JP7306449B2 - 高周波回路用積層体、フレキシブルプリント基板、及び積層体捲回体 - Google Patents
高周波回路用積層体、フレキシブルプリント基板、及び積層体捲回体 Download PDFInfo
- Publication number
- JP7306449B2 JP7306449B2 JP2021503529A JP2021503529A JP7306449B2 JP 7306449 B2 JP7306449 B2 JP 7306449B2 JP 2021503529 A JP2021503529 A JP 2021503529A JP 2021503529 A JP2021503529 A JP 2021503529A JP 7306449 B2 JP7306449 B2 JP 7306449B2
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- resin layer
- layer
- group
- frequency circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
- C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
- C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019037593 | 2019-03-01 | ||
JP2019037593 | 2019-03-01 | ||
PCT/JP2020/006407 WO2020179443A1 (ja) | 2019-03-01 | 2020-02-19 | 高周波回路用積層体及びその製造方法、フレキシブルプリント基板、bステージシート、並びに積層体捲回体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020179443A1 JPWO2020179443A1 (zh) | 2020-09-10 |
JP7306449B2 true JP7306449B2 (ja) | 2023-07-11 |
Family
ID=72337888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021503529A Active JP7306449B2 (ja) | 2019-03-01 | 2020-02-19 | 高周波回路用積層体、フレキシブルプリント基板、及び積層体捲回体 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7306449B2 (zh) |
KR (1) | KR20210134641A (zh) |
CN (1) | CN113544191B (zh) |
TW (1) | TWI822966B (zh) |
WO (1) | WO2020179443A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI803168B (zh) * | 2022-01-25 | 2023-05-21 | 欣興電子股份有限公司 | 電路板線路訊號強化方法及其結構 |
JP2024018566A (ja) * | 2022-07-29 | 2024-02-08 | 長瀬産業株式会社 | 構造体 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008177243A (ja) | 2007-01-16 | 2008-07-31 | Nippon Steel Chem Co Ltd | 多層プリント配線板の製造方法 |
JP2008284716A (ja) | 2007-05-15 | 2008-11-27 | Sumitomo Chemical Co Ltd | 高分子フィルム積層体及びその製造方法、並びに、高分子フィルム積層体を用いたフレキシブル配線板。 |
JP2011040727A (ja) | 2009-07-14 | 2011-02-24 | Ajinomoto Co Inc | 銅箔付き接着フィルム |
JP2012151829A (ja) | 2010-12-27 | 2012-08-09 | Canon Components Inc | フレキシブルプリント配線基板及び無線通信モジュール |
JP2013184298A (ja) | 2012-03-05 | 2013-09-19 | Asahi Rubber Inc | 金属箔付白色反射シートのロール原反、回路付白色反射シートのロール原反、及びそれらの製造方法 |
JP2014045076A (ja) | 2012-08-27 | 2014-03-13 | Nippon Kayaku Co Ltd | 高周波回路用基板 |
JP2015209511A (ja) | 2014-04-28 | 2015-11-24 | Jsr株式会社 | 重合体組成物、重合体ペレット、成形体及びフィルム |
JP2016032098A (ja) | 2014-07-25 | 2016-03-07 | Jsr株式会社 | 回路基板用樹脂基板、回路基板用樹脂組成物および回路基板 |
WO2016114287A1 (ja) | 2015-01-13 | 2016-07-21 | 日立化成株式会社 | フレキシブルプリント配線板用樹脂フィルム、樹脂付き金属箔、カバーレイフィルム、ボンディングシート及びフレキシブルプリント配線板 |
WO2016143447A1 (ja) | 2015-03-11 | 2016-09-15 | Jsr株式会社 | 重合体、樹脂組成物及び樹脂成形体 |
JP2016203426A (ja) | 2015-04-17 | 2016-12-08 | ナミックス株式会社 | 金属被膜付絶縁体、半導体装置、および金属被膜付絶縁体の製造方法 |
JP2017137486A (ja) | 2016-02-04 | 2017-08-10 | Jsr株式会社 | 樹脂組成物、重合体の製造方法及び成形体 |
WO2018056466A1 (ja) | 2016-09-26 | 2018-03-29 | 日立化成株式会社 | 樹脂組成物、半導体用配線層積層体及び半導体装置 |
WO2019054334A1 (ja) | 2017-09-15 | 2019-03-21 | Jsr株式会社 | 高周波回路用積層体及びその製造方法、並びにbステージシート |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6235787B2 (ja) | 2013-03-29 | 2017-11-22 | 東レ・デュポン株式会社 | 高周波回路基板用カバーレイ |
JP6388483B2 (ja) | 2014-03-13 | 2018-09-12 | 東レ・デュポン株式会社 | 高周波回路基板用カバーレイ及びフレキシブルフラットケーブル用基材 |
JP2016087799A (ja) | 2014-10-29 | 2016-05-23 | 東レ・デュポン株式会社 | 高周波回路基板用の長尺状積層体及びその製造方法 |
TWI625232B (zh) * | 2016-02-26 | 2018-06-01 | Fujifilm Corp | 積層體、積層體的製造方法、半導體元件以及半導體元件的製造方法 |
EP3447081B1 (en) * | 2016-04-20 | 2021-03-31 | JSR Corporation | Polymer, composition, molded article, cured product, and laminate |
CN109789689A (zh) * | 2016-09-29 | 2019-05-21 | 日铁化学材料株式会社 | 聚酰亚胺膜、铜张层叠板及电路基板 |
-
2020
- 2020-02-19 KR KR1020217027486A patent/KR20210134641A/ko not_active Application Discontinuation
