JP7262901B2 - 被加工物の切削方法 - Google Patents
被加工物の切削方法 Download PDFInfo
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- JP7262901B2 JP7262901B2 JP2019116108A JP2019116108A JP7262901B2 JP 7262901 B2 JP7262901 B2 JP 7262901B2 JP 2019116108 A JP2019116108 A JP 2019116108A JP 2019116108 A JP2019116108 A JP 2019116108A JP 7262901 B2 JP7262901 B2 JP 7262901B2
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- 238000005520 cutting process Methods 0.000 title claims description 216
- 238000000034 method Methods 0.000 title claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 97
- 238000001514 detection method Methods 0.000 claims description 84
- 238000006073 displacement reaction Methods 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 claims description 7
- 230000007246 mechanism Effects 0.000 description 13
- 238000003860 storage Methods 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
4 基台
6 X軸移動機構(加工送りユニット)
8 X軸ガイドレール
10 X軸移動テーブル
11 被加工物
11a 表面
11b 裏面
11c 外周部
11d 中心
12 X軸ボールねじ
14 X軸パルスモータ
16 θテーブル
18a テーブル基台
18b テーブルカバー
20 チャックテーブル
20a 枠体
20b 保持プレート
20c 保持面
24 回転軸
26 回転中心
30 支持構造
32 切削ユニット移動機構(割り出し送りユニット、切り込み送りユニット)
34 Y軸ガイドレール
36 Y軸移動プレート
38 Y軸ボールねじ
40 Y軸パルスモータ
42 Z軸ガイドレール
44 Z軸移動プレート
46 Z軸ボールねじ
48 Z軸パルスモータ
50 第1の切削ユニット
52 スピンドルハウジング
54 スピンドル
56 切削ブレード
58 カメラユニット(縁位置検出ユニット)
60 第2の切削ユニット
62 スピンドルハウジング
64 スピンドル
66 切削ブレード
68 背圧式センサユニット(高さ位置検出ユニット)
68a ノズル
70 ブレード位置検出ユニット
72 レーザー変位計
72a レーザービーム照射ユニット
A,D グラフ
B ずれ量
C 深さ
E1,E2 距離
L レーザービーム
Claims (4)
- 円盤状の被加工物を保持するチャックテーブルと、
該チャックテーブルに保持された該被加工物を切削可能な切削ブレードをそれぞれ有する第1の切削ユニット及び第2の切削ユニットと、
該第1の切削ユニットに固定され、該被加工物の外周部の縁の位置を検出する縁位置検出ユニットと、
該第2の切削ユニットに固定され、該チャックテーブルに保持された該被加工物の表面の高さ位置を検出する高さ位置検出ユニットと、
を備える切削装置を用いて、該被加工物の該表面側の該外周部を切削する被加工物の切削方法であって、
該被加工物の該表面側が露出する様に、該被加工物の裏面側を該チャックテーブルで保持する保持ステップと、
該高さ位置検出ユニットを用いて、該被加工物の該表面の該外周部の複数箇所の高さ位置を検出する高さ位置検出ステップと、
該高さ位置検出ステップを行いながら、該縁位置検出ユニットを用いて、該縁の位置を検出する縁位置検出ステップと、
該縁位置検出ステップで検出された該縁の位置から算出された該被加工物の中心と該チャックテーブルの回転中心とのずれ量に基づいて該第1の切削ユニット及び該第2の切削ユニットの一方の切削ブレードの位置を調整し、且つ、該高さ位置検出ステップで検出された該複数箇所の高さ位置に基づいて該被加工物に該一方の切削ブレードを切り込む深さを調整しながら、該被加工物の該外周部を切削する外周部切削ステップと、
を備えることを特徴とする被加工物の切削方法。 - 該縁位置検出ユニットは、被写体を可視光で撮像するカメラ又はレーザー変位計であることを特徴とする請求項1に記載の被加工物の切削方法。
- 該高さ位置検出ユニットは、背圧式センサであることを特徴とする請求項1又は2に記載の被加工物の切削方法。
- 円盤状の被加工物を保持するチャックテーブルと、
該チャックテーブルに保持された該被加工物を切削可能な切削ブレードをそれぞれ有する第1の切削ユニット及び第2の切削ユニットと、
該第1の切削ユニットに固定され、該被加工物の外周部の縁の位置を検出する縁位置検出ユニットと、
該第2の切削ユニットに固定され、該チャックテーブルに保持された該被加工物の表面の高さ位置を検出する高さ位置検出ユニットと、
を備える切削装置を用いて、該被加工物の該表面側の該外周部を切削する被加工物の切削方法であって、
該被加工物の該表面側が露出する様に、該被加工物の裏面側を該チャックテーブルで保持する保持ステップと、
該縁位置検出ユニットを用いて、該縁の位置を検出する縁位置検出ステップと、
