JP7327690B2 - 伝送線路及び電子機器 - Google Patents

伝送線路及び電子機器 Download PDF

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Publication number
JP7327690B2
JP7327690B2 JP2022565123A JP2022565123A JP7327690B2 JP 7327690 B2 JP7327690 B2 JP 7327690B2 JP 2022565123 A JP2022565123 A JP 2022565123A JP 2022565123 A JP2022565123 A JP 2022565123A JP 7327690 B2 JP7327690 B2 JP 7327690B2
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JP
Japan
Prior art keywords
transmission line
element body
insulator layer
conductor layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022565123A
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English (en)
Japanese (ja)
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JPWO2022113591A1 (https=
JPWO2022113591A5 (https=
Inventor
伸郎 池本
哲聡 奥田
恒亮 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2022113591A1 publication Critical patent/JPWO2022113591A1/ja
Publication of JPWO2022113591A5 publication Critical patent/JPWO2022113591A5/ja
Priority to JP2023124127A priority Critical patent/JP7772040B2/ja
Application granted granted Critical
Publication of JP7327690B2 publication Critical patent/JP7327690B2/ja
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/085Triplate lines
    • H01P3/087Suspended triplate lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06Coaxial lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • H01P3/085Triplate lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/02Bends; Corners; Twists

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022565123A 2020-11-30 2021-10-22 伝送線路及び電子機器 Active JP7327690B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023124127A JP7772040B2 (ja) 2020-11-30 2023-07-31 伝送線路

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020198382 2020-11-30
JP2020198382 2020-11-30
PCT/JP2021/039061 WO2022113591A1 (ja) 2020-11-30 2021-10-22 伝送線路及び電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023124127A Division JP7772040B2 (ja) 2020-11-30 2023-07-31 伝送線路

Publications (3)

Publication Number Publication Date
JPWO2022113591A1 JPWO2022113591A1 (https=) 2022-06-02
JPWO2022113591A5 JPWO2022113591A5 (https=) 2023-06-20
JP7327690B2 true JP7327690B2 (ja) 2023-08-16

Family

ID=81754259

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022565123A Active JP7327690B2 (ja) 2020-11-30 2021-10-22 伝送線路及び電子機器
JP2023124127A Active JP7772040B2 (ja) 2020-11-30 2023-07-31 伝送線路

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023124127A Active JP7772040B2 (ja) 2020-11-30 2023-07-31 伝送線路

Country Status (4)

Country Link
US (2) US12394876B2 (https=)
JP (2) JP7327690B2 (https=)
CN (2) CN221304960U (https=)
WO (1) WO2022113591A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022260092A1 (https=) * 2021-06-09 2022-12-15
WO2025121070A1 (ja) * 2023-12-06 2025-06-12 株式会社村田製作所 高周波信号伝送線路及び電子機器
WO2025121071A1 (ja) * 2023-12-06 2025-06-12 株式会社村田製作所 高周波信号伝送線路及び電子機器
WO2025121069A1 (ja) * 2023-12-06 2025-06-12 株式会社村田製作所 高周波信号伝送線路及び電子機器
WO2026048712A1 (ja) * 2024-08-29 2026-03-05 株式会社村田製作所 伝送線路及び電子機器
WO2026048599A1 (ja) * 2024-09-02 2026-03-05 株式会社村田製作所 多層基板及び電子機器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151854A (ja) 2000-11-15 2002-05-24 Genesis Technology Kk 多層プリント配線板およびその製造方法
WO2017130731A1 (ja) 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5712607A (en) * 1996-04-12 1998-01-27 Dittmer; Timothy W. Air-dielectric stripline
TWI445249B (zh) 2010-07-08 2014-07-11 Kuo Chih Hung 天線模組
JP6285638B2 (ja) 2013-04-25 2018-02-28 日本メクトロン株式会社 プリント配線板およびプリント配線板製造方法
US20170271734A1 (en) 2016-03-17 2017-09-21 Multek Technologies Limited Embedded cavity in printed circuit board by solder mask dam

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151854A (ja) 2000-11-15 2002-05-24 Genesis Technology Kk 多層プリント配線板およびその製造方法
WO2017130731A1 (ja) 2016-01-27 2017-08-03 株式会社村田製作所 信号伝送線路

Also Published As

Publication number Publication date
US20250343341A1 (en) 2025-11-06
WO2022113591A1 (ja) 2022-06-02
JPWO2022113591A1 (https=) 2022-06-02
CN221304960U (zh) 2024-07-09
JP7772040B2 (ja) 2025-11-18
JP2023138604A (ja) 2023-10-02
US20230327309A1 (en) 2023-10-12
CN220066075U (zh) 2023-11-21
US12394876B2 (en) 2025-08-19

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