JP7250157B2 - check device - Google Patents

Description

The technology disclosed in this specification relates to a technology for checking settings and measurement values of machines that constitute a mounting line.

2. Description of the Related Art Conventionally, mounting lines for mounting components on substrates have been known. A mounting line is generally composed of a plurality of machines such as a printer, a surface mounter, and an inspection machine. Patent Literature 1 listed below describes the following points as an overview of a component mounting system. To reflect a condition change made on one machine to other machines. If conditions cannot be changed on other machines (during implementation, etc.), the changes will not be reflected immediately, but will be reflected after the machine is switched.

Japanese Patent No. 4915335

In order to improve the production quality and production efficiency of the mounting line, it is preferable to manage machine settings and measurement values.
SUMMARY OF THE INVENTION An object of the present invention is to improve the management performance of a mounting line by providing a check function that compares machine settings and measured values with those to be compared and determines whether there is a difference.

The checking device disclosed in this specification has a data processing unit that compares the setting or measured value of the machine with a comparison target and determines whether there is a difference. In this configuration, the management performance of the mounting line can be improved by having a check function for checking differences by comparing setting and measured values with comparison targets.

As an embodiment of the checking device, the setting may be a setting selected from a plurality of selection items, and the data processing section may issue a warning when the setting differs from the comparison target. This configuration can prompt the operator (worker) to take necessary measures such as informing the operator of the setting difference and asking for confirmation.

As an embodiment of the checking device, the settings may be settings that should be common among a plurality of machines, and the comparison target may be settings of different machines. In this configuration, differences in settings between machines can be determined.

As an embodiment of the checking device, if the measured value is different from the comparison object, the data processing unit warns if the difference between the measurement value and the comparison object exceeds an allowable value. good. With this configuration, a warning is issued only when it is determined that there is an abnormality in the measured value, and if the difference from the comparison target is a variation or a measurement error, unnecessary warning can be suppressed.

As an embodiment of the checking device, when a plurality of measurement objects are mounted on the same machine, the comparison object may be measured values of other measurement objects mounted on the same machine. If it is the same machine, there is no difference in usage, so it is suitable for comparison.

As an embodiment of the checking device, when the measurement target is mounted on a plurality of machines, the comparison target may be the measured values of the measurement target mounted on another machine. By making other machines the target of comparison, the range of targets for comparison can be expanded.

As an embodiment of the checking device, the comparison target may be a past measurement value of the same measurement object. By comparing past measured values, it is easy to judge whether the condition of the object to be measured or the machine is good or bad.

As one embodiment of the checking device, the allowable value may differ according to the type of the measured value. In this configuration, the allowable value can be determined for each type of object to be measured.

In one embodiment of the checking device, the allowable value may be changeable. By changing the allowable value, it is possible to adjust the ease with which a warning is issued. That is, by decreasing the allowable value, it becomes easier to issue a warning, and by increasing the allowable value, it becomes possible to make it difficult to issue a warning.

According to the technology disclosed in this specification, it is possible to improve the management performance of the mounting line by having a check function that compares the machine settings and measured values with those to be compared and determines the presence or absence of differences. be.

Configuration diagram of mounting line Top view of surface mounter Side view of head unit Cross section of mounting head Schematic of base camera Block diagram of a surface mounter Explanatory diagram of quasi-simultaneous transport Explanatory diagram of individual transport Diagram showing setting of transport method for each machine Chart showing nozzle types and vacuum levels for each mounting head Flowchart of setting confirmation processing Flowchart of measurement value confirmation processing Execution conditions for confirmation processing and charts showing target items A chart showing the comparison range and warning conditions for each item

<Embodiment 1>
Embodiments of the present invention will be described below with reference to the drawings.
1. Configuration of Mounting Line FIG. 1 is a line configuration diagram of a mounting line. The example of FIG. 1 shows an example in which two mounting lines S are provided in the same factory. S1 is the first mounting line, and S2 is the second mounting line.

