JP7306449B2 - 高周波回路用積層体、フレキシブルプリント基板、及び積層体捲回体 - Google Patents

高周波回路用積層体、フレキシブルプリント基板、及び積層体捲回体 Download PDF

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Publication number
JP7306449B2
JP7306449B2 JP2021503529A JP2021503529A JP7306449B2 JP 7306449 B2 JP7306449 B2 JP 7306449B2 JP 2021503529 A JP2021503529 A JP 2021503529A JP 2021503529 A JP2021503529 A JP 2021503529A JP 7306449 B2 JP7306449 B2 JP 7306449B2
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Japan
Prior art keywords
laminate
resin layer
layer
group
frequency circuit
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Japanese (ja)
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JPWO2020179443A1 (zh
Inventor
功 西村
隆一 奥田
晋太郎 藤冨
了嗣 多田羅
伸行 宮木
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JSR Corp
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JSR Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
JP2021503529A 2019-03-01 2020-02-19 高周波回路用積層体、フレキシブルプリント基板、及び積層体捲回体 Active JP7306449B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019037593 2019-03-01
JP2019037593 2019-03-01
PCT/JP2020/006407 WO2020179443A1 (ja) 2019-03-01 2020-02-19 高周波回路用積層体及びその製造方法、フレキシブルプリント基板、ｂステージシート、並びに積層体捲回体

Publications (2)

Publication Number Publication Date
JPWO2020179443A1 JPWO2020179443A1 (zh) 2020-09-10
JP7306449B2 true JP7306449B2 (ja) 2023-07-11

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JP2021503529A Active JP7306449B2 (ja) 2019-03-01 2020-02-19 高周波回路用積層体、フレキシブルプリント基板、及び積層体捲回体

Country Status (5)

Country Link
JP (1) JP7306449B2 (zh)
KR (1) KR20210134641A (zh)
CN (1) CN113544191B (zh)
TW (1) TWI822966B (zh)
WO (1) WO2020179443A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI803168B (zh) * 2022-01-25 2023-05-21 欣興電子股份有限公司 電路板線路訊號強化方法及其結構
JP2024018566A (ja) * 2022-07-29 2024-02-08 長瀬産業株式会社 構造体

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008177243A (ja) 2007-01-16 2008-07-31 Nippon Steel Chem Co Ltd 多層プリント配線板の製造方法
JP2008284716A (ja) 2007-05-15 2008-11-27 Sumitomo Chemical Co Ltd 高分子フィルム積層体及びその製造方法、並びに、高分子フィルム積層体を用いたフレキシブル配線板。
JP2011040727A (ja) 2009-07-14 2011-02-24 Ajinomoto Co Inc 銅箔付き接着フィルム
JP2012151829A (ja) 2010-12-27 2012-08-09 Canon Components Inc フレキシブルプリント配線基板及び無線通信モジュール
JP2013184298A (ja) 2012-03-05 2013-09-19 Asahi Rubber Inc 金属箔付白色反射シートのロール原反、回路付白色反射シートのロール原反、及びそれらの製造方法
JP2014045076A (ja) 2012-08-27 2014-03-13 Nippon Kayaku Co Ltd 高周波回路用基板
JP2015209511A (ja) 2014-04-28 2015-11-24 Jsr株式会社 重合体組成物、重合体ペレット、成形体及びフィルム
JP2016032098A (ja) 2014-07-25 2016-03-07 Jsr株式会社 回路基板用樹脂基板、回路基板用樹脂組成物および回路基板
WO2016114287A1 (ja) 2015-01-13 2016-07-21 日立化成株式会社 フレキシブルプリント配線板用樹脂フィルム、樹脂付き金属箔、カバーレイフィルム、ボンディングシート及びフレキシブルプリント配線板
WO2016143447A1 (ja) 2015-03-11 2016-09-15 Jsr株式会社 重合体、樹脂組成物及び樹脂成形体
JP2016203426A (ja) 2015-04-17 2016-12-08 ナミックス株式会社 金属被膜付絶縁体、半導体装置、および金属被膜付絶縁体の製造方法
JP2017137486A (ja) 2016-02-04 2017-08-10 Jsr株式会社 樹脂組成物、重合体の製造方法及び成形体
WO2018056466A1 (ja) 2016-09-26 2018-03-29 日立化成株式会社 樹脂組成物、半導体用配線層積層体及び半導体装置
WO2019054334A1 (ja) 2017-09-15 2019-03-21 Jsr株式会社 高周波回路用積層体及びその製造方法、並びにｂステージシート

