JP7309651B2 - 感光性組成物とその利用 - Google Patents

感光性組成物とその利用 Download PDF

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Publication number
JP7309651B2
JP7309651B2 JP2020062834A JP2020062834A JP7309651B2 JP 7309651 B2 JP7309651 B2 JP 7309651B2 JP 2020062834 A JP2020062834 A JP 2020062834A JP 2020062834 A JP2020062834 A JP 2020062834A JP 7309651 B2 JP7309651 B2 JP 7309651B2
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Japan
Prior art keywords
mass
meth
photosensitive composition
acrylic resin
organic binder
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JP2020062834A
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English (en)
Japanese (ja)
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JP2021162674A (ja
Inventor
重治 高田
省吾 長江
佑一朗 佐合
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Noritake Co Ltd
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Noritake Co Ltd
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Publication date
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Priority to JP2020062834A priority Critical patent/JP7309651B2/ja
Priority to TW110107583A priority patent/TW202140576A/zh
Priority to KR1020210037553A priority patent/KR20210122119A/ko
Priority to CN202110336149.7A priority patent/CN113467185B/zh
Publication of JP2021162674A publication Critical patent/JP2021162674A/ja
Priority to JP2022043605A priority patent/JP7446355B2/ja
Application granted granted Critical
Publication of JP7309651B2 publication Critical patent/JP7309651B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/0325—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polysaccharides, e.g. cellulose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/003—Apparatus or processes specially adapted for manufacturing conductors or cables using irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Conductive Materials (AREA)
JP2020062834A 2020-03-31 2020-03-31 感光性組成物とその利用 Active JP7309651B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020062834A JP7309651B2 (ja) 2020-03-31 2020-03-31 感光性組成物とその利用
TW110107583A TW202140576A (zh) 2020-03-31 2021-03-03 感光性組成物、複合體、電子零件及電子零件的製造方法
KR1020210037553A KR20210122119A (ko) 2020-03-31 2021-03-23 감광성 조성물, 복합체, 전자 부품, 및 전자 부품의 제조 방법
CN202110336149.7A CN113467185B (zh) 2020-03-31 2021-03-29 感光性组合物、复合体、电子部件及电子部件的制造方法
JP2022043605A JP7446355B2 (ja) 2020-03-31 2022-03-18 感光性組成物とその利用

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020062834A JP7309651B2 (ja) 2020-03-31 2020-03-31 感光性組成物とその利用

Related Child Applications (1)

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JP2022043605A Division JP7446355B2 (ja) 2020-03-31 2022-03-18 感光性組成物とその利用

Publications (2)

Publication Number Publication Date
JP2021162674A JP2021162674A (ja) 2021-10-11
JP7309651B2 true JP7309651B2 (ja) 2023-07-18

Family

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JP2020062834A Active JP7309651B2 (ja) 2020-03-31 2020-03-31 感光性組成物とその利用
JP2022043605A Active JP7446355B2 (ja) 2020-03-31 2022-03-18 感光性組成物とその利用

Family Applications After (1)

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JP2022043605A Active JP7446355B2 (ja) 2020-03-31 2022-03-18 感光性組成物とその利用

Country Status (4)

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JP (2) JP7309651B2 (enrdf_load_stackoverflow)
KR (1) KR20210122119A (enrdf_load_stackoverflow)
CN (1) CN113467185B (enrdf_load_stackoverflow)
TW (1) TW202140576A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115185160B (zh) * 2022-09-09 2023-06-27 之江实验室 基于纤维素衍生物的激光直写光刻胶组合物及图案化方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196455A (ja) 2005-01-05 2006-07-27 Samsung Sdi Co Ltd 感光性ペースト組成物、それを利用して製造されたｐｄｐ電極、及びそれを含むｐｄｐ
JP2019168575A (ja) 2018-03-23 2019-10-03 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1124520C (zh) * 1999-10-14 2003-10-15 财团法人工业技术研究院 一种水分散性负型感光性组合物
JP4197177B2 (ja) 2005-03-18 2008-12-17 東京応化工業株式会社 ブラックマトリックス形成用光硬化性樹脂組成物、これを用いた感光性フィルム、ブラックマトリックスの形成方法、ブラックマトリックス及びそのブラックマトリックスを有するプラズマディスプレイパネル
KR101142631B1 (ko) * 2007-12-14 2012-05-10 코오롱인더스트리 주식회사 샌드블라스트 레지스트용 감광성 수지 조성물 및 드라이필름 포토레지스트
US8329066B2 (en) * 2008-07-07 2012-12-11 Samsung Sdi Co., Ltd. Paste containing aluminum for preparing PDP electrode, method of preparing the PDP electrode using the paste and PDP electrode prepared using the method
JP2011007864A (ja) 2009-06-23 2011-01-13 Jsr Corp 感光性ペースト組成物およびパターン形成方法
TW201539483A (zh) 2014-04-02 2015-10-16 Toyo Boseki 感光性導電糊劑、導電性薄膜、電路及觸控面板
JP2017182901A (ja) 2016-03-28 2017-10-05 東レ株式会社 感光性導電ペースト及び、それを用いた電子部品の製造方法
JP6814237B2 (ja) * 2018-03-23 2021-01-13 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006196455A (ja) 2005-01-05 2006-07-27 Samsung Sdi Co Ltd 感光性ペースト組成物、それを利用して製造されたｐｄｐ電極、及びそれを含むｐｄｐ
JP2019168575A (ja) 2018-03-23 2019-10-03 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用

Also Published As

Publication number Publication date
CN113467185A (zh) 2021-10-01
JP2022103158A (ja) 2022-07-07
KR20210122119A (ko) 2021-10-08
TW202140576A (zh) 2021-11-01
JP2021162674A (ja) 2021-10-11
JP7446355B2 (ja) 2024-03-08
CN113467185B (zh) 2025-07-25

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