The mounting line S is equipped with a plurality of machines. The machines include a printer that prints solder paste on the substrate P to be worked, a coating machine that applies a coating liquid to the substrate P, a surface mounter that mounts the component B on the substrate P, and an inspection of the substrate P. and a reflow machine that heats solder to bond the component B to the substrate P.

In this example, both the first mounting line S1 and the second mounting line S2 are composed of one printer 11, three surface mounters 13A to 13C, and one inspection machine 15, a total of five machines. constitutes a mounting line S. Each machine also has a display panel 18 and an error indicator lamp 19, as shown in FIG.

Each machine is connected in series by a transport conveyor 32 . The transport direction of the substrate P is the right direction, the left side in FIG. 1 is the upstream side, and the right side in FIG. 1 is the downstream side. The board P to be worked is sent to each machine in order, and the printing operation, the mounting operation, and the inspection are performed.

The reason why three surface mounters 13 are provided for one mounting line S is to shorten the takt time by sharing the mounting operation for one substrate P among the three.

A standby unit 25 is arranged between each machine. The standby unit 25 is installed to temporarily keep the substrate P on standby when it is transported from the upstream machine to the downstream machine.

As shown in FIG. 1, a management device 20 is installed in the factory. The management device 20 is a device that manages the mounting line S. FIG. The management device 20 is connected to each mounting line S1, S2 via a communication line 16, and can communicate with each machine on each mounting line S1, S2. It is also possible to communicate between the machines on the same mounting line S1, S2 via the communication line 16. FIG.

The management device 20 has a data processing section 20A, a memory 20B, a display section 20C, and an input section 20D. The management device 20 stores production plan information such as data of the board P to be produced and the data of the part B to be used for production in the memory 20B, and can transmit the information of the production plan to each machine.

In addition to this, the data processing unit 20A has a check function for comparing machine settings and measured values with those to be compared to determine the presence or absence of differences. The check function will be explained later in detail. The management device 20 corresponds to the "checking device" of the present invention.

2. Configuration of Surface Mounter FIG. 2 is a plan view of the surface mounter 13 . Since the three surface mounters 13A to 13C have the same structure, they are referred to as the surface mounter 13 when they are not distinguished from each other.

The surface mounter 13 includes a base 31 , a transport conveyor 32 , a head unit 33 , a driving section 34 and a feeder 35 . The transport conveyor 32 transports the substrate P to be worked on the base 31 in the X direction.

The drive unit 34 is a device that moves the head unit 33 on the base 31 in the planar direction (XY direction).

As the drive unit 34, a two-axis or three-axis ball screw mechanism using a motor as a drive source can be exemplified. In this example, it is a two-axis drive unit having a first drive shaft 34A extending in the X direction and a second drive shaft 34B extending in the Y direction. The feeder 35 is a device that supplies components B to be mounted on the board P. FIG.

As shown in FIG. 3 , the head unit 33 is slidably supported by the support member 38 and has a plurality of mounting heads 40 . In this example, there are four mounting heads 40A to 40D. The mounting head 40 is supported by the head unit 33 so as to be vertically movable.

As shown in FIG. 4 , the mounting head 40 has a nozzle shaft 41 and a suction nozzle 45 . The nozzle shaft 41 has an air supply path 42 at the center of the shaft. The suction nozzle 45 is attached to the tip 41A of the nozzle shaft 41 . A filter 44 is attached inside the supply path 42 of the tip portion 41A of the nozzle shaft 41 . The filter 44 catches sucked dust and foreign matter.

The suction nozzle 45 is a so-called buffing nozzle, and includes a nozzle holder 46 , a nozzle body 47 and a spring 48 . The suction nozzle 45 is vertically positioned with respect to the nozzle shaft 41 by abutting the nozzle holder 46 against the shaft holder 43 . The nozzle body 47 is attached to the nozzle holder 46 so as to be retractable. A spring 48 is attached to the outer periphery of the nozzle body 47 and biases the nozzle body 47 in the protruding direction.

By supplying negative pressure to the supply path 42 from the negative pressure generator 51 connected to the air source 53, a suction force is generated at the tip of the suction nozzle 45, and the component B can be suctioned and held. Also, by stopping the supply of the negative pressure, it is possible to release the part B from being held. A pressure sensor 55 is installed on the nozzle shaft 41 to detect the level of the negative pressure.

The head unit 33 and the mounting head 40 fulfill the function of picking up the component B from the feeder 35 and then moving it to the working position in the center of the base to mount it on the substrate P. FIG. Mounting is a series of operations from picking up to mounting.

The surface mounter 13 has a base camera 37 and a head camera 36 . The base camera 37, as shown in FIG. 5, comprises an illumination 37A, a lens 37B, and a camera body 37C. are placed. The base camera 37 photographs the component B sucked and held by the suction nozzle 45 from below.

From the image of the base camera 37, it is possible to detect the suction state of the component B with respect to the suction nozzle 45. FIG. That is, it is possible to detect the amount of displacement of the suction position of the component B with respect to the suction nozzle 45 from the image of the base camera 37 . Also, the deviation amount of the suction angle of the component B with respect to the suction nozzle 45 can be detected.

By correcting the position and angle of the component B with respect to the board P based on the recognition result of the image captured by the base camera 37 (displacement of the pickup position and the displacement of the pickup angle), the mounting accuracy of the component B can be improved. I can.

As shown in FIG. 3, the head camera 36 is arranged on the outer surface of the head unit 33 with its photographing surface facing downward. The head camera 36 is provided for recognizing the position of the substrate P stopped at the work position in the center of the base.

In this example, the position of the substrate P can be recognized by recognizing the position mark (fiducial mark) attached to the substrate P as an image.

FIG. 6 is a block diagram showing the electrical configuration of the surface mounter 13. As shown in FIG. A controller 100 is a control device for the surface mounter 13 .

The controller 100 has a data processing unit 101 and a memory 103 which are configured by a CPU or the like. The memory 103 stores programs and information necessary for manufacturing the board P. FIG. For example, a mounting program for mounting the component B and a transport program for transporting the board P are stored.

The conveyer 32 , the drive section 34 , the base camera 37 , the head camera 36 and the communication section 105 are connected to the controller 100 .

The controller 100 performs a transport operation of the substrate P by controlling the transport conveyor 32 according to a transport program. Further, by controlling the driving section 34 according to the mounting program, the mounting operation of the component B is executed using the head unit 33 .

The controller 100 can image-recognize the component B held by the suction nozzle 45 from the image captured by the base camera 37 . Also, the substrate P can be image-recognized from the image captured by the head camera 36 .

An abnormal stop switch 106 and a setting change panel 107 are connected to the controller 100 . The abnormal stop switch 106 is a switch for an operator (worker) to stop the surface mounter 13 in an emergency. A setting change panel 107 is an operation panel for the operator to change machine settings.

2. Machine Settings and Measured Value Check Functions Examples of the settings of the surface mounter 13 are as follows.

(A) Transfer method setting (B) Transfer speed setting (C) Substrate standby execution or non-execution between machines using the waiting unit 25 (D) Base mark recognition operation execution interval (E) Pickup position confirmation operation (F) Presence or absence of maintenance tasks and execution intervals

(A) There are two types of transfer method settings, "quasi-simultaneous" and "individual". Individual" can be selected.

"Quasi-simultaneously" is, as shown in FIG. 7A, a transport method in which the surface mounter 13 and the standby unit 25 transport the board P synchronously, so that the board P is simultaneously carried into and discharged from the surface mounter 13. is.

"Individual" is a transport method in which, as shown in FIG. 7B, when the mounting operation by the surface mounter 13 is completed, the substrate P is transported to the standby unit 25, and then the next substrate P is transported from the standby unit 25. is. In other words, this is a transport method in which the board P is unloaded from and loaded into the surface mounter 13 asynchronously.

