JPWO2021205789A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2021205789A5
JPWO2021205789A5 JP2022514340A JP2022514340A JPWO2021205789A5 JP WO2021205789 A5 JPWO2021205789 A5 JP WO2021205789A5 JP 2022514340 A JP2022514340 A JP 2022514340A JP 2022514340 A JP2022514340 A JP 2022514340A JP WO2021205789 A5 JPWO2021205789 A5 JP WO2021205789A5
Authority
JP
Japan
Prior art keywords
light
optical path
light source
measured
folding mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022514340A
Other languages
English (en)
Japanese (ja)
Other versions
JP7308355B2 (ja
JPWO2021205789A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2021/008475 external-priority patent/WO2021205789A1/ja
Publication of JPWO2021205789A1 publication Critical patent/JPWO2021205789A1/ja
Publication of JPWO2021205789A5 publication Critical patent/JPWO2021205789A5/ja
Application granted granted Critical
Publication of JP7308355B2 publication Critical patent/JP7308355B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2022514340A 2020-04-07 2021-03-04 レーザ加工モニタ装置、レーザ加工モニタ方法、およびレーザ加工装置 Active JP7308355B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020068853 2020-04-07
JP2020068853 2020-04-07
PCT/JP2021/008475 WO2021205789A1 (ja) 2020-04-07 2021-03-04 レーザ加工モニタ装置、レーザ加工モニタ方法、およびレーザ加工装置

Publications (3)

Publication Number Publication Date
JPWO2021205789A1 JPWO2021205789A1 (https=) 2021-10-14
JPWO2021205789A5 true JPWO2021205789A5 (https=) 2022-12-20
JP7308355B2 JP7308355B2 (ja) 2023-07-13

Family

ID=78022917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514340A Active JP7308355B2 (ja) 2020-04-07 2021-03-04 レーザ加工モニタ装置、レーザ加工モニタ方法、およびレーザ加工装置

Country Status (5)

Country Link
US (1) US20230137623A1 (https=)
EP (1) EP4116027B1 (https=)
JP (1) JP7308355B2 (https=)
CN (1) CN115397601B (https=)
WO (1) WO2021205789A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021128707A1 (de) * 2021-11-04 2023-05-04 Precitec Gmbh & Co. Kg Verfahren zum Kalibrieren eines oder mehrerer optischer Sensoren eines Laserbearbeitungskopfes, Laserbearbeitungskopf und Laserbearbeitungssystem
CN114646386B (zh) * 2022-03-23 2026-03-10 广州德擎光学科技有限公司 一种光路校准模块

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11197863A (ja) * 1998-01-09 1999-07-27 Nikon Corp レーザ加工装置
JP2004132793A (ja) * 2002-10-09 2004-04-30 Nuclear Fuel Ind Ltd 燃料集合体の支持格子の溶接方法及び該方法にて形成された支持格子並びに該支持格子の製造装置
JP4453407B2 (ja) * 2004-03-15 2010-04-21 三菱電機株式会社 レーザ加工装置
US7681453B2 (en) * 2005-03-29 2010-03-23 Lockheed Martin Corporation System and method to calibrate multiple sensors
JP4757557B2 (ja) 2005-07-29 2011-08-24 ミヤチテクノス株式会社 レーザ加工ヘッド
JP2007098442A (ja) * 2005-10-05 2007-04-19 Toyota Motor Corp レーザ接合品質検査装置
JP4835730B2 (ja) * 2009-08-06 2011-12-14 横河電機株式会社 蛍光量または吸光量の測定方法および測定装置
US10072971B2 (en) * 2010-04-16 2018-09-11 Metal Improvement Company, Llc Flexible beam delivery system for high power laser systems
JP5358775B2 (ja) * 2010-06-24 2013-12-04 有限会社西原電子 欠陥電極検出装置
JP2014015352A (ja) * 2012-07-09 2014-01-30 Hitachi High-Technologies Corp 基板加工方法及び装置
DE102013209526B4 (de) * 2013-05-23 2015-04-30 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren, Computerprogrammprodukt und Vorrichtung zum Erkennen eines Schnittabrisses
US10166631B2 (en) * 2014-03-12 2019-01-01 Mitsubishi Electronic Corporation Laser processing head apparatus with camera monitor
WO2018185973A1 (ja) * 2017-04-04 2018-10-11 株式会社アマダミヤチ レーザ加工監視方法及びレーザ加工監視装置
CN108994455B (zh) * 2018-08-24 2024-04-05 浙江君华智慧物联科技有限公司 一种高效激光打孔及清洗光学系统
JP6997065B2 (ja) 2018-10-29 2022-01-17 株式会社三共 遊技機
CN110231610B (zh) * 2019-05-24 2022-12-02 武汉大学 星载激光测高仪有源光斑能量探测器检测标定平台及方法
US12042879B2 (en) * 2019-10-23 2024-07-23 Nps Co., Ltd. Laser apparatus

Similar Documents

Publication Publication Date Title
US9503708B2 (en) Systems and methods for reducing z-thickness and zero-order effects in depth cameras
US7528967B2 (en) Optical characteristic measuring apparatus and measuring method using light reflected from object to be measured
CN110763202B (zh) 导航装置及其照明系统和光束整形元件
JP2005504429A5 (https=)
WO2019007175A1 (zh) 一种高效光程折叠器件
JPWO2021205789A5 (https=)
JP7112311B2 (ja) 変位計測装置
TWI594532B (zh) 光源
US9945656B2 (en) Multi-function spectroscopic device
TW200846986A (en) Optical navigation device that utilizes a vertical cavity surface emitting laser (VCSEL) configured to emit visible coherent light
JPS6038613A (ja) 測距光学系
FR2625010A1 (fr) Illuminateur de forte puissance pour camera
JP2001105168A (ja) 出射光学系、出射光学系を備えたレーザ加工装置、及びレーザ加工方法
TWI543032B (zh) 光學導航裝置
CN215989637U (zh) 双波长的枪瞄准直光源模块
JP7656063B2 (ja) 反射型光センサ
CN101310209A (zh) 从一个光源提供几条正交的准直光束的光学系统
TWI729615B (zh) 反射式聚光干涉儀
US20240329204A1 (en) Distance measuring apparatus
US12416801B2 (en) Multiple light source configuration
TWI898328B (zh) 具有光源件之掃描鏡裝置
Domjan et al. Stripe illuminator based on LED array and parabolic mirror for active triangulation sensors used on mobile robots
EP4160195B1 (en) Thin film characteristic measuring apparatus
JP6955300B1 (ja) 光照射ユニット
TWI658895B (zh) 光輔助加工構造