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6235787B2 (ja) 2013-03-29 2017-11-22 東レ・デュポン株式会社 高周波回路基板用カバーレイ
JP6388483B2 (ja) 2014-03-13 2018-09-12 東レ・デュポン株式会社 高周波回路基板用カバーレイ及びフレキシブルフラットケーブル用基材
JP2016087799A (ja) 2014-10-29 2016-05-23 東レ・デュポン株式会社 高周波回路基板用の長尺状積層体及びその製造方法
TWI625232B (zh) * 2016-02-26 2018-06-01 Fujifilm Corp 積層體、積層體的製造方法、半導體元件以及半導體元件的製造方法
EP3447081B1 (en) * 2016-04-20 2021-03-31 JSR Corporation Polymer, composition, molded article, cured product, and laminate
CN109789689A (zh) * 2016-09-29 2019-05-21 日铁化学材料株式会社 聚酰亚胺膜、铜张层叠板及电路基板

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008177243A (ja) 2007-01-16 2008-07-31 Nippon Steel Chem Co Ltd 多層プリント配線板の製造方法
JP2008284716A (ja) 2007-05-15 2008-11-27 Sumitomo Chemical Co Ltd 高分子フィルム積層体及びその製造方法、並びに、高分子フィルム積層体を用いたフレキシブル配線板。
JP2011040727A (ja) 2009-07-14 2011-02-24 Ajinomoto Co Inc 銅箔付き接着フィルム
JP2012151829A (ja) 2010-12-27 2012-08-09 Canon Components Inc フレキシブルプリント配線基板及び無線通信モジュール
JP2013184298A (ja) 2012-03-05 2013-09-19 Asahi Rubber Inc 金属箔付白色反射シートのロール原反、回路付白色反射シートのロール原反、及びそれらの製造方法
JP2014045076A (ja) 2012-08-27 2014-03-13 Nippon Kayaku Co Ltd 高周波回路用基板
JP2015209511A (ja) 2014-04-28 2015-11-24 Jsr株式会社 重合体組成物、重合体ペレット、成形体及びフィルム
JP2016032098A (ja) 2014-07-25 2016-03-07 Jsr株式会社 回路基板用樹脂基板、回路基板用樹脂組成物および回路基板
WO2016114287A1 (ja) 2015-01-13 2016-07-21 日立化成株式会社 フレキシブルプリント配線板用樹脂フィルム、樹脂付き金属箔、カバーレイフィルム、ボンディングシート及びフレキシブルプリント配線板
WO2016143447A1 (ja) 2015-03-11 2016-09-15 Jsr株式会社 重合体、樹脂組成物及び樹脂成形体
JP2016203426A (ja) 2015-04-17 2016-12-08 ナミックス株式会社 金属被膜付絶縁体、半導体装置、および金属被膜付絶縁体の製造方法
JP2017137486A (ja) 2016-02-04 2017-08-10 Jsr株式会社 樹脂組成物、重合体の製造方法及び成形体
WO2018056466A1 (ja) 2016-09-26 2018-03-29 日立化成株式会社 樹脂組成物、半導体用配線層積層体及び半導体装置
WO2019054334A1 (ja) 2017-09-15 2019-03-21 Jsr株式会社 高周波回路用積層体及びその製造方法、並びにｂステージシート

Also Published As

Publication number Publication date
KR20210134641A (ko) 2021-11-10
TW202102575A (zh) 2021-01-16
CN113544191B (zh) 2024-03-29
TWI822966B (zh) 2023-11-21
JPWO2020179443A1 (zh) 2020-09-10
CN113544191A (zh) 2021-10-22
WO2020179443A1 (ja) 2020-09-10

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