The setting of the transport method should be common to all the machines constituting the mounting line S, and all the machines 11, 13A to 13C, 15 should select the same setting.

If the operator changes the setting of the transport method, and the settings are different in some machines, transport failure may occur. In the example of FIG. 8, each of the machines 11, 13A, 13C, and 15 is set to "quasi-simultaneously", whereas only the third surface mounter 13B is set to "individually." The settings are different from those of other machines.

Therefore, the data processing unit 20A of the management device 20 compares the transport method settings among the machines, determines whether there is a difference, and issues a warning. By doing so, it is possible to prompt the operator to take necessary measures such as confirming the setting of the transport method.

Also, the comparison result may be displayed on the display unit 20C of the management device 20 regardless of whether or not there is a difference. By displaying the comparison result, the operator can grasp the setting result of the transport method of each machine 11, 13A to 13C, 15, and the manageability of the mounting line S is improved.

The timing of comparing the setting of the transport method (the timing of issuing a warning) may be when the operator changes the setting of the transport method. Also, it may be at the start of production, or at the time of resuming production after suspending it temporarily.

(B) The setting of the transport speed of the substrate P and (C) whether or not to execute substrate standby between machines using the waiting section 25 should be common among the machines constituting the mounting line S, as with the transport method. It's a setting.

Therefore, when these settings are changed, the data processing unit 20A of the management device 20 should compare the settings between the machines in the same way as the setting of the transport method, and issue a warning if there is a difference. .

(D) The recognition operation of the base mark is performed by photographing the base mark M on the base 31 with the head camera 36 and detecting the positional deviation of the mark M. This is the operation of measuring the axial thermal elongation of the drive unit 34 . The measured amount of thermal elongation of the shaft is used for correcting the mounting position of the component B. FIG.

(E) The pickup position confirmation operation is an operation of confirming the position of the component B supplied by the feeder 35 with the head camera 36 . When the pick-up position confirmation operation is executed, the pick-up position accuracy of the component B by the mounting head 40 is increased, but the takt time is slowed down.

(F) The maintenance task is cleaning of the mounting head 40 and cleaning of the drive unit 34, and is an operation performed off-line (during non-production).

(D) If the execution interval of the recognition operation of the base mark M is set differently, the measurement frequency of the axial elongation will differ between machines, and the mounting accuracy of the component B may differ. (E) If there is a difference in the presence or absence of the suction position confirmation operation, there may be differences in the suction accuracy and takt time between machines. (F) If the presence or absence of the maintenance task and the setting of the execution interval are different, the condition of the machine may be different, and the mounting accuracy of the component B may be different.

Therefore, in the data processing unit 20A of the management device 20, the setting of the execution interval of the recognition operation of the base mark M, the setting of the presence/absence of the adsorption position confirmation operation, the presence/absence of the maintenance task, and the setting of the execution interval are compared with those to be compared. should be used to determine the difference. Since these settings are specific to the surface mounter 13, when checking these settings, it is preferable to target machines of the same type, that is, the surface mounters 13, as the target range for comparison. The surface mounter 13 may be a machine on the same mounting line or a machine on another mounting line.

Examples of the measured values of the surface mounter 13 are as follows.
(A) Negative pressure level of mounting head 40 (B) Brightness of illumination (C) Axis movement speed

(A) The negative pressure level of the mounting head 40 includes a first negative pressure level when the tip of the nozzle is opened (hereinafter, when opened) and a second negative pressure level when the tip of the nozzle is closed (hereinafter, when closed). There are levels.

The first negative pressure level can be used as a threshold for confirming the adsorption action. In other words, it can be determined that the component B has been picked up when the negative pressure is higher than the first negative pressure level by a predetermined value or more. The reason is that when the component B is picked up, the negative pressure of the mounting head 40 becomes greater than when it is released.

