112180696B (zh) 2019-07-01 2020-07-01 检测装置、曝光装置和物品制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019123134A JP7328809B2 (ja) 2019-07-01 2019-07-01 検出装置、露光装置、および物品製造方法

Publications (3)

Publication Number Publication Date
JP2021009230A JP2021009230A (ja) 2021-01-28
JP2021009230A5 JP2021009230A5 (https=) 2022-07-05
JP7328809B2 true JP7328809B2 (ja) 2023-08-17

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JP2019123134A Active JP7328809B2 (ja) 2019-07-01 2019-07-01 検出装置、露光装置、および物品製造方法

Country Status (6)

Country Link
US (1) US11079692B2 (https=)
JP (1) JP7328809B2 (https=)
KR (1) KR102756369B1 (https=)
CN (1) CN112180696B (https=)
SG (1) SG10202005801XA (https=)
TW (1) TWI781419B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7173891B2 (ja) * 2019-02-14 2022-11-16 キヤノン株式会社 計測装置、露光装置、および物品製造方法
EP4020086A1 (en) * 2020-12-28 2022-06-29 ASML Netherlands B.V. A metrology apparatus and a metrology method
JP2022117091A (ja) * 2021-01-29 2022-08-10 キヤノン株式会社 計測装置、リソグラフィ装置及び物品の製造方法
JP7729734B2 (ja) * 2021-05-14 2025-08-26 キヤノントッキ株式会社 成膜装置、プログラム、位置検知精度の評価方法及び電子デバイスの製造方法
JP7600070B2 (ja) * 2021-10-12 2024-12-16 キヤノン株式会社 マーク検出装置、露光装置および物品製造方法
US12259660B2 (en) 2021-10-26 2025-03-25 Industrial Technology Research Institute Inspection method and inspection platform for lithography
TWI801012B (zh) * 2021-10-26 2023-05-01 財團法人工業技術研究院 用於微影製程的檢測方法與檢測平台
CN116107171A (zh) * 2021-11-10 2023-05-12 佳能株式会社 信息处理方法、光刻装置、存储介质及物品制造方法
JP7834460B2 (ja) * 2021-12-06 2026-03-24 キヤノン株式会社 検出装置、基板処理装置、及び物品の製造方法
JP7817841B2 (ja) 2022-01-18 2026-02-19 キヤノン株式会社 検出装置、検出方法、露光装置及び物品の製造方法
JP2023124596A (ja) * 2022-02-25 2023-09-06 キヤノン株式会社 検出方法、検出装置、リソグラフィ装置、および物品の製造方法
CN114756002A (zh) * 2022-04-08 2022-07-15 苏州威达智电子科技有限公司 一种采用微型控制器的多功能检测设备及其控制系统
KR102711897B1 (ko) * 2022-11-09 2024-09-27 이재준 비전 얼라인먼트 시스템 및 이를 이용한 스테이지 이동시 진동 및 흔들림에 대한 오차보정방법

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JP2006310683A (ja) 2005-05-02 2006-11-09 Nikon Corp 調整方法
JP2012227551A (ja) 2012-08-03 2012-11-15 Nikon Corp マーク検出方法及び装置、位置制御方法及び装置、露光方法及び装置、並びにデバイス製造方法

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JP3209190B2 (ja) * 1991-07-10 2001-09-17 株式会社ニコン 露光方法
US5654553A (en) * 1993-06-10 1997-08-05 Nikon Corporation Projection exposure apparatus having an alignment sensor for aligning a mask image with a substrate
JP4402418B2 (ja) * 2003-10-08 2010-01-20 キヤノン株式会社 露光装置およびデバイス製造方法
JP2005175400A (ja) * 2003-12-15 2005-06-30 Canon Inc 露光装置
TWI547771B (zh) * 2006-08-31 2016-09-01 尼康股份有限公司 Mobile body drive system and moving body driving method, pattern forming apparatus and method, exposure apparatus and method, component manufacturing method, and method of determining
SG10201407218XA (en) 2006-09-01 2015-01-29 Nippon Kogaku Kk Movable Body Drive Method And Movable Body Drive System, Pattern Formation Method And Apparatus, Exposure Method And Apparatus, And Device Manufacturing Method
JP5120691B2 (ja) 2007-08-24 2013-01-16 株式会社ニコン マーク検出方法及び装置、露光方法及び装置、並びにデバイス製造方法
JP2009054736A (ja) 2007-08-24 2009-03-12 Nikon Corp マーク検出方法及び装置、位置制御方法及び装置、露光方法及び装置、並びにデバイス製造方法
JP6462993B2 (ja) * 2014-04-02 2019-01-30 キヤノン株式会社 露光装置および物品製造方法
CN105527795B (zh) * 2014-09-28 2018-09-18 上海微电子装备（集团）股份有限公司 曝光装置及离焦倾斜误差补偿方法
JP6207671B1 (ja) * 2016-06-01 2017-10-04 キヤノン株式会社 パターン形成装置、基板配置方法及び物品の製造方法
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JP2006310683A (ja) 2005-05-02 2006-11-09 Nikon Corp 調整方法
JP2012227551A (ja) 2012-08-03 2012-11-15 Nikon Corp マーク検出方法及び装置、位置制御方法及び装置、露光方法及び装置、並びにデバイス製造方法

Also Published As

Publication number Publication date
SG10202005801XA (en) 2021-02-25
KR20210003045A (ko) 2021-01-11
JP2021009230A (ja) 2021-01-28
US11079692B2 (en) 2021-08-03
CN112180696B (zh) 2024-06-18
KR102756369B1 (ko) 2025-01-20
CN112180696A (zh) 2021-01-05
US20210003930A1 (en) 2021-01-07
TW202102949A (zh) 2021-01-16
TWI781419B (zh) 2022-10-21

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