- 2020-02-19 CN CN202080017248.2A patent/CN113544191B/zh active Active
- 2020-02-19 WO PCT/JP2020/006407 patent/WO2020179443A1/ja active Application Filing
- 2020-02-19 JP JP2021503529A patent/JP7306449B2/ja active Active
- 2020-02-26 TW TW109106333A patent/TWI822966B/zh active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008177243A (ja) | 2007-01-16 | 2008-07-31 | Nippon Steel Chem Co Ltd | 多層プリント配線板の製造方法 |
JP2008284716A (ja) | 2007-05-15 | 2008-11-27 | Sumitomo Chemical Co Ltd | 高分子フィルム積層体及びその製造方法、並びに、高分子フィルム積層体を用いたフレキシブル配線板。 |
JP2011040727A (ja) | 2009-07-14 | 2011-02-24 | Ajinomoto Co Inc | 銅箔付き接着フィルム |
JP2012151829A (ja) | 2010-12-27 | 2012-08-09 | Canon Components Inc | フレキシブルプリント配線基板及び無線通信モジュール |
JP2013184298A (ja) | 2012-03-05 | 2013-09-19 | Asahi Rubber Inc | 金属箔付白色反射シートのロール原反、回路付白色反射シートのロール原反、及びそれらの製造方法 |
JP2014045076A (ja) | 2012-08-27 | 2014-03-13 | Nippon Kayaku Co Ltd | 高周波回路用基板 |
JP2015209511A (ja) | 2014-04-28 | 2015-11-24 | Jsr株式会社 | 重合体組成物、重合体ペレット、成形体及びフィルム |
JP2016032098A (ja) | 2014-07-25 | 2016-03-07 | Jsr株式会社 | 回路基板用樹脂基板、回路基板用樹脂組成物および回路基板 |
WO2016114287A1 (ja) | 2015-01-13 | 2016-07-21 | 日立化成株式会社 | フレキシブルプリント配線板用樹脂フィルム、樹脂付き金属箔、カバーレイフィルム、ボンディングシート及びフレキシブルプリント配線板 |
WO2016143447A1 (ja) | 2015-03-11 | 2016-09-15 | Jsr株式会社 | 重合体、樹脂組成物及び樹脂成形体 |
JP2016203426A (ja) | 2015-04-17 | 2016-12-08 | ナミックス株式会社 | 金属被膜付絶縁体、半導体装置、および金属被膜付絶縁体の製造方法 |
JP2017137486A (ja) | 2016-02-04 | 2017-08-10 | Jsr株式会社 | 樹脂組成物、重合体の製造方法及び成形体 |
WO2018056466A1 (ja) | 2016-09-26 | 2018-03-29 | 日立化成株式会社 | 樹脂組成物、半導体用配線層積層体及び半導体装置 |
WO2019054334A1 (ja) | 2017-09-15 | 2019-03-21 | Jsr株式会社 | 高周波回路用積層体及びその製造方法、並びにbステージシート |
Also Published As
Publication number | Publication date |
---|---|
KR20210134641A (ko) | 2021-11-10 |
TW202102575A (zh) | 2021-01-16 |
CN113544191B (zh) | 2024-03-29 |
TWI822966B (zh) | 2023-11-21 |
JPWO2020179443A1 (zh) | 2020-09-10 |
CN113544191A (zh) | 2021-10-22 |
WO2020179443A1 (ja) | 2020-09-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11134568B2 (en) | High-frequency circuit laminate and method for producing same, and B-stage sheet | |
TWI784050B (zh) | 電路基板 | |
TWI777950B (zh) | 聚醯亞胺、聚醯亞胺系黏著劑、薄膜狀黏著材料、黏著層、黏著薄片、附有樹脂之銅箔、覆銅積層板及印刷線路板、以及多層線路板及其製造方法 | |
JP4929623B2 (ja) | 変性ポリイミド樹脂を含有する熱硬化性樹脂組成物 | |
TWI637852B (zh) | Resin sheet with support | |
TW521552B (en) | Adhesive film and method for manufacturing multilayer printed wiring board comprising the same | |
JP4986256B2 (ja) | 変性ポリイミド樹脂を含有するプリプレグ | |
JP7306449B2 (ja) | 高周波回路用積層体、フレキシブルプリント基板、及び積層体捲回体 | |
JP4929634B2 (ja) | 接着層付き金属箔及び金属張積層板 | |
JP7115165B2 (ja) | 高周波回路用積層体及びフレキシブルプリント基板 | |
WO2022034872A1 (ja) | 樹脂層付き銅箔、及び、これを用いた積層体 | |
US20220022314A1 (en) | Composite and copper clad laminate made therefrom | |
TWI740802B (zh) | 支撐體、接著片、層合構造體、半導體裝置及印刷電路板之製造方法 | |
JP7087859B2 (ja) | 積層体捲回体 | |
KR20060129081A (ko) | 가요성 프린트 배선용 기판과 그의 제조방법 | |
KR20170005506A (ko) | 동박 적층판용 접착제 | |
JP2006051687A (ja) | 接着層付き金属箔及び金属張積層板 | |
JP2022060293A (ja) | プリント配線板の製造方法 | |
TW202231702A (zh) | 樹脂組成物、硬化物、片狀層合材料、樹脂片、印刷配線板及半導體裝置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220614 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220913 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221020 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230110 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230309 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230530 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230612 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7306449 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |