JP7301662B2 - 基板処理方法および基板処理装置 - Google Patents

基板処理方法および基板処理装置 Download PDF

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Publication number
JP7301662B2
JP7301662B2 JP2019138966A JP2019138966A JP7301662B2 JP 7301662 B2 JP7301662 B2 JP 7301662B2 JP 2019138966 A JP2019138966 A JP 2019138966A JP 2019138966 A JP2019138966 A JP 2019138966A JP 7301662 B2 JP7301662 B2 JP 7301662B2
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JP
Japan
Prior art keywords
liquid
substrate
liquid film
film
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019138966A
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English (en)
Japanese (ja)
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JP2021022671A (ja
JP2021022671A5 (cg-RX-API-DMAC10.html
Inventor
学 奥谷
博史 阿部
岳明 石津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2019138966A priority Critical patent/JP7301662B2/ja
Priority to US16/935,204 priority patent/US11524314B2/en
Priority to CN202010708287.9A priority patent/CN112309903B/zh
Priority to KR1020200091383A priority patent/KR102412306B1/ko
Priority to TW109125222A priority patent/TWI728881B/zh
Publication of JP2021022671A publication Critical patent/JP2021022671A/ja
Publication of JP2021022671A5 publication Critical patent/JP2021022671A5/ja
Application granted granted Critical
Publication of JP7301662B2 publication Critical patent/JP7301662B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/56—Three layers or more
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2019138966A 2019-07-29 2019-07-29 基板処理方法および基板処理装置 Active JP7301662B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2019138966A JP7301662B2 (ja) 2019-07-29 2019-07-29 基板処理方法および基板処理装置
US16/935,204 US11524314B2 (en) 2019-07-29 2020-07-22 Substrate processing method and substrate processing device
CN202010708287.9A CN112309903B (zh) 2019-07-29 2020-07-22 基板处理方法及基板处理装置
KR1020200091383A KR102412306B1 (ko) 2019-07-29 2020-07-23 기판 처리방법 및 기판 처리장치
TW109125222A TWI728881B (zh) 2019-07-29 2020-07-27 基板處理方法及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019138966A JP7301662B2 (ja) 2019-07-29 2019-07-29 基板処理方法および基板処理装置

Publications (3)

Publication Number Publication Date
JP2021022671A JP2021022671A (ja) 2021-02-18
JP2021022671A5 JP2021022671A5 (cg-RX-API-DMAC10.html) 2021-05-13
JP7301662B2 true JP7301662B2 (ja) 2023-07-03

Family

ID=74258530

Family Applications (1)

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JP2019138966A Active JP7301662B2 (ja) 2019-07-29 2019-07-29 基板処理方法および基板処理装置

Country Status (5)

Country Link
US (1) US11524314B2 (cg-RX-API-DMAC10.html)
JP (1) JP7301662B2 (cg-RX-API-DMAC10.html)
KR (1) KR102412306B1 (cg-RX-API-DMAC10.html)
CN (1) CN112309903B (cg-RX-API-DMAC10.html)
TW (1) TWI728881B (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102905150B1 (ko) * 2021-10-14 2025-12-30 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102889410B1 (ko) 2021-10-14 2025-11-24 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP2025006094A (ja) * 2023-06-29 2025-01-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2025030911A (ja) * 2023-08-24 2025-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2025033160A (ja) * 2023-08-29 2025-03-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091364A (ja) 2006-09-29 2008-04-17 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2008153452A (ja) 2006-12-18 2008-07-03 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2016186971A (ja) 2015-03-27 2016-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2017183634A (ja) 2016-03-31 2017-10-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2019057625A (ja) 2017-09-21 2019-04-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2019102698A (ja) 2017-12-05 2019-06-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008034553A (ja) 2006-07-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板保持装置
JP2010050143A (ja) 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4927158B2 (ja) 2009-12-25 2012-05-09 東京エレクトロン株式会社 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置
JP6223839B2 (ja) * 2013-03-15 2017-11-01 東京エレクトロン株式会社 基板液処理方法、基板液処理装置および記憶媒体
JP6376554B2 (ja) * 2014-03-26 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10249487B2 (en) * 2015-01-23 2019-04-02 SCREEN Holdings Co., Ltd. Substrate processing method
JP6592303B2 (ja) 2015-08-14 2019-10-16 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄方法および基板洗浄装置
JP6642868B2 (ja) 2015-08-18 2020-02-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US20180204743A1 (en) 2015-08-18 2018-07-19 SCREEN Holdings Co., Ltd. Substrate treatment method and substrate treatment device
JP6613181B2 (ja) * 2016-03-17 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102336394B1 (ko) 2017-03-17 2021-12-08 현대자동차주식회사 연료전지 공기 공급 제어방법 및 시스템
JP7208091B2 (ja) 2019-04-18 2023-01-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091364A (ja) 2006-09-29 2008-04-17 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2008153452A (ja) 2006-12-18 2008-07-03 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2016186971A (ja) 2015-03-27 2016-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2017183634A (ja) 2016-03-31 2017-10-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2019057625A (ja) 2017-09-21 2019-04-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2019102698A (ja) 2017-12-05 2019-06-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
US11524314B2 (en) 2022-12-13
CN112309903B (zh) 2024-09-06
KR20210014077A (ko) 2021-02-08
US20210031228A1 (en) 2021-02-04
TW202105572A (zh) 2021-02-01
JP2021022671A (ja) 2021-02-18
TWI728881B (zh) 2021-05-21
CN112309903A (zh) 2021-02-02
KR102412306B1 (ko) 2022-06-22

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