CN221304960U - 传输线路 - Google Patents
传输线路 Download PDFInfo
- Publication number
- CN221304960U CN221304960U CN202323086718.0U CN202323086718U CN221304960U CN 221304960 U CN221304960 U CN 221304960U CN 202323086718 U CN202323086718 U CN 202323086718U CN 221304960 U CN221304960 U CN 221304960U
- Authority
- CN
- China
- Prior art keywords
- transmission line
- insulator layer
- layer
- conductor layer
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 292
- 239000010410 layer Substances 0.000 claims abstract description 488
- 239000004020 conductor Substances 0.000 claims abstract description 283
- 239000002356 single layer Substances 0.000 claims abstract description 6
- 239000012212 insulator Substances 0.000 claims description 274
- 239000011800 void material Substances 0.000 claims description 107
- 230000015572 biosynthetic process Effects 0.000 claims description 41
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 239000011229 interlayer Substances 0.000 description 43
- 238000012986 modification Methods 0.000 description 30
- 230000004048 modification Effects 0.000 description 30
- 230000005684 electric field Effects 0.000 description 25
- 239000000463 material Substances 0.000 description 19
- 230000000694 effects Effects 0.000 description 17
- 238000005452 bending Methods 0.000 description 16
- 239000011241 protective layer Substances 0.000 description 11
- 238000009826 distribution Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000008054 signal transmission Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 238000010023 transfer printing Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
- H01P3/087—Suspended triplate lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/06—Coaxial lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/02—Bends; Corners; Twists
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020198382 | 2020-11-30 | ||
| JP2020-198382 | 2020-11-30 | ||
| CN202190000821.9U CN220066075U (zh) | 2020-11-30 | 2021-10-22 | 传输线路以及电子设备 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202190000821.9U Division CN220066075U (zh) | 2020-11-30 | 2021-10-22 | 传输线路以及电子设备 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221304960U true CN221304960U (zh) | 2024-07-09 |
Family
ID=81754259
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323086718.0U Active CN221304960U (zh) | 2020-11-30 | 2021-10-22 | 传输线路 |
| CN202190000821.9U Active CN220066075U (zh) | 2020-11-30 | 2021-10-22 | 传输线路以及电子设备 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202190000821.9U Active CN220066075U (zh) | 2020-11-30 | 2021-10-22 | 传输线路以及电子设备 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US12394876B2 (https=) |
| JP (2) | JP7327690B2 (https=) |
| CN (2) | CN221304960U (https=) |
| WO (1) | WO2022113591A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2022260092A1 (https=) * | 2021-06-09 | 2022-12-15 | ||
| WO2025121070A1 (ja) * | 2023-12-06 | 2025-06-12 | 株式会社村田製作所 | 高周波信号伝送線路及び電子機器 |
| WO2025121071A1 (ja) * | 2023-12-06 | 2025-06-12 | 株式会社村田製作所 | 高周波信号伝送線路及び電子機器 |
| WO2025121069A1 (ja) * | 2023-12-06 | 2025-06-12 | 株式会社村田製作所 | 高周波信号伝送線路及び電子機器 |
| WO2026048712A1 (ja) * | 2024-08-29 | 2026-03-05 | 株式会社村田製作所 | 伝送線路及び電子機器 |
| WO2026048599A1 (ja) * | 2024-09-02 | 2026-03-05 | 株式会社村田製作所 | 多層基板及び電子機器 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5712607A (en) * | 1996-04-12 | 1998-01-27 | Dittmer; Timothy W. | Air-dielectric stripline |
| JP2002151854A (ja) * | 2000-11-15 | 2002-05-24 | Genesis Technology Kk | 多層プリント配線板およびその製造方法 |
| TWI445249B (zh) | 2010-07-08 | 2014-07-11 | Kuo Chih Hung | 天線模組 |
| JP6285638B2 (ja) | 2013-04-25 | 2018-02-28 | 日本メクトロン株式会社 | プリント配線板およびプリント配線板製造方法 |
| CN208608339U (zh) | 2016-01-27 | 2019-03-15 | 株式会社村田制作所 | 信号传输线路 |
| US20170271734A1 (en) | 2016-03-17 | 2017-09-21 | Multek Technologies Limited | Embedded cavity in printed circuit board by solder mask dam |
-
2021
- 2021-10-22 WO PCT/JP2021/039061 patent/WO2022113591A1/ja not_active Ceased
- 2021-10-22 CN CN202323086718.0U patent/CN221304960U/zh active Active
- 2021-10-22 JP JP2022565123A patent/JP7327690B2/ja active Active
- 2021-10-22 CN CN202190000821.9U patent/CN220066075U/zh active Active
-
2023
- 2023-05-24 US US18/201,211 patent/US12394876B2/en active Active
- 2023-07-31 JP JP2023124127A patent/JP7772040B2/ja active Active
-
2025
- 2025-07-11 US US19/266,286 patent/US20250343341A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250343341A1 (en) | 2025-11-06 |
| JP7327690B2 (ja) | 2023-08-16 |
| WO2022113591A1 (ja) | 2022-06-02 |
| JPWO2022113591A1 (https=) | 2022-06-02 |
| JP7772040B2 (ja) | 2025-11-18 |
| JP2023138604A (ja) | 2023-10-02 |
| US20230327309A1 (en) | 2023-10-12 |
| CN220066075U (zh) | 2023-11-21 |
| US12394876B2 (en) | 2025-08-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |