JP7308355B2 - レーザ加工モニタ装置、レーザ加工モニタ方法、およびレーザ加工装置 - Google Patents

レーザ加工モニタ装置、レーザ加工モニタ方法、およびレーザ加工装置 Download PDF

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JP7308355B2
JP7308355B2 JP2022514340A JP2022514340A JP7308355B2 JP 7308355 B2 JP7308355 B2 JP 7308355B2 JP 2022514340 A JP2022514340 A JP 2022514340A JP 2022514340 A JP2022514340 A JP 2022514340A JP 7308355 B2 JP7308355 B2 JP 7308355B2
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Prior art keywords
reference light
light source
sensor
optical path
laser processing
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Japanese (ja)
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JPWO2021205789A5 (https=
JPWO2021205789A1 (https=
Inventor
淳 梁瀬
雄祐 西崎
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Amada Co Ltd
Amada Weld Tech Co Ltd
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Amada Co Ltd
Amada Weld Tech Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Quality & Reliability (AREA)
  • Laser Beam Processing (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
JP2022514340A 2020-04-07 2021-03-04 レーザ加工モニタ装置、レーザ加工モニタ方法、およびレーザ加工装置 Active JP7308355B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020068853 2020-04-07
JP2020068853 2020-04-07
PCT/JP2021/008475 WO2021205789A1 (ja) 2020-04-07 2021-03-04 レーザ加工モニタ装置、レーザ加工モニタ方法、およびレーザ加工装置

Publications (3)

Publication Number Publication Date
JPWO2021205789A1 JPWO2021205789A1 (https=) 2021-10-14
JPWO2021205789A5 JPWO2021205789A5 (https=) 2022-12-20
JP7308355B2 true JP7308355B2 (ja) 2023-07-13

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JP2022514340A Active JP7308355B2 (ja) 2020-04-07 2021-03-04 レーザ加工モニタ装置、レーザ加工モニタ方法、およびレーザ加工装置

Country Status (5)

Country Link
US (1) US20230137623A1 (https=)
EP (1) EP4116027B1 (https=)
JP (1) JP7308355B2 (https=)
CN (1) CN115397601B (https=)
WO (1) WO2021205789A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021128707A1 (de) * 2021-11-04 2023-05-04 Precitec Gmbh & Co. Kg Verfahren zum Kalibrieren eines oder mehrerer optischer Sensoren eines Laserbearbeitungskopfes, Laserbearbeitungskopf und Laserbearbeitungssystem
CN114646386B (zh) * 2022-03-23 2026-03-10 广州德擎光学科技有限公司 一种光路校准模块

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004132793A (ja) 2002-10-09 2004-04-30 Nuclear Fuel Ind Ltd 燃料集合体の支持格子の溶接方法及び該方法にて形成された支持格子並びに該支持格子の製造装置
JP2005254314A (ja) 2004-03-15 2005-09-22 Mitsubishi Electric Corp レーザ加工装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11197863A (ja) * 1998-01-09 1999-07-27 Nikon Corp レーザ加工装置
US7681453B2 (en) * 2005-03-29 2010-03-23 Lockheed Martin Corporation System and method to calibrate multiple sensors
JP4757557B2 (ja) 2005-07-29 2011-08-24 ミヤチテクノス株式会社 レーザ加工ヘッド
JP2007098442A (ja) * 2005-10-05 2007-04-19 Toyota Motor Corp レーザ接合品質検査装置
JP4835730B2 (ja) * 2009-08-06 2011-12-14 横河電機株式会社 蛍光量または吸光量の測定方法および測定装置
US10072971B2 (en) * 2010-04-16 2018-09-11 Metal Improvement Company, Llc Flexible beam delivery system for high power laser systems
JP5358775B2 (ja) * 2010-06-24 2013-12-04 有限会社西原電子 欠陥電極検出装置
JP2014015352A (ja) * 2012-07-09 2014-01-30 Hitachi High-Technologies Corp 基板加工方法及び装置
DE102013209526B4 (de) * 2013-05-23 2015-04-30 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren, Computerprogrammprodukt und Vorrichtung zum Erkennen eines Schnittabrisses
US10166631B2 (en) * 2014-03-12 2019-01-01 Mitsubishi Electronic Corporation Laser processing head apparatus with camera monitor
WO2018185973A1 (ja) * 2017-04-04 2018-10-11 株式会社アマダミヤチ レーザ加工監視方法及びレーザ加工監視装置
CN108994455B (zh) * 2018-08-24 2024-04-05 浙江君华智慧物联科技有限公司 一种高效激光打孔及清洗光学系统
JP6997065B2 (ja) 2018-10-29 2022-01-17 株式会社三共 遊技機
CN110231610B (zh) * 2019-05-24 2022-12-02 武汉大学 星载激光测高仪有源光斑能量探测器检测标定平台及方法
US12042879B2 (en) * 2019-10-23 2024-07-23 Nps Co., Ltd. Laser apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004132793A (ja) 2002-10-09 2004-04-30 Nuclear Fuel Ind Ltd 燃料集合体の支持格子の溶接方法及び該方法にて形成された支持格子並びに該支持格子の製造装置
JP2005254314A (ja) 2004-03-15 2005-09-22 Mitsubishi Electric Corp レーザ加工装置

Also Published As

Publication number Publication date
WO2021205789A1 (ja) 2021-10-14
EP4116027B1 (en) 2024-08-14
EP4116027A1 (en) 2023-01-11
CN115397601B (zh) 2025-06-06
EP4116027A4 (en) 2023-09-06
US20230137623A1 (en) 2023-05-04
JPWO2021205789A1 (https=) 2021-10-14
CN115397601A (zh) 2022-11-25

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