A second negative pressure level can be used as a threshold for confirming the donning action. That is, when the negative pressure becomes lower than the second negative pressure level by a predetermined value or more, it can be determined that the component B is mounted. The reason is that when the component B is mounted, the negative pressure of the mounting head 40 becomes smaller than when it is sealed.

Each surface mounter 13 periodically cleans (maintains) each mounting head 40 mounted on the head unit 33 as part of machine adjustment. After cleaning, the pressure sensor 55 is used to measure the first negative pressure level and the second negative pressure level for each mounting head 40, and the measured values are used as the above threshold values.

FIG. 9 shows measurement results of the first negative pressure level and the second negative pressure level for the four mounting heads 40A to 40D mounted on the head unit 33 of the surface mounter 13. FIG. The negative pressure level is a value with the atmospheric pressure as a reference (zero), and the higher the numerical value, the higher the negative pressure.

The suction nozzles 45 that are attached to the mounting head 40 and used are classified into types (types) according to differences in nozzle shape, inner diameter, and the like. In the example of FIG. 9, the mounting heads 40A-40C are type A. The 40D mounting head is of type B.

As shown in FIG. 9, the mounting head 40A has a first vacuum level of "79" and a second vacuum level of "100".

When the negative pressure level of the mounting head 40A is compared with the mounting heads 40B and 40C of the same type A, the difference in the first negative pressure level is "4" and "-2", and the difference between the first negative pressure levels is "4" and "-2". difference is small. On the other hand, the difference in the second negative pressure level is "101" and "104", and the difference between the mounting heads 40B and 40C is large and considered to be an abnormal value.

If there is an abnormality in the first negative pressure level or the second negative pressure level, there is concern that the mounting operation of the substrate P may be performed under poor conditions such as clogging or leakage of the air supply path 42 .

Therefore, the data processing unit 20A of the management device 20 compares the negative pressure levels (measured values) between the mounting heads 40 having the same nozzle type, and determines whether or not there is a difference.

The data processing unit 20A of the management device 20 does not give a warning if the difference is equal to or less than the allowable value even if the negative pressure level is different from the comparison target, and gives a warning if the difference is greater than the allowable value. By doing this, it is possible to issue warnings only when it is determined that there is an abnormality in the measured value, and to prevent unnecessary warnings from being issued if the difference from the comparison target is a degree of variation or a measurement error. .

Also, the comparison result may be displayed on the display unit 20C of the management device 20 regardless of the level difference. By displaying the comparison result, the operator can grasp the level of the negative pressure of each mounting head 40, and the manageability of the mounting line S is improved.

The range in which the negative pressure levels are compared may be within the same surface mounter or other surface mounters 13 on the same mounting line S as long as the types of nozzles are common. Also, the surface mounter 13 of another mounting line S in the same factory may be used.

The timing for comparing the negative pressure levels (timing for issuing a warning) may be after machine adjustment (after maintenance) or at the start of production. It may also be used when production is temporarily interrupted and restarted. Alternatively, it may be when a predetermined time has passed since the previous time, or when an error of a predetermined probability or more (faulty mounting of component B) has occurred.

(E) Brightness of illumination is brightness of illumination of the base camera 37 and the head camera 36, and can be measured by brightness when a predetermined mark is recognized at the same illumination level.

(F) The axis movement speed is the movement speed of the head unit 33, and can be measured from the time required to move the head unit 33 by a predetermined distance.

(E) If the brightness of the illumination is different from that of the object for comparison, there may be a large difference in recognition accuracy between machines. (F) If the axis movement speed is different, there may be a large difference in takt time between machines.

Therefore, the data processing unit 20A of the management device 20 may compare the measured value of the illumination brightness and the measured value of the axis movement speed with those to be compared to determine the difference. Note that the brightness of the illumination and the axis movement speed are measured values unique to the surface mounter 13, so when checking these, the comparison target range is the same type of machine, that is, the surface mounter 13. do it. The surface mounter 13 may be a machine on the same mounting line S or a machine on another mounting line S.

