JP7310774B2 - 天井搬送車及び天井搬送車における巻取ドラムの回転量算出方法 - Google Patents
天井搬送車及び天井搬送車における巻取ドラムの回転量算出方法 Download PDFInfo
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- JP7310774B2 JP7310774B2 JP2020169670A JP2020169670A JP7310774B2 JP 7310774 B2 JP7310774 B2 JP 7310774B2 JP 2020169670 A JP2020169670 A JP 2020169670A JP 2020169670 A JP2020169670 A JP 2020169670A JP 7310774 B2 JP7310774 B2 JP 7310774B2
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C13/00—Other constructional features or details
- B66C13/18—Control systems or devices
- B66C13/22—Control systems or devices for electric drives
- B66C13/23—Circuits for controlling the lowering of the load
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- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C13/00—Other constructional features or details
- B66C13/18—Control systems or devices
- B66C13/46—Position indicators for suspended loads or for crane elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66D—CAPSTANS; WINCHES; TACKLES, e.g. PULLEY BLOCKS; HOISTS
- B66D1/00—Rope, cable, or chain winding mechanisms; Capstans
- B66D1/28—Other constructional details
- B66D1/40—Control devices
- B66D1/48—Control devices automatic
- B66D1/485—Control devices automatic electrical
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/06—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness specially adapted for measuring length or width of objects while moving
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/10—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters
- G01B21/12—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters of objects while moving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B66—HOISTING; LIFTING; HAULING
- B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
- B66C19/00—Cranes comprising trolleys or crabs running on fixed or movable bridges or gantries
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- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Automation & Control Theory (AREA)
- Control And Safety Of Cranes (AREA)
- Warehouses Or Storage Devices (AREA)
- Control Of Conveyors (AREA)
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Description
但し、
L:昇降台の昇降量、n:巻取ドラムの回転量、t:吊持材の厚みの個体値、D:巻取ドラムの直径の個体値、L0:吊持材の全長の個体値、n0:原点位置に昇降台が位置するときの巻取ドラムの回転量、N:サンプル数(2以上の整数)、ni:第iサンプルにおける巻取ドラムの回転量、Li:第iサンプルにおける昇降台の昇降量。
但し、
L:昇降台の昇降量、n:巻取ドラムの回転量、t:吊持材の厚みの個体値、D:巻取ドラムの直径の個体値、L0:吊持材の全長の個体値、n0:原点位置に昇降台が位置するときの巻取ドラムの回転量。
但し、
L:昇降台7の昇降量、n:巻取ドラム61の回転量、t:ベルトBの厚みの個体値、D:巻取ドラム61の直径の個体値、L0:ベルトBの全長の個体値、n0:原点位置に昇降台7が位置するときの巻取ドラム61の回転量。
但し、
t:ベルトBの厚みの個体値、D:巻取ドラム61の直径の個体値、L0:ベルトBの全長の個体値、n0:原点位置に昇降台7が位置するときの巻取ドラム61の回転量、N:サンプル数(2以上の整数)、ni:第iサンプルにおける巻取ドラム61の回転量、Li:第iサンプルにおける昇降台7の昇降量。
Claims (7)
- 物品を移載する昇降台と、前記昇降台に取り付けられた吊持材を重ね巻きする巻取ドラムと、前記巻取ドラムの回転量を制御することにより前記昇降台の昇降量を制御するコントローラと、を備えた天井搬送車であって、
前記コントローラは、
前記天井搬送車の個体値として、前記吊持材の全長の個体値、前記巻取ドラムの直径の個体値、及び、前記吊持材の厚みの個体値を算出する第1処理と、
前記第1処理で算出した前記吊持材の全長の個体値、前記巻取ドラムの直径の個体値、及び、前記吊持材の厚みの個体値に基づいて、前記昇降台の昇降量に対する前記巻取ドラムの回転量を算出する第2処理と、を実行し、
前記第1処理では、前記昇降台の昇降量が、前記吊持材の全長の個体値と前記巻取ドラムの直径の個体値と前記吊持材の厚みの個体値とを係数として含む、前記巻取ドラムの回転量の二乗関数で近似されることを利用して、前記吊持材の全長の個体値、前記巻取ドラムの直径の個体値、及び、前記吊持材の厚みの個体値を算出し、
前記吊持材の全長は、前記巻取ドラムから前記吊持材の全てが引き出された状態から前記昇降台が原点位置に位置するまで前記吊持材が巻き取られた場合における、前記巻取ドラムに巻き取られた前記吊持材の長さに相当する、天井搬送車。 - 前記第1処理では、前記昇降台の昇降量及び当該昇降量のときの前記巻取ドラムの回転量からなるサンプルデータを2以上含むデータ群に基づいて、前記吊持材の全長の個体値、前記巻取ドラムの直径の個体値、及び、前記吊持材の厚みの個体値を算出する、請求項1に記載の天井搬送車。
- 前記コントローラは、
