JP7270937B2 - セラミックベースマイクロホットプレート及びその製造方法 - Google Patents

セラミックベースマイクロホットプレート及びその製造方法 Download PDF

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Publication number
JP7270937B2
JP7270937B2 JP2020573472A JP2020573472A JP7270937B2 JP 7270937 B2 JP7270937 B2 JP 7270937B2 JP 2020573472 A JP2020573472 A JP 2020573472A JP 2020573472 A JP2020573472 A JP 2020573472A JP 7270937 B2 JP7270937 B2 JP 7270937B2
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ceramic
hotplate
glass
heating
micro
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Japanese (ja)
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JP2022506000A (ja
Inventor
▲錦▼ 王
程 ▲張▼
克▲棟▼ ▲張▼
奇 ▲馮▼
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Suzhou Nanogrid Technology Co Ltd
SAIC Motor Corp Ltd
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Suzhou Nanogrid Technology Co Ltd
SAIC Motor Corp Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
JP2020573472A 2018-06-29 2019-06-27 セラミックベースマイクロホットプレート及びその製造方法 Active JP7270937B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201810714351.7A CN110655034A (zh) 2018-06-29 2018-06-29 一种陶瓷基微热板及其制备方法
CN201810714351.7 2018-06-29
PCT/CN2019/093361 WO2020001555A1 (zh) 2018-06-29 2019-06-27 一种陶瓷基微热板及其制备方法

Publications (2)

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JP2022506000A JP2022506000A (ja) 2022-01-17
JP7270937B2 true JP7270937B2 (ja) 2023-05-11

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JP2020573472A Active JP7270937B2 (ja) 2018-06-29 2019-06-27 セラミックベースマイクロホットプレート及びその製造方法

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JP (1) JP7270937B2 (zh)
CN (1) CN110655034A (zh)
WO (1) WO2020001555A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112408311A (zh) * 2020-12-02 2021-02-26 苏州麦茂思传感技术有限公司 一种陶瓷悬梁式mems微热板及其制造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002174617A (ja) 2000-12-07 2002-06-21 Matsushita Electric Ind Co Ltd ガスセンサ
JP2005149751A (ja) 2003-11-11 2005-06-09 Olympus Corp 発熱素子
JP2008238090A (ja) 2007-03-28 2008-10-09 Kyocera Corp マイクロ流路体
WO2009078370A1 (ja) 2007-12-14 2009-06-25 Ngk Spark Plug Co., Ltd. ガスセンサ
JP2010204029A (ja) 2009-03-05 2010-09-16 Kobe Steel Ltd 中空構造素子
JP2017219441A (ja) 2016-06-08 2017-12-14 Ｎｉｓｓｈａ株式会社 Ｍｅｍｓガスセンサ、ｍｅｍｓガスセンサ実装体、ｍｅｍｓガスセンサ・パッケージ、ｍｅｍｓガスセンサ組立体、及びｍｅｍｓガスセンサの製造方法
US20180038816A1 (en) 2016-08-05 2018-02-08 National Applied Research Laboratories Miniature gas sensor and method for manufacturing the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3204365B2 (ja) * 1996-03-29 2001-09-04 矢崎総業株式会社 マイクロヒータ及びｃｏセンサ
JP4845469B2 (ja) * 2005-10-07 2011-12-28 富士電機株式会社 薄膜ガスセンサ
CN100442036C (zh) * 2006-04-28 2008-12-10 中国科学院合肥物质科学研究院 一种双电容厚膜陶瓷感压元件的制备方法
US8024958B2 (en) * 2007-05-18 2011-09-27 Life Safety Distribution Ag Gas sensors with thermally insulating ceramic substrates
KR100917792B1 (ko) * 2007-07-06 2009-09-24 전자부품연구원 반사판을 구비한 마이크로 히터 및 그 제조방법
DE102011003481A1 (de) * 2011-02-02 2012-08-02 Robert Bosch Gmbh Elektronisches Bauteil umfassend einen keramischen träger und Verwendung eines keramischen Trägers
CN104165902B (zh) * 2014-07-18 2017-01-18 苏州能斯达电子科技有限公司 一种具有绝热沟槽的mems气体传感器及其加工方法
CN204873818U (zh) * 2015-05-05 2015-12-16 广州大学 微弹簧式悬臂梁自带均热板微加热器
CN106744652B (zh) * 2017-02-10 2019-04-30 苏州甫一电子科技有限公司 复合结构的mems微加热芯片及其制造方法与应用
CN107192744A (zh) * 2017-04-01 2017-09-22 上海申矽凌微电子科技有限公司 气敏电阻的制造方法及使用该方法制造的气体传感器
CN107381495B (zh) * 2017-08-14 2023-11-14 南方科技大学 一种mems微热板及其制造方法
CN208440276U (zh) * 2018-06-29 2019-01-29 上海汽车集团股份有限公司 一种陶瓷基微热板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002174617A (ja) 2000-12-07 2002-06-21 Matsushita Electric Ind Co Ltd ガスセンサ
JP2005149751A (ja) 2003-11-11 2005-06-09 Olympus Corp 発熱素子
JP2008238090A (ja) 2007-03-28 2008-10-09 Kyocera Corp マイクロ流路体
WO2009078370A1 (ja) 2007-12-14 2009-06-25 Ngk Spark Plug Co., Ltd. ガスセンサ
JP2010204029A (ja) 2009-03-05 2010-09-16 Kobe Steel Ltd 中空構造素子
JP2017219441A (ja) 2016-06-08 2017-12-14 Ｎｉｓｓｈａ株式会社 Ｍｅｍｓガスセンサ、ｍｅｍｓガスセンサ実装体、ｍｅｍｓガスセンサ・パッケージ、ｍｅｍｓガスセンサ組立体、及びｍｅｍｓガスセンサの製造方法
US20180038816A1 (en) 2016-08-05 2018-02-08 National Applied Research Laboratories Miniature gas sensor and method for manufacturing the same

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JP2022506000A (ja) 2022-01-17
CN110655034A (zh) 2020-01-07
WO2020001555A1 (zh) 2020-01-02

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