JP2019201144A - Production apparatus for component mounting system, component mounting apparatus, and inspection method for component mounting system - Google Patents

Abstract

To provide a production apparatus for a component mounting system, capable of checking whether or not abnormality has been caused by changing a value of a parameter of a production program.SOLUTION: This component mounting apparatus 100b (production apparatus for a component mounting system) is a production apparatus constituting a component mounting system 100, the component mounting apparatus comprising: a substrate imaging unit 6 (inspection unit) for performing inspection; and a control unit 9 that, when it is detected before production of a substrate P is started by a production program 12 for producing the substrate P that a value of a parameter of the production program 12 has been changed, controls the substrate imaging unit 6 so that inspection is performed on an inspection item corresponding to the parameter whose value change has been detected.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a production apparatus for a component mounting system, a component mounting apparatus, and an inspection method for the component mounting system.

  2. Description of the Related Art Conventionally, a component mounting system for producing a board is known (for example, see Patent Document 1).

  Patent Document 1 discloses a component mounting line (component mounting system) for producing a circuit board on which electronic components are mounted. The component mounting line includes a solder printer, a component mounting machine, and the like. Japanese Patent Application Laid-Open No. 2005-228561 discloses a production management computer that manages production of a component mounting line. The production management computer transmits an NC program for producing a circuit board to a component mounting machine on the component mounting line. The component mounter performs an operation of mounting the electronic component on the circuit board and producing the circuit board based on the transmitted NC program.

  In addition, the production management computer checks whether there is a change in the data of the NC program before transmitting the NC data to the component mounting machine. When there is a change in the NC program data, the production management computer notifies the operator of the NC program data change contents. The operator determines whether there is a problem in the data change contents of the notified NC program, and inputs an instruction to the production management computer. When the operator inputs an instruction that there is no problem in the data change contents, the production management computer transmits the NC program whose data is changed to the component mounter. The component mounter produces a board based on the NC program whose data is changed.

JP 2014-165440 A

  However, the production management computer and the component mounter described in Patent Document 1 can only confirm the data change contents of the NC program before starting the production of the substrate, and the NC program has a change in the data. When the substrate is produced by this method, there is a problem that it cannot be confirmed whether or not an abnormality has occurred due to the change of the NC program data.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to determine whether or not an abnormality has occurred due to a change in a parameter value of a production program. A component mounting system production apparatus, a component mounting apparatus, and a component mounting system inspection method that can be confirmed.

  A production apparatus for a component mounting system according to a first aspect of the present invention is a production apparatus that constitutes a component mounting system, and starts production of a substrate by an inspection unit for performing an inspection and a production program for producing a substrate. If it is detected that there is a change in the parameter value of the production program before the inspection, the inspection unit is controlled to inspect the inspection item corresponding to the parameter in which the value is detected to be changed. A control unit.

  In the production apparatus of the component mounting system according to the first aspect of the present invention, when the board is produced by the production program having a change in the parameter value, the parameter is changed to the parameter having the changed value. A corresponding inspection item can be inspected by the inspection unit to obtain an inspection result. As a result, it is possible to provide a production apparatus for a component mounting system capable of confirming whether or not an abnormality has occurred due to a change in parameter value. Moreover, in the production apparatus of the component mounting system according to the first aspect, the production apparatus can inspect the inspection items. This is due to the fact that the parameter value has been changed compared to the case where inspection is performed in a downstream apparatus such as an inspection apparatus that does not have a production function and is disposed downstream of the production apparatus in the substrate transport direction. Can be detected at an early stage.

  In the production apparatus of the component mounting system according to the first aspect, preferably, the parameter value is changed based on a comparison between a past production program recorded after the completion of production and a production program used this time. Has been detected. If comprised in this way, the parameter from which the value was changed can be detected based on the comparison with the past production program with a production track record, and this production program. As a result, it is possible to effectively detect a parameter that may cause an abnormality as a parameter to be inspected.