原点位置に前記昇降台を位置させた状態において、前記昇降台に保持された第1計測用部材と前記第1計測用部材の直下に配置された第2計測用部材との間の距離を検出するセンサにより検出した距離を、第1距離として取得する第1データ取得用処理と、
前記昇降台を設定昇降量だけ昇降させた状態において、前記センサにより検出した距離を第2距離として取得すると共に、前記第2距離から前記第1距離を減算した値、及び、当該設定昇降量のときの前記巻取ドラムの回転量を、前記サンプルデータにおける前記昇降台の昇降量及び前記巻取ドラムの回転量として取得する第2データ取得用処理と、
前記第2データ取得用処理を前記設定昇降量を変更して繰り返し実行する第3データ取得用処理と、を実行する、請求項2又は3に記載の天井搬送車。 - 複数回の前記第2データ取得用処理それぞれにおける前記設定昇降量を入力可能な入力部を備える、請求項4に記載の天井搬送車。
- 物品を移載する昇降台と、前記昇降台に取り付けられた吊持材を重ね巻きする巻取ドラムと、前記巻取ドラムの回転量を制御することにより前記昇降台の昇降量を制御するコントローラと、を備えた天井搬送車における、前記巻取ドラムの回転量を算出する方法であって、
前記天井搬送車の個体値として、前記吊持材の全長の個体値、前記巻取ドラムの直径の個体値、及び、前記吊持材の厚みの個体値を算出する第1ステップと、
前記第1ステップで算出した前記吊持材の全長の個体値、前記巻取ドラムの直径の個体値、及び、前記吊持材の厚みの個体値に基づいて、前記昇降台の昇降量に対する前記巻取ドラムの回転量を算出する第2ステップと、を含み、
前記第1ステップでは、前記昇降台の昇降量が、前記吊持材の全長の個体値と前記巻取ドラムの直径の個体値と前記吊持材の厚みの個体値とを係数として含む、前記巻取ドラムの回転量の二乗関数で近似されることを利用して、前記吊持材の全長の個体値、前記巻取ドラムの直径の個体値、及び、前記吊持材の厚みの個体値を算出し、
前記吊持材の全長は、前記巻取ドラムから前記吊持材の全てが引き出された状態から前記昇降台が原点位置に位置するまで前記吊持材が巻き取られた場合における、前記巻取ドラムに巻き取られた前記吊持材の長さに相当する、天井搬送車における巻取ドラムの回転量算出方法。
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JP2020169670A JP7310774B2 (ja) | 2020-10-07 | 2020-10-07 | 天井搬送車及び天井搬送車における巻取ドラムの回転量算出方法 |
US17/463,744 US12014945B2 (en) | 2020-10-07 | 2021-09-01 | Overhead transport vehicle and method for calculating rotation amount of winding drum in overhead transport vehicle |
CN202111113498.9A CN114291739A (zh) | 2020-10-07 | 2021-09-23 | 桥式输送车及桥式输送车中的卷取滚筒的旋转量计算方法 |
TW110137143A TWI833119B (zh) | 2020-10-07 | 2021-10-06 | 高架行走車及高架行走車之捲取鼓筒的旋轉量算出方法 |
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JP2020169670A JP7310774B2 (ja) | 2020-10-07 | 2020-10-07 | 天井搬送車及び天井搬送車における巻取ドラムの回転量算出方法 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009066610A (ja) | 2007-09-11 | 2009-04-02 | Ihi Corp | ダイクッション装置及びダイクッションの制御方法 |
JP2009292644A (ja) | 2008-06-09 | 2009-12-17 | Murata Mach Ltd | 搬送走行車 |
JP2016047747A (ja) | 2014-08-27 | 2016-04-07 | 村田機械株式会社 | 移載位置決定方法 |
JP2019043720A (ja) | 2017-09-01 | 2019-03-22 | 村田機械株式会社 | 天井搬送車システム及び天井搬送車でのティーチング方法 |
US20200176294A1 (en) | 2018-11-29 | 2020-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer transport system and method for transporting wafers |
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JPS587584B2 (ja) * | 1977-11-17 | 1983-02-10 | 川崎製鉄株式会社 | 巻取機におけるラツパ−ロ−ルの制御方法 |
JP3748940B2 (ja) * | 1995-03-20 | 2006-02-22 | 東京エレクトロン株式会社 | 位置決め装置,処理システムおよび位置決め方法 |
JPH09168128A (ja) * | 1995-12-18 | 1997-06-24 | Sharp Corp | 液晶テレビの共通電極電位調整装置 |
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- 2021-09-01 US US17/463,744 patent/US12014945B2/en active Active
- 2021-09-23 CN CN202111113498.9A patent/CN114291739A/zh active Pending
- 2021-10-06 TW TW110137143A patent/TWI833119B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009066610A (ja) | 2007-09-11 | 2009-04-02 | Ihi Corp | ダイクッション装置及びダイクッションの制御方法 |
JP2009292644A (ja) | 2008-06-09 | 2009-12-17 | Murata Mach Ltd | 搬送走行車 |
JP2016047747A (ja) | 2014-08-27 | 2016-04-07 | 村田機械株式会社 | 移載位置決定方法 |
JP2019043720A (ja) | 2017-09-01 | 2019-03-22 | 村田機械株式会社 | 天井搬送車システム及び天井搬送車でのティーチング方法 |
US20200176294A1 (en) | 2018-11-29 | 2020-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer transport system and method for transporting wafers |
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US12014945B2 (en) | 2024-06-18 |
US20220108905A1 (en) | 2022-04-07 |
CN114291739A (zh) | 2022-04-08 |
JP2022061622A (ja) | 2022-04-19 |
TW202215588A (zh) | 2022-04-16 |
TWI833119B (zh) | 2024-02-21 |
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