JP7287300B2 - 電力変換装置 - Google Patents

電力変換装置 Download PDF

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Publication number
JP7287300B2
JP7287300B2 JP2020018239A JP2020018239A JP7287300B2 JP 7287300 B2 JP7287300 B2 JP 7287300B2 JP 2020018239 A JP2020018239 A JP 2020018239A JP 2020018239 A JP2020018239 A JP 2020018239A JP 7287300 B2 JP7287300 B2 JP 7287300B2
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JP
Japan
Prior art keywords
modules
semiconductor
phase
module
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020018239A
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English (en)
Japanese (ja)
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JP2021125978A5 (enrdf_load_stackoverflow
JP2021125978A (ja
Inventor
貴弘 留田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2020018239A priority Critical patent/JP7287300B2/ja
Priority to PCT/JP2020/046523 priority patent/WO2021157199A1/ja
Publication of JP2021125978A publication Critical patent/JP2021125978A/ja
Publication of JP2021125978A5 publication Critical patent/JP2021125978A5/ja
Application granted granted Critical
Publication of JP7287300B2 publication Critical patent/JP7287300B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2020018239A 2020-02-05 2020-02-05 電力変換装置 Active JP7287300B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020018239A JP7287300B2 (ja) 2020-02-05 2020-02-05 電力変換装置
PCT/JP2020/046523 WO2021157199A1 (ja) 2020-02-05 2020-12-14 電力変換装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020018239A JP7287300B2 (ja) 2020-02-05 2020-02-05 電力変換装置

Publications (3)

Publication Number Publication Date
JP2021125978A JP2021125978A (ja) 2021-08-30
JP2021125978A5 JP2021125978A5 (enrdf_load_stackoverflow) 2022-07-11
JP7287300B2 true JP7287300B2 (ja) 2023-06-06

Family

ID=77199909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020018239A Active JP7287300B2 (ja) 2020-02-05 2020-02-05 電力変換装置

Country Status (2)

Country Link
JP (1) JP7287300B2 (enrdf_load_stackoverflow)
WO (1) WO2021157199A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024046297A (ja) * 2022-09-22 2024-04-03 トヨタ自動車株式会社 電力変換装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006141096A (ja) 2004-11-10 2006-06-01 Toyota Motor Corp 半導体装置
JP2009254189A (ja) 2008-04-09 2009-10-29 Denso Corp 電力変換装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7107043B2 (ja) * 2018-07-11 2022-07-27 株式会社デンソー 電力変換装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006141096A (ja) 2004-11-10 2006-06-01 Toyota Motor Corp 半導体装置
JP2009254189A (ja) 2008-04-09 2009-10-29 Denso Corp 電力変換装置

Also Published As

Publication number Publication date
JP2021125978A (ja) 2021-08-30
WO2021157199A1 (ja) 2021-08-12

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