KR102412306B1 - 기판 처리방법 및 기판 처리장치 - Google Patents

기판 처리방법 및 기판 처리장치 Download PDF

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Publication number
KR102412306B1
KR102412306B1 KR1020200091383A KR20200091383A KR102412306B1 KR 102412306 B1 KR102412306 B1 KR 102412306B1 KR 1020200091383 A KR1020200091383 A KR 1020200091383A KR 20200091383 A KR20200091383 A KR 20200091383A KR 102412306 B1 KR102412306 B1 KR 102412306B1
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South Korea
Prior art keywords
liquid
substrate
liquid film
film
gas
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KR1020200091383A
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English (en)
Korean (ko)
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KR20210014077A (ko
Inventor
마나부 오쿠타니
히로시 아베
타카아키 이시즈
Original Assignee
가부시키가이샤 스크린 홀딩스
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Publication of KR20210014077A publication Critical patent/KR20210014077A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H01L21/02057—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/06—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with a blast of gas or vapour
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/56—Three layers or more
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
    • H01L21/67034—
    • H01L21/67051—
    • H01L21/67098—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020200091383A 2019-07-29 2020-07-23 기판 처리방법 및 기판 처리장치 Active KR102412306B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-138966 2019-07-29
JP2019138966A JP7301662B2 (ja) 2019-07-29 2019-07-29 基板処理方法および基板処理装置

Publications (2)

Publication Number Publication Date
KR20210014077A KR20210014077A (ko) 2021-02-08
KR102412306B1 true KR102412306B1 (ko) 2022-06-22

Family

ID=74258530

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200091383A Active KR102412306B1 (ko) 2019-07-29 2020-07-23 기판 처리방법 및 기판 처리장치

Country Status (5)

Country Link
US (1) US11524314B2 (cg-RX-API-DMAC10.html)
JP (1) JP7301662B2 (cg-RX-API-DMAC10.html)
KR (1) KR102412306B1 (cg-RX-API-DMAC10.html)
CN (1) CN112309903B (cg-RX-API-DMAC10.html)
TW (1) TWI728881B (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102905150B1 (ko) * 2021-10-14 2025-12-30 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102889410B1 (ko) 2021-10-14 2025-11-24 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP2025006094A (ja) * 2023-06-29 2025-01-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2025030911A (ja) * 2023-08-24 2025-03-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2025033160A (ja) * 2023-08-29 2025-03-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160214148A1 (en) * 2015-01-23 2016-07-28 SCREEN Holdings Co., Ltd. Substrate processing method

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008034553A (ja) 2006-07-27 2008-02-14 Dainippon Screen Mfg Co Ltd 基板保持装置
JP2008091364A (ja) * 2006-09-29 2008-04-17 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4960075B2 (ja) 2006-12-18 2012-06-27 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP2010050143A (ja) 2008-08-19 2010-03-04 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP4927158B2 (ja) 2009-12-25 2012-05-09 東京エレクトロン株式会社 基板処理方法、その基板処理方法を実行させるためのプログラムを記録した記録媒体及び基板処理装置
JP6223839B2 (ja) * 2013-03-15 2017-11-01 東京エレクトロン株式会社 基板液処理方法、基板液処理装置および記憶媒体
JP6376554B2 (ja) * 2014-03-26 2018-08-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6453688B2 (ja) 2015-03-27 2019-01-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6592303B2 (ja) 2015-08-14 2019-10-16 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄方法および基板洗浄装置
JP6642868B2 (ja) 2015-08-18 2020-02-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US20180204743A1 (en) 2015-08-18 2018-07-19 SCREEN Holdings Co., Ltd. Substrate treatment method and substrate treatment device
JP6613181B2 (ja) * 2016-03-17 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6671217B2 (ja) 2016-03-31 2020-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
KR102336394B1 (ko) 2017-03-17 2021-12-08 현대자동차주식회사 연료전지 공기 공급 제어방법 및 시스템
JP6953255B2 (ja) 2017-09-21 2021-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7008489B2 (ja) 2017-12-05 2022-01-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7208091B2 (ja) 2019-04-18 2023-01-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160214148A1 (en) * 2015-01-23 2016-07-28 SCREEN Holdings Co., Ltd. Substrate processing method

Also Published As

Publication number Publication date
US11524314B2 (en) 2022-12-13
CN112309903B (zh) 2024-09-06
KR20210014077A (ko) 2021-02-08
US20210031228A1 (en) 2021-02-04
TW202105572A (zh) 2021-02-01
JP2021022671A (ja) 2021-02-18
TWI728881B (zh) 2021-05-21
JP7301662B2 (ja) 2023-07-03
CN112309903A (zh) 2021-02-02

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