JP7264106B2 - 積層セラミックコンデンサ - Google Patents
積層セラミックコンデンサ Download PDFInfo
- Publication number
- JP7264106B2 JP7264106B2 JP2020080103A JP2020080103A JP7264106B2 JP 7264106 B2 JP7264106 B2 JP 7264106B2 JP 2020080103 A JP2020080103 A JP 2020080103A JP 2020080103 A JP2020080103 A JP 2020080103A JP 7264106 B2 JP7264106 B2 JP 7264106B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive
- resin layer
- metal particles
- conductive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims description 76
- 229920005989 resin Polymers 0.000 claims description 273
- 239000011347 resin Substances 0.000 claims description 273
- 239000011231 conductive filler Substances 0.000 claims description 125
- 239000002923 metal particle Substances 0.000 claims description 120
- 238000007747 plating Methods 0.000 claims description 89
- 239000002245 particle Substances 0.000 claims description 39
- 229910021645 metal ion Inorganic materials 0.000 claims description 26
- 238000009826 distribution Methods 0.000 claims description 9
- 150000004696 coordination complex Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 485
- 229910052751 metal Inorganic materials 0.000 description 73
- 239000002184 metal Substances 0.000 description 73
- 125000002524 organometallic group Chemical group 0.000 description 30
- 239000011164 primary particle Substances 0.000 description 27
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 25
- 238000000034 method Methods 0.000 description 15
- 239000000843 powder Substances 0.000 description 15
- 239000012530 fluid Substances 0.000 description 14
- 238000003475 lamination Methods 0.000 description 13
- 229910052763 palladium Inorganic materials 0.000 description 13
- 229920001187 thermosetting polymer Polymers 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 238000007667 floating Methods 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 9
- 239000011163 secondary particle Substances 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 238000003917 TEM image Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 238000005470 impregnation Methods 0.000 description 7
- 229910052697 platinum Inorganic materials 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 6
- 238000009827 uniform distribution Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910001252 Pd alloy Inorganic materials 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000006722 reduction reaction Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 206010042674 Swelling Diseases 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000012010 growth Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- -1 palladium ions Chemical class 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 229910002971 CaTiO3 Inorganic materials 0.000 description 1
- 229910002976 CaZrO3 Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910002370 SrTiO3 Inorganic materials 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910001423 beryllium ion Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Non-Insulated Conductors (AREA)
Description
10 積層体
11 内層部
11E 対向電極部
12 第1の主面側外層部
13 第2の主面側外層部
LS1 第1の端面
LS2 第2の端面
WS1 第1の側面
WS2 第2の側面
TS1 第1の主面
TS2 第2の主面
20 誘電体層
30 内部電極層
31 第1の内部電極層
31A 第1の対向部
31B 第1の引き出し部
32 第2の内部電極層
32A 第2の対向部
32B 第2の引き出し部
40 外部電極
40A 第1の外部電極
40B 第2の外部電極
50 下地電極層
50A 第1の下地電極層
50B 第2の下地電極層
60 導電性樹脂層
60A 第1の導電性樹脂層
60B 第2の導電性樹脂層
61 樹脂部
62 導電性フィラー