  In this case, it is preferable that the change in the parameter value is detected based on a comparison between the production program used last time and the production program used this time. With this configuration, it is possible to detect a parameter whose value has been changed based on a comparison between the previous (previous) production program in which parameter optimization is more advanced and the current production program. As a result, a parameter that may cause an abnormality can be more effectively detected as a parameter for inspection.

  In the production apparatus of the component mounting system according to the first aspect, preferably, the inspection item is determined based on inspection item information in which a parameter is associated with an inspection item. If comprised in this way, an appropriate inspection item can be determined only by selecting the inspection item corresponding to the parameter whose value was changed from the inspection item information. As a result, an appropriate inspection item can be easily determined according to the parameter whose value has been changed.

  In the production apparatus of the component mounting system according to the first aspect, preferably, the parameter is at least one of a parameter related to a substrate, a parameter related to a component mounted on the substrate, and a parameter related to a component supply device that supplies the component. The inspection item includes at least one of an item related to the substrate, an item related to the component, and an item related to the component supply apparatus. If comprised in this way, it is a parameter regarding a board | substrate, a component, or a component supply apparatus, Comprising: The inspection item corresponding to the parameter in which the value was changed can be test | inspected by an test | inspection part, and a test result can be obtained. As a result, it is possible to confirm whether or not an abnormality has occurred due to a change in the parameter value relating to the board, the component, or the component supply apparatus.

  In the production apparatus of the component mounting system according to the first aspect, preferably, the control unit performs the inspection a predetermined number of times for the predetermined inspection item, and when it is confirmed that there is no abnormality, the predetermined inspection item is determined. The control for ending the inspection is performed. With this configuration, when it can be determined that stable substrate production can be performed even with the changed value, the inspection for a predetermined inspection item can be terminated and the subsequent inspection can be omitted. As a result, it is possible to reduce the time required for the production of the substrate by the amount of omitting the subsequent inspection while producing the stable substrate.

  In the production apparatus of the component mounting system according to the first aspect described above, preferably, when it is confirmed that there is an abnormality in the inspection for the predetermined inspection item, the control unit sets the parameter value corresponding to the predetermined inspection item. Control is performed to inquire the user whether or not to return to the value before the change. With this configuration, the user can correct the changed parameter value to an appropriate value before the change only by instructing to return the parameter value to the value before the change in response to the inquiry. . As a result, the changed parameter value can be corrected to an appropriate value while saving the user's trouble of correcting the parameter value.

  A production apparatus for a component mounting system according to a second aspect of the present invention is a production apparatus that constitutes a component mounting system, and includes a communication unit that communicates with a downstream apparatus disposed on the downstream side in the board conveyance direction, and a board If it is detected that there is a change in the value of the parameter of the production program before starting the production of the board by the production program for the production, the inspection item corresponding to the parameter in which the value is detected to be changed And a control unit that performs control to instruct the downstream device via the communication unit.

  In the production apparatus of the component mounting system according to the second aspect of the present invention, by configuring as described above, the board is produced by the production program in which the parameter value is changed when the parameter value is changed. In this case, the inspection item corresponding to the parameter whose value has been changed can be inspected by the downstream apparatus, and the inspection result can be obtained. As a result, it is possible to provide a production apparatus for a component mounting system capable of confirming whether or not an abnormality has occurred due to a change in parameter value. Moreover, in the production apparatus of the component mounting system according to the second aspect, the inspection item can be inspected in the downstream side apparatus. Thereby, compared with the case where it inspects in the production apparatus which instruct | indicated inspection, the burden of a production apparatus can be reduced.

  A component mounting apparatus according to a third aspect of the present invention includes a head for mounting components on a substrate, an inspection unit for performing inspection, and a production program before starting production of a substrate by a production program for producing a substrate. A control unit that controls the inspection unit so as to inspect the inspection item corresponding to the parameter that is detected to have a change in value when it is detected that the value of the parameter is changed. .

