JP7279319B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP7279319B2
JP7279319B2 JP2018161660A JP2018161660A JP7279319B2 JP 7279319 B2 JP7279319 B2 JP 7279319B2 JP 2018161660 A JP2018161660 A JP 2018161660A JP 2018161660 A JP2018161660 A JP 2018161660A JP 7279319 B2 JP7279319 B2 JP 7279319B2
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Japan
Prior art keywords
resin composition
resin
conductor layer
mass
layer
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Active
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JP2018161660A
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English (en)
Japanese (ja)
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JP2019044180A (ja
Inventor
嘉生 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
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Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of JP2019044180A publication Critical patent/JP2019044180A/ja
Priority to JP2023013813A priority Critical patent/JP2023052814A/ja
Application granted granted Critical
Publication of JP7279319B2 publication Critical patent/JP7279319B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2018161660A 2017-09-04 2018-08-30 樹脂組成物 Active JP7279319B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023013813A JP2023052814A (ja) 2017-09-04 2023-02-01 樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017169816 2017-09-04
JP2017169816 2017-09-04

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023013813A Division JP2023052814A (ja) 2017-09-04 2023-02-01 樹脂組成物

Publications (2)

Publication Number Publication Date
JP2019044180A JP2019044180A (ja) 2019-03-22
JP7279319B2 true JP7279319B2 (ja) 2023-05-23

Family

ID=65514791

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018161660A Active JP7279319B2 (ja) 2017-09-04 2018-08-30 樹脂組成物
JP2023013813A Pending JP2023052814A (ja) 2017-09-04 2023-02-01 樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023013813A Pending JP2023052814A (ja) 2017-09-04 2023-02-01 樹脂組成物

Country Status (4)

Country Link
JP (2) JP7279319B2 (zh)
KR (2) KR102560184B1 (zh)
CN (1) CN109423014A (zh)
TW (1) TW201922908A (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6870544B2 (ja) * 2017-09-04 2021-05-12 味の素株式会社 樹脂組成物
JP2019173009A (ja) * 2018-03-28 2019-10-10 積水化学工業株式会社 硬化体、樹脂材料及び多層プリント配線板
CN111836843A (zh) * 2018-03-28 2020-10-27 积水化学工业株式会社 树脂材料及多层印刷布线板
JP7305326B2 (ja) * 2018-09-28 2023-07-10 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7124770B2 (ja) * 2019-03-07 2022-08-24 味の素株式会社 樹脂組成物
JP7192674B2 (ja) * 2019-06-20 2022-12-20 味の素株式会社 樹脂シート
JP7222320B2 (ja) * 2019-06-25 2023-02-15 味の素株式会社 樹脂組成物
JP7354774B2 (ja) * 2019-11-01 2023-10-03 味の素株式会社 樹脂組成物
WO2023149209A1 (ja) * 2022-02-03 2023-08-10 味の素株式会社 樹脂組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007032424A1 (ja) 2005-09-15 2007-03-22 Sekisui Chemical Co., Ltd. 樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板、および多層積層板
JP2016027097A (ja) 2014-06-30 2016-02-18 味の素株式会社 樹脂組成物
JP2017101138A (ja) 2015-12-01 2017-06-08 味の素株式会社 樹脂組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4951816B2 (ja) * 2001-03-30 2012-06-13 日立化成工業株式会社 プリント配線板用絶縁樹脂組成物及びその用途
TWI378938B (en) * 2006-01-13 2012-12-11 Fushimi Pharmaceutical Co Ltd Cyclic cyanato group-containing phosphazene compound and method for making such compound
JP5088146B2 (ja) * 2008-01-11 2012-12-05 横浜ゴム株式会社 封止剤用液状エポキシ樹脂組成物
CN102822272A (zh) * 2011-03-31 2012-12-12 积水化学工业株式会社 预固化物、粗糙化预固化物及层叠体
WO2014004900A2 (en) * 2012-06-27 2014-01-03 Toray Composites (America), Inc. Benzoxazine resin composition, prepreg, and fiber-reinforced composite material
JP6269294B2 (ja) * 2014-04-24 2018-01-31 味の素株式会社 プリント配線板の絶縁層用樹脂組成物
JP6413831B2 (ja) * 2015-02-24 2018-10-31 味の素株式会社 回路基板及びその製造方法
KR20160118962A (ko) * 2015-04-03 2016-10-12 스미토모 베이클리트 컴퍼니 리미티드 프리프레그, 수지 기판, 금속 부착 적층판, 프린트 배선 기판, 및 반도체 장치
CN105504681B (zh) * 2015-12-17 2018-05-29 广东生益科技股份有限公司 一种热固性树脂组合物以及含有它的预浸料、层压板以及印制电路板
JP6489148B2 (ja) * 2017-04-05 2019-03-27 味の素株式会社 樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007032424A1 (ja) 2005-09-15 2007-03-22 Sekisui Chemical Co., Ltd. 樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板、および多層積層板
JP2016027097A (ja) 2014-06-30 2016-02-18 味の素株式会社 樹脂組成物
JP2017101138A (ja) 2015-12-01 2017-06-08 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
KR20230113507A (ko) 2023-07-31
TW201922908A (zh) 2019-06-16
CN109423014A (zh) 2019-03-05
KR20190026615A (ko) 2019-03-13
KR102560184B1 (ko) 2023-07-28
KR102671534B1 (ko) 2024-06-04
JP2019044180A (ja) 2019-03-22
JP2023052814A (ja) 2023-04-12

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