63 金属粒子
63A 金属一次粒子
63B 金属二次粒子
70 めっき層
70A 第1のめっき層
70B 第2のめっき層
71 Niめっき層
71A 第1のNiめっき層
71B 第2のNiめっき層
72 Snめっき層
72A 第1のSnめっき層
72B 第2のSnめっき層
L 長さ方向
W 幅方向
T 積層方向
Claims (8)
- 積層された複数の誘電体層と積層された複数の内部電極層とを含む積層体と、
前記内部電極層に接続される外部電極と、を備え、
前記外部電極は、導電性樹脂層と、前記導電性樹脂層上に配置されるめっき層と、を有し、
前記導電性樹脂層は、樹脂部と、前記樹脂部内に分散された導電性フィラーと、前記導電性樹脂層において前記導電性フィラーとは異なる分布で偏って存在する金属粒子と、を有し、
前記樹脂部に対する前記金属粒子の存在比率は、前記導電性樹脂層の前記積層体側よりも、前記導電性樹脂層の前記めっき層側の方が高く、
前記樹脂部に対する前記導電性フィラーの存在比率は、前記導電性樹脂層の前記積層体側と、前記導電性樹脂層の前記めっき層側とで、略同等である、積層セラミックコンデンサ。 - 前記導電性フィラーに対する前記金属粒子の存在比率は、前記導電性樹脂層の前記積層体側よりも、前記導電性樹脂層の前記めっき層側の方が高い、請求項1に記載の積層セラミックコンデンサ。
- 前記金属粒子は、金属一次粒子と、金属一次粒子により構成された金属二次粒子を含み、
前記金属一次粒子の平均粒子径は、前記導電性フィラーの平均粒子径の10分の1以下である、請求項1または請求項2に記載の積層セラミックコンデンサ。 - 前記導電性フィラーの平均粒子径は1μm以上である、請求項3に記載の積層セラミックコンデンサ。
- 前記金属一次粒子の平均粒子径は0.1μm以下である、請求項3または請求項4に記載の積層セラミックコンデンサ。
- 前記金属粒子は、前記樹脂部において、前記導電性フィラー間に配置され、前記導電性フィラー間の通電経路を形成する、請求項1~5のいずれか1項に記載の積層セラミックコンデンサ。
- 前記金属粒子のイオン化傾向は、前記導電性フィラーのイオン化傾向よりも低い、請求項1~6のいずれか1項に記載の積層セラミックコンデンサ。
- 前記導電性樹脂層は、有機金属錯体または金属イオンを含む、請求項1~7のいずれか1項に記載の積層セラミックコンデンサ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020080103A JP7264106B2 (ja) | 2020-04-30 | 2020-04-30 | 積層セラミックコンデンサ |
US17/241,129 US11594372B2 (en) | 2020-04-30 | 2021-04-27 | Multilayer ceramic capacitor |
US18/101,721 US11763988B2 (en) | 2020-04-30 | 2023-01-26 | Multilayer ceramic capacitor |
JP2023010730A JP2023038363A (ja) | 2020-04-30 | 2023-01-27 | 積層セラミックコンデンサ |
US18/231,512 US20230395323A1 (en) | 2020-04-30 | 2023-08-08 | Multilayer ceramic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020080103A JP7264106B2 (ja) | 2020-04-30 | 2020-04-30 | 積層セラミックコンデンサ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023010730A Division JP2023038363A (ja) | 2020-04-30 | 2023-01-27 | 積層セラミックコンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021174956A JP2021174956A (ja) | 2021-11-01 |
JP7264106B2 true JP7264106B2 (ja) | 2023-04-25 |
Family
ID=78278642
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020080103A Active JP7264106B2 (ja) | 2020-04-30 | 2020-04-30 | 積層セラミックコンデンサ |
JP2023010730A Pending JP2023038363A (ja) | 2020-04-30 | 2023-01-27 | 積層セラミックコンデンサ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023010730A Pending JP2023038363A (ja) | 2020-04-30 | 2023-01-27 | 積層セラミックコンデンサ |
Country Status (2)
Country | Link |
---|---|
US (3) | US11594372B2 (ja) |
JP (2) | JP7264106B2 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014039000A (ja) | 2012-08-10 | 2014-02-27 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ及びその製造方法。 |
US20150090483A1 (en) | 2013-09-30 | 2015-04-02 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor, manufacturing method thereof, and board having the same mounted thereon |
JP2015115601A (ja) | 2013-12-12 | 2015-06-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層セラミックキャパシタ、その製造方法及び積層セラミックキャパシタの実装基板 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11162771A (ja) | 1997-11-25 | 1999-06-18 | Kyocera Corp | 積層セラミックコンデンサ |
US7751174B2 (en) * | 2002-12-09 | 2010-07-06 | Matsushita Electric Industrial Co., Ltd. | Electronic part with external electrode |
KR101598253B1 (ko) * | 2013-10-02 | 2016-02-26 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
KR20150089276A (ko) * | 2014-01-27 | 2015-08-05 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 외부전극용 도전성 페이스트 |
JP6533429B2 (ja) * | 2015-07-28 | 2019-06-19 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
