TWI728881B - 基板處理方法及基板處理裝置 - Google Patents

基板處理方法及基板處理裝置 Download PDF

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Publication number
TWI728881B
TWI728881B TW109125222A TW109125222A TWI728881B TW I728881 B TWI728881 B TW I728881B TW 109125222 A TW109125222 A TW 109125222A TW 109125222 A TW109125222 A TW 109125222A TW I728881 B TWI728881 B TW I728881B
Authority
TW
Taiwan
Prior art keywords
liquid
substrate
liquid film
film
gas
Prior art date
Application number
TW109125222A
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English (en)
Chinese (zh)
Other versions
TW202105572A (zh
Inventor
奥谷学
阿部博史
石津岳明
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202105572A publication Critical patent/TW202105572A/zh
Application granted granted Critical
Publication of TWI728881B publication Critical patent/TWI728881B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/56—Three layers or more
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW109125222A 2019-07-29 2020-07-27 基板處理方法及基板處理裝置 TWI728881B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019138966A JP7301662B2 (ja) 2019-07-29 2019-07-29 基板処理方法および基板処理装置
JP2019-138966 2019-07-29

Publications (2)

Publication Number Publication Date
TW202105572A TW202105572A (zh) 2021-02-01
TWI728881B true TWI728881B (zh) 2021-05-21

Family

ID=74258530

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109125222A TWI728881B (zh) 2019-07-29 2020-07-27 基板處理方法及基板處理裝置

Country Status (5)

Country Link
US (1) US11524314B2 (cg-RX-API-DMAC10.html)
JP (1) JP7301662B2 (cg-RX-API-DMAC10.html)
KR (1) KR102412306B1 (cg-RX-API-DMAC10.html)
CN (1) CN112309903B (cg-RX-API-DMAC10.html)
TW (1) TWI728881B (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102905150B1 (ko) * 2021-10-14 2025-12-30 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102889410B1 (ko) 2021-10-14 2025-11-24 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP2025006094A (ja) * 2023-06-29 2025-01-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2025030911A (ja) * 2023-08-24 2025-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2025033160A (ja) * 2023-08-29 2025-03-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140216506A1 (en) * 2009-12-25 2014-08-07 Tokyo Electron Limited Substrate processing apparatus
US20170043379A1 (en) * 2015-08-14 2017-02-16 SCREEN Holdings Co., Ltd. Substrate cleaning method and substrate cleaning apparatus
US20170282210A1 (en) * 2016-03-31 2017-10-05 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing apparatus
US20180269506A1 (en) * 2017-03-17 2018-09-20 Hyundai Motor Company Air supply control method and system for fuel cell

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008034553A (ja) 2006-07-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板保持装置
JP2008091364A (ja) * 2006-09-29 2008-04-17 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4960075B2 (ja) 2006-12-18 2012-06-27 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP2010050143A (ja) 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP6223839B2 (ja) * 2013-03-15 2017-11-01 東京エレクトロン株式会社 基板液処理方法、基板液処理装置および記憶媒体
JP6376554B2 (ja) * 2014-03-26 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US10249487B2 (en) * 2015-01-23 2019-04-02 SCREEN Holdings Co., Ltd. Substrate processing method
JP6453688B2 (ja) 2015-03-27 2019-01-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6642868B2 (ja) 2015-08-18 2020-02-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US20180204743A1 (en) 2015-08-18 2018-07-19 SCREEN Holdings Co., Ltd. Substrate treatment method and substrate treatment device
JP6613181B2 (ja) * 2016-03-17 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6953255B2 (ja) 2017-09-21 2021-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7008489B2 (ja) 2017-12-05 2022-01-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7208091B2 (ja) 2019-04-18 2023-01-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140216506A1 (en) * 2009-12-25 2014-08-07 Tokyo Electron Limited Substrate processing apparatus
US20170043379A1 (en) * 2015-08-14 2017-02-16 SCREEN Holdings Co., Ltd. Substrate cleaning method and substrate cleaning apparatus
US20170282210A1 (en) * 2016-03-31 2017-10-05 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing apparatus
US20180269506A1 (en) * 2017-03-17 2018-09-20 Hyundai Motor Company Air supply control method and system for fuel cell

Also Published As

Publication number Publication date
US11524314B2 (en) 2022-12-13
CN112309903B (zh) 2024-09-06
KR20210014077A (ko) 2021-02-08
US20210031228A1 (en) 2021-02-04
TW202105572A (zh) 2021-02-01
JP2021022671A (ja) 2021-02-18
JP7301662B2 (ja) 2023-07-03
CN112309903A (zh) 2021-02-02
KR102412306B1 (ko) 2022-06-22

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