FIG. 10 is a flowchart of the setting confirmation process. FIG. 12 shows target items and execution conditions for confirmation processing. In addition, FIG. 13 shows a comparison target range and warning conditions for each target item.

As shown in FIG. 12, there are two target items, "setting" and "measurement value". When the target item is "setting", the execution condition of the confirmation process is when the setting is changed or when production is started.

When the operator (worker) changes the settings in each machine, the information is sent to the management device 20 . Upon receiving the setting change information, the data processing unit 20A of the management device 20 determines that the execution condition is satisfied, and executes the setting confirmation process (FIG. 10).

The confirmation process consists of seven steps S10 to S70. S10 is a process of determining a target range for comparing machine settings.

Specifically, the comparison target range can be determined from the correlation table (target item-target range correlation table) shown in FIG. For example, when the changed setting is "conveyance method setting", the comparison target range is all machines on the same mounting line S. In other words, all the machines 11, 13A to 13C, and 15 of the first mounting line S1 change when the setting of the transport method is changed in the first mounting line S1.

Also, when the changed setting is the "setting of pickup position confirmation", the surface mounters 13A to 13C of the same mounting line S are used. That is, when the setting of the suction position confirmation is changed in the first mounting line S1, the three surface mounters 13A to 13C of the first mounting line S1 are used. Incidentally, the correlation table is preferably stored in the memory 20B in advance.

S20 is a process of selecting an arbitrary one as a representative from the range to be compared. S30 is a process of selecting a comparison target.

S40 is a process of reading setting data from the representative and the comparison target and comparing the settings. S50 is a process of determining a difference in setting, and S60 is a process of issuing a warning if there is a difference. S70 is a process for determining whether or not comparison has been performed for all objects.

For example, when the setting of the transport method is changed in the mounting line S1, the data processing unit 20A determines the comparison target range to all machines in the mounting line S1 from the correlation table of FIG. 13 (S10).

The data processing unit 20A selects one as a representative arbitrarily from the range to be compared (S20), and selects the other range as a comparison target (S30). For example, the surface mounter 13A is selected as a representative, and the surface mounter 13B is selected as a comparison target.

The data processing unit 20A then reads the settings of the transport method from the two selected surface mounters 13A and 13B, and compares the settings of the transport method (S40).

In the example of FIG. 8, the setting of the transfer method of the surface mounter 13A is "semi-simultaneous" and the setting of the transfer method of the surface mounter 13B is "individual", which are different.

In this case, the data processing unit 20A determines that there is a setting difference and issues a warning (S50, S60). The warning may be displayed on the display unit 20C by displaying a message requesting confirmation of "setting", or by turning on the abnormality indicator lamp 19 of the surface mounter 13B requesting confirmation of the setting.

Further, when the settings of the transport method of the surface mounter 13A and the surface mounter 13B are the same, the data processing unit 20A determines that there is no difference (S50: NO determination).

When determining that there is no difference, the data processing unit 20A selects the next comparison target. For example, the surface mounter 13C is selected, and the transfer method setting is read from the surface mounter 13C.

Then, the management device 20 compares the setting of the transport method of the surface mounter 13A selected as a representative with the setting of the transport method of the surface mounter 13C selected as the next comparison target.

Such processing is repeated, and if the two machines selected from the range to be compared have different transport method settings, a warning is issued (S60). Also, if the setting of the transport method is common for all combinations, the confirmation process is finally finished.

FIG. 11 is a flowchart of the process of confirming the measured value. The measurement value confirmation process differs from the setting confirmation process in that a determination step of S55 is added. The determination step of S55 is a step of comparing the difference in the measured values with the allowable value and determining whether or not to issue a warning when it is determined in S50 that there is a difference in the measured values.

As shown in FIG. 12, the measurement value confirmation process shown in FIG. 11 is executed when a predetermined period of time has elapsed since the previous machine adjustment, or when an error of a predetermined probability or more has occurred. Here, an example after machine adjustment will be described.

When machine adjustment or the like is performed on the machine, the information is sent to the management device 20 . Upon receiving the machine adjustment information, the data processing unit 20A of the management device 20 determines that the execution condition is satisfied, and executes the measurement value confirmation process (FIG. 11).

When the confirmation process starts, the data processing unit 20A first determines a comparison target range from the correlation table of FIG. 13 (S10).

For example, when the surface mounter 13A cleans the mounting head 40 as machine adjustment, the surface mounter 13A is equipped with four mounting heads 40A to 40D. Since the mounting heads 40A to 40C have the same nozzles, the three mounting heads 40A to 40C are selected as a comparison target range (see FIG. 9).

The data processing unit 20A selects one as a representative arbitrarily from the range to be compared (S20), and selects the other range as a comparison target (S30). For example, the mounting head 40A is selected as a representative, and the mounting head 40B is selected as a comparison target.

The data processing unit 20A then reads the data of the negative pressure levels of the two selected mounting heads 40A and 40B from the surface mounter 13A. Then, the first negative pressure level and the second negative pressure level are compared for the two mounting heads 40A and 40B (S40).

In the example of FIG. 9, the first negative pressure level is "79" for the mounting head 40A and "75" for the mounting head 40B, which are different. The second negative pressure level is "100" for the mounting head 40A and "201" for the mounting head 40B, which are different.

In this case, the data processing unit 20A determines that there is a difference (S50), and then compares the difference in negative pressure level with the allowable value (S55).

As shown in FIG. 13, the allowable value is determined for each type of measured value, and is 30% for negative pressure and 20% for illumination. It should be noted that this numerical value indicates the ratio of the level difference with the comparison target as the standard (100%).

In the above case, the level difference of the first negative pressure level is "4", which is "approximately 5%" in terms of ratio, which is below the allowable value. On the other hand, the level difference of the second negative pressure level is "101", which is "approximately 50%" when converted into a ratio, which is larger than the allowable value.

The data processing unit 20A issues a warning when the level difference of even one of the first negative pressure level and the second negative pressure level is greater than the allowable value (S60).

The warning may be displayed on the display unit 20C by displaying a message announcing an abnormality in the "measured value", or by turning on the abnormality indicator lamp 19 of the surface mounter 13A requesting confirmation of the abnormality.

On the other hand, when all the level differences are within the allowable value, the data processing section 20A selects the next comparison target. For example, the mounting head 40C is selected and the negative pressure level of the mounting head 40C is read from the surface mounter 13A.

Then, the data processing section 20A compares the negative pressure level of the mounting head 40A of the surface mounter 13A selected as a representative with the negative pressure level of the mounting head 40C selected as the next comparison target.

Such processing is repeated, and when the first negative pressure level and the second negative pressure level are compared between the two mounting heads 40 selected from the range to be compared, the level difference is greater than the allowable value. , a warning is issued (S60). Also, if the level difference is equal to or less than the allowable value for all combinations, the confirmation process is finally terminated.

In this configuration, the management performance of the mounting line S can be improved by having a check function for checking differences by comparing settings and measured values with comparison targets.

Also, if the setting differs from the comparison target, a warning is issued. With the warning, the operator can be asked to confirm the setting, and if there is a setting error, the operator can be prompted to correct the setting. Therefore, it is possible to suppress production failures due to setting errors or the like.

Also, if the level difference between the measured values is larger than the allowable value, a warning is given. The warning can request the operator to confirm the state of the object to be measured and prompt the operator to take necessary measures. Therefore, when there is an abnormality in the measurement target such as the mounting head 40, it is possible to prevent production from being performed under bad conditions.

Although the embodiments have been described in detail above, they are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above.

(1) In the first embodiment, the mounting line S is composed of one printer 11, three surface mounters 13A to 13C, and one inspection machine 15. FIG. The mounting line S may have any configuration as long as it has at least one surface mounter 13 .