KR101973433B1 (ko) | 2016-04-15 | 2019-04-29 | 삼성전기주식회사 | 적층형 커패시터 및 그 제조 방법 |
US10446320B2 (en) | 2016-04-15 | 2019-10-15 | Samsung Electro-Mechanics Co., Ltd. | Multilayer capacitor having external electrode including conductive resin layer |
JP6631547B2 (ja) | 2016-12-09 | 2020-01-15 | 株式会社村田製作所 | 積層セラミックコンデンサ |
US10319527B2 (en) * | 2017-04-04 | 2019-06-11 | Samsung Electro-Mechanics Co., Ltd. | Multilayer capacitor |
KR102270303B1 (ko) * | 2019-08-23 | 2021-06-30 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
-
2020
- 2020-04-30 JP JP2020080103A patent/JP7264106B2/ja active Active
-
2021
- 2021-04-27 US US17/241,129 patent/US11594372B2/en active Active
-
2023
- 2023-01-26 US US18/101,721 patent/US11763988B2/en active Active
- 2023-01-27 JP JP2023010730A patent/JP2023038363A/ja active Pending
- 2023-08-08 US US18/231,512 patent/US20230395323A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014039000A (ja) | 2012-08-10 | 2014-02-27 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ及びその製造方法。 |
US20150090483A1 (en) | 2013-09-30 | 2015-04-02 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor, manufacturing method thereof, and board having the same mounted thereon |
JP2015115601A (ja) | 2013-12-12 | 2015-06-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層セラミックキャパシタ、その製造方法及び積層セラミックキャパシタの実装基板 |
Also Published As
Publication number | Publication date |
---|---|
JP2023038363A (ja) | 2023-03-16 |
US11594372B2 (en) | 2023-02-28 |
JP2021174956A (ja) | 2021-11-01 |
US20210343476A1 (en) | 2021-11-04 |
US11763988B2 (en) | 2023-09-19 |
US20230178300A1 (en) | 2023-06-08 |
US20230395323A1 (en) | 2023-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10734159B2 (en) | Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor | |
WO2008059666A1 (en) | Laminated electronic component and method for manufacturing the same | |
US11183334B2 (en) | Multilayer ceramic electronic component | |
JP2022191911A (ja) | 積層セラミック電子部品 | |
JP2017073539A (ja) | 電子部品 | |
JP7416021B2 (ja) | 積層セラミック電子部品 | |
US11515093B2 (en) | Multilayer ceramic capacitor and mounting structure of the multilayer ceramic capacitor | |
JP2021061302A (ja) | 積層セラミックコンデンサ | |
US20240096556A1 (en) | Electronic component | |
JP7264106B2 (ja) | 積層セラミックコンデンサ | |
US20220406528A1 (en) | Multilayer ceramic electronic component | |
JP2020184555A (ja) | 積層セラミックコンデンサ | |
JP7396251B2 (ja) | 積層セラミックコンデンサ | |
JP7447804B2 (ja) | 積層インダクタの内部電極形成用銀ペースト | |
KR20210120846A (ko) | 적층 세라믹 전자부품 | |
WO2023234314A1 (ja) | 積層セラミックコンデンサ | |
JP2003059337A (ja) | 導電性ペースト及びそれを用いたチップ型電子部品 | |
WO2023243159A1 (ja) | 積層セラミックコンデンサ | |
WO2024057636A1 (ja) | 積層セラミック電子部品 | |
JP2023157118A (ja) | 積層セラミック電子部品 | |
WO2024029149A1 (ja) | 積層セラミック電子部品及び積層セラミック電子部品の実装構造 | |
WO2024029150A1 (ja) | 積層セラミックコンデンサ | |
WO2023243160A1 (ja) | 積層セラミックコンデンサ | |
WO2023243209A1 (ja) | 積層セラミックコンデンサ | |
US20230207214A1 (en) | Multilayer ceramic capacitor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20211105 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20221027 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221206 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230125 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230314 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230327 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7264106 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |