JP7264669B2 - 表示装置 - Google Patents

表示装置 Download PDF

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Publication number
JP7264669B2
JP7264669B2 JP2019037721A JP2019037721A JP7264669B2 JP 7264669 B2 JP7264669 B2 JP 7264669B2 JP 2019037721 A JP2019037721 A JP 2019037721A JP 2019037721 A JP2019037721 A JP 2019037721A JP 7264669 B2 JP7264669 B2 JP 7264669B2
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JP
Japan
Prior art keywords
light emitting
emitting element
electrode
substrate
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019037721A
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English (en)
Japanese (ja)
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JP2020140171A (ja
JP2020140171A5 (enExample
Inventor
雅延 池田
理 伊東
康弘 金谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to JP2019037721A priority Critical patent/JP7264669B2/ja
Priority to PCT/JP2019/051032 priority patent/WO2020179206A1/ja
Publication of JP2020140171A publication Critical patent/JP2020140171A/ja
Priority to US17/460,307 priority patent/US11810886B2/en
Publication of JP2020140171A5 publication Critical patent/JP2020140171A5/ja
Application granted granted Critical
Publication of JP7264669B2 publication Critical patent/JP7264669B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/2901—Shape
    • H01L2224/29011—Shape comprising apertures or cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29339—Silver [Ag] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/325—Material
    • H01L2224/32505—Material outside the bonding interface, e.g. in the bulk of the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8384—Sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Control Of El Displays (AREA)
JP2019037721A 2019-03-01 2019-03-01 表示装置 Active JP7264669B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019037721A JP7264669B2 (ja) 2019-03-01 2019-03-01 表示装置
PCT/JP2019/051032 WO2020179206A1 (ja) 2019-03-01 2019-12-25 表示装置
US17/460,307 US11810886B2 (en) 2019-03-01 2021-08-30 Display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019037721A JP7264669B2 (ja) 2019-03-01 2019-03-01 表示装置

Publications (3)

Publication Number Publication Date
JP2020140171A JP2020140171A (ja) 2020-09-03
JP2020140171A5 JP2020140171A5 (enExample) 2022-03-08
JP7264669B2 true JP7264669B2 (ja) 2023-04-25

Family

ID=72280491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019037721A Active JP7264669B2 (ja) 2019-03-01 2019-03-01 表示装置

Country Status (3)

Country Link
US (1) US11810886B2 (enExample)
JP (1) JP7264669B2 (enExample)
WO (1) WO2020179206A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6985983B2 (ja) * 2018-05-31 2021-12-22 株式会社ジャパンディスプレイ 表示装置
KR20240093193A (ko) * 2022-12-15 2024-06-24 엘지디스플레이 주식회사 발광 표시 장치

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017149A (ja) 2001-06-29 2003-01-17 Matsushita Electric Ind Co Ltd 電気接続部材とそれを用いた電気部品
JP2011021255A (ja) 2009-07-16 2011-02-03 Applied Nanoparticle Laboratory Corp ３金属成分型複合ナノ金属ペースト、接合方法及び電子部品
WO2011114747A1 (ja) 2010-03-18 2011-09-22 古河電気工業株式会社 導電性ペースト、及び該ペーストから得られる導電接続部材
JP2016503958A (ja) 2012-12-10 2016-02-08 ルクスビュー テクノロジー コーポレイション 発光素子反射バンク構造
JP2016512347A (ja) 2013-03-15 2016-04-25 ルクスビュー テクノロジー コーポレイション 冗長性スキームを備えた発光ダイオードディスプレイ、及び統合欠陥検出検査を備えた発光ダイオードディスプレイを製造する方法
US20170187976A1 (en) 2015-12-23 2017-06-29 X-Celeprint Limited Serial row-select matrix-addressed system
US20180076182A1 (en) 2016-09-14 2018-03-15 Innolux Corporation Display devices
JP2018523848A (ja) 2015-07-23 2018-08-23 ソウル セミコンダクター カンパニー リミテッド ディスプレイ装置及びその製造方法
JP2018182282A (ja) 2017-04-21 2018-11-15 ルーメンス カンパニー リミテッド マイクロｌｅｄディスプレイ装置及びその製造方法
JP2018206532A (ja) 2017-05-31 2018-12-27 ニホンハンダ株式会社 ペースト状金属粒子組成物、接合方法および電子装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6170045B2 (ja) * 2012-06-25 2017-07-26 イビデン株式会社 接合基板及びその製造方法ならびに接合基板を用いた半導体モジュール及びその製造方法
US9252375B2 (en) * 2013-03-15 2016-02-02 LuxVue Technology Corporation Method of fabricating a light emitting diode display with integrated defect detection test
WO2015133821A1 (en) * 2014-03-05 2015-09-11 Lg Electronics Inc. Display device using semiconductor light emitting device
GB201413578D0 (en) 2014-07-31 2014-09-17 Infiniled Ltd A colour iled display on silicon
US10021762B1 (en) * 2017-06-30 2018-07-10 Innolux Corporation Display device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017149A (ja) 2001-06-29 2003-01-17 Matsushita Electric Ind Co Ltd 電気接続部材とそれを用いた電気部品
JP2011021255A (ja) 2009-07-16 2011-02-03 Applied Nanoparticle Laboratory Corp ３金属成分型複合ナノ金属ペースト、接合方法及び電子部品
WO2011114747A1 (ja) 2010-03-18 2011-09-22 古河電気工業株式会社 導電性ペースト、及び該ペーストから得られる導電接続部材
JP2016503958A (ja) 2012-12-10 2016-02-08 ルクスビュー テクノロジー コーポレイション 発光素子反射バンク構造
JP2016512347A (ja) 2013-03-15 2016-04-25 ルクスビュー テクノロジー コーポレイション 冗長性スキームを備えた発光ダイオードディスプレイ、及び統合欠陥検出検査を備えた発光ダイオードディスプレイを製造する方法
JP2018523848A (ja) 2015-07-23 2018-08-23 ソウル セミコンダクター カンパニー リミテッド ディスプレイ装置及びその製造方法
US20170187976A1 (en) 2015-12-23 2017-06-29 X-Celeprint Limited Serial row-select matrix-addressed system
US20180076182A1 (en) 2016-09-14 2018-03-15 Innolux Corporation Display devices
JP2018182282A (ja) 2017-04-21 2018-11-15 ルーメンス カンパニー リミテッド マイクロｌｅｄディスプレイ装置及びその製造方法
JP2018206532A (ja) 2017-05-31 2018-12-27 ニホンハンダ株式会社 ペースト状金属粒子組成物、接合方法および電子装置の製造方法

Also Published As

Publication number Publication date
JP2020140171A (ja) 2020-09-03
US20210391293A1 (en) 2021-12-16
US11810886B2 (en) 2023-11-07
WO2020179206A1 (ja) 2020-09-10

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