該縁位置検出ステップで検出された該縁の位置から算出された該被加工物の中心と、該チャックテーブルの回転中心とのずれ量に基づいて、該高さ位置検出ユニットの位置を調整しながら、該被加工物の該表面の該外周部の複数箇所の高さ位置を検出する高さ位置検出ステップと、
該第1の切削ユニット及び該第2の切削ユニットの一方の切削ブレードの位置を該ずれ量に基づいて調整し、且つ、該高さ位置検出ステップで検出された該複数箇所の高さ位置に基づいて該被加工物に該一方の切削ブレードを切り込む深さを調整しながら、該被加工物の該外周部を切削する外周部切削ステップと、
を備えることを特徴とする被加工物の切削方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2019116108A JP7262901B2 (ja) | 2019-06-24 | 2019-06-24 | 被加工物の切削方法 |
KR1020200063367A KR20210000266A (ko) | 2019-06-24 | 2020-05-27 | 피가공물의 절삭 방법 |
TW109120954A TWI828920B (zh) | 2019-06-24 | 2020-06-20 | 被加工物的切割方法 |
CN202010577903.1A CN112123606B (zh) | 2019-06-24 | 2020-06-23 | 被加工物的切削方法 |
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JP2019116108A JP7262901B2 (ja) | 2019-06-24 | 2019-06-24 | 被加工物の切削方法 |
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JP2021002605A JP2021002605A (ja) | 2021-01-07 |
JP7262901B2 true JP7262901B2 (ja) | 2023-04-24 |
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KR (1) | KR20210000266A (ja) |
CN (1) | CN112123606B (ja) |
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CN116423689B (zh) * | 2023-06-13 | 2023-09-15 | 江苏京创先进电子科技有限公司 | 太鼓晶圆对中确定方法及太鼓晶圆切割方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014116487A (ja) | 2012-12-11 | 2014-06-26 | Disco Abrasive Syst Ltd | 切削装置 |
JP2014239134A (ja) | 2013-06-07 | 2014-12-18 | 株式会社ディスコ | ウェーハの加工方法 |
JP2018114580A (ja) | 2017-01-17 | 2018-07-26 | 株式会社ディスコ | ウエーハの加工方法及び切削装置 |
JP2019033189A (ja) | 2017-08-09 | 2019-02-28 | 株式会社ディスコ | 切削装置及びウェーハの加工方法 |
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JP3515917B2 (ja) | 1998-12-01 | 2004-04-05 | シャープ株式会社 | 半導体装置の製造方法 |
JP6205231B2 (ja) * | 2013-10-08 | 2017-09-27 | 株式会社ディスコ | 切削装置 |
JP2018161733A (ja) * | 2017-03-27 | 2018-10-18 | 株式会社ディスコ | ウェーハの加工方法 |
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- 2020-05-27 KR KR1020200063367A patent/KR20210000266A/ko active Search and Examination
- 2020-06-20 TW TW109120954A patent/TWI828920B/zh active
- 2020-06-23 CN CN202010577903.1A patent/CN112123606B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2014116487A (ja) | 2012-12-11 | 2014-06-26 | Disco Abrasive Syst Ltd | 切削装置 |
JP2014239134A (ja) | 2013-06-07 | 2014-12-18 | 株式会社ディスコ | ウェーハの加工方法 |
JP2018114580A (ja) | 2017-01-17 | 2018-07-26 | 株式会社ディスコ | ウエーハの加工方法及び切削装置 |
JP2019033189A (ja) | 2017-08-09 | 2019-02-28 | 株式会社ディスコ | 切削装置及びウェーハの加工方法 |
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KR20210000266A (ko) | 2021-01-04 |
CN112123606A (zh) | 2020-12-25 |
JP2021002605A (ja) | 2021-01-07 |
TW202101571A (zh) | 2021-01-01 |
CN112123606B (zh) | 2024-02-23 |
TWI828920B (zh) | 2024-01-11 |
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