(2) In the first embodiment, the difference in the measured value (negative pressure level) is checked by the management device 20, but each machine constituting the mounting line S, such as the surface mounter 13, may be checked. In particular, settings and measurements relating to the behavior specific to each machine may be checked within that machine. In other words, the "checking device" of the present invention may be the management device 20 that manages the mounting line S, or the controller 100 provided in a machine such as the surface mounter 13. FIG.

(3) In Embodiment 1, the negative pressure level of the mounting head 40 was compared within the same surface mounter 13 after machine adjustment. Specifically, the negative pressure was compared among the three mounting heads 40A to 40C in the surface mounter 13A. The object of comparison may be any other than the same surface mounter 13A as long as the mounting head 40 is equipped with the same nozzle. For example, in addition to the same surface mounter 13A, the mounting heads 40A to 40C of the other surface mounters 13B and 13C on the same mounting line S may be added to the range. Also, the mounting heads 40A to 40C of the surface mounters 13A to 13C of different mounting lines S may be added to the comparison targets. By widening the comparison target, it becomes possible to maintain the same condition over a wide range, and it is expected that the production quality will be constant. In addition, by widening the comparison target, comparison can be made even when there is no comparison target, such as the mounting head 40D, in the same surface mounter 13A. The same is true when checking other measured values.

(4) In Embodiment 1, the negative pressure levels of the mounting heads 40 were compared between different mounting heads 40 within the same surface mounter 13 after machine adjustment. Specifically, the three mounting heads 40A to 40C of the surface mounter 13A were compared. A past measurement value may be used as the object of comparison as long as the mounting head 40 is equipped with the same nozzle. That is, when checking the negative pressure level of the mounting head 40A of the surface mounter 13A, it may be compared with a past negative pressure level such as the previous value of the negative pressure level of the same mounting head 40A. When past measured values of the same object to be measured are compared, it is possible to determine a change in the condition of the object to be measured such as the mounting head 40 from the difference in the measured values. Moreover, when the level difference from the past measured value exceeds the allowable value, it is possible to suppress deterioration of the condition by issuing a warning. The same is true when checking other measured values.

(5) In the first embodiment, the allowable value for determining whether to issue a warning is set to a different numerical value depending on the object to be measured. Specifically, the allowable value was 30% for the negative pressure, and 20% for the lighting. These allowable values may be changed by the input unit 20D of the management device 20. FIG. By decreasing the allowable value, the condition for issuing the warning can be tightened, and by increasing the allowable value, the condition for issuing the warning can be loosened.

11 printing machine 13 surface mounting machine 15 inspection machine 20 management device (checking device)
20A Data processing unit 33 Head unit 40 Mounting head 45 Suction nozzle 100 Controller S1 First mounting line S2 Second mounting line

Claims (9)

A checking device for a machine that constitutes a board mounting line,
a data processing unit that compares the settings of the machines between the machines and checks for differences in settings;
The setting is a setting selected from a plurality of selection items,
A checking device , wherein the data processing unit issues a warning if the settings differ between machines . The checking device according to claim 1 ,
The checking device, wherein the setting is a substrate transfer method. The checking device according to claim 1 ,
The checking device, wherein the setting is the transport speed of the substrate. The checking device according to claim 1 ,
The checking device, wherein the setting is presence/absence of substrate standby between machines using standby units. The checking device according to claim 1 ,
The setting is a setting that should be common among the surface mounters that make up the board mounting line,
The checking device, wherein the comparison target is the setting of another surface mounter. The checking device according to claim 5 ,
The checking device, wherein the setting is an execution interval of a base mark recognition operation. The checking device according to claim 5 ,
The checking device, wherein the setting is execution/non-execution of the suction position confirmation operation. The checking device according to claim 5 ,
The checking device, wherein the settings are settings related to a maintenance task. The checking device according to any one of claims 1 to 8 ,
said machine sending information to the checking device when there is a change in machine settings;
A checking device, wherein the checking device executes a confirmation process for checking a setting difference in response to receiving information on a setting change.

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