  In the component mounting apparatus according to the third aspect of the present invention, due to the configuration as described above, the value of the parameter of the production program is changed as in the production apparatus of the component mounting system according to the first aspect. Thus, it is possible to provide a component mounting apparatus that can confirm whether or not an abnormality has occurred.

  The inspection method for a component mounting system according to the fourth aspect of the present invention changes the parameter value of the production program before starting production of the substrate by the production program for producing the substrate in the production apparatus constituting the component mounting system. If it is detected that there is a change in the parameter value, the inspection item corresponding to the parameter in which the change is detected is inspected.

  In the component mounting system inspection method according to the fourth aspect of the present invention, by configuring as described above, the parameter values of the production program are changed in the same manner as in the component mounting system production apparatus according to the first aspect. In particular, it is possible to provide a method for inspecting a component mounting system capable of confirming whether or not an abnormality has occurred.

  According to the present invention, as described above, a production apparatus for a component mounting system, a component mounting apparatus, and a component mounting system capable of confirming whether or not an abnormality has occurred due to a change in a parameter value of a production program An inspection method for a component mounting system can be provided.

It is a schematic diagram showing a component mounting system of the first and second embodiments. It is a typical top view which shows the component mounting apparatus of 1st and 2nd embodiment. It is a block diagram which shows the control structure of the component mounting apparatus of 1st and 2nd embodiment. It is a figure for demonstrating the parameter of the production program of the component mounting apparatus of 1st Embodiment. It is a figure for demonstrating the inspection item information of the component mounting apparatus of 1st Embodiment. It is a figure for demonstrating the test | inspection operation | movement regarding the component of the component mounting apparatus of 1st Embodiment. It is a figure for demonstrating the 1st example of the test | inspection operation | movement regarding the board | substrate of the component mounting apparatus of 1st Embodiment. It is a figure for demonstrating the 2nd example of the test | inspection operation | movement regarding the board | substrate of the component mounting apparatus of 1st Embodiment. It is a figure for demonstrating the test | inspection operation | movement regarding the component supply apparatus of the component mounting apparatus of 1st Embodiment. It is a flowchart for demonstrating the board | substrate production process of the component mounting apparatus of 1st Embodiment. It is a flowchart for demonstrating the inspection item determination process of the component mounting apparatus of 1st Embodiment. It is a flowchart for demonstrating the mounting process of 1 board | substrate of the component mounting apparatus of 1st Embodiment. It is a flowchart for demonstrating the inspection process of the component mounting apparatus of 1st Embodiment. It is a block diagram which shows the control structure of the inspection apparatus of the component mounting system of 2nd Embodiment. It is a flowchart for demonstrating the board | substrate test | inspection process of the test | inspection apparatus of 2nd Embodiment. It is a flowchart for demonstrating the test | inspection process of 1 board | substrate of the test | inspection apparatus of 2nd Embodiment. It is a flowchart for demonstrating the inspection item determination process of the component mounting apparatus of 2nd Embodiment. It is a flowchart for demonstrating the parameter correction process of the component mounting apparatus of 2nd Embodiment.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings.

[First Embodiment]
First, the configuration of the component mounting system 100 according to the first embodiment will be described with reference to FIG.

(Configuration of component mounting system)
As shown in FIG. 1, a component mounting system 100 mounts (mounts) a component E (electronic component) such as an IC, a transistor, a capacitor, and a resistor on a substrate P such as a printed circuit board. This is a system for producing a substrate P.

  The component mounting system 100 includes a printing apparatus 100a, a component mounting apparatus 100b, an inspection apparatus 100c before reflow, a reflow furnace 100d, and an inspection apparatus 100e after reflow. The printing apparatus 100a, the component mounting apparatus 100b, the pre-reflow inspection apparatus 100c, the reflow furnace 100d, and the reflow inspection apparatus 100e are arranged in this order from the upstream side to the downstream side. . In addition, a delivery conveyor (not shown) is disposed between the devices to convey and transfer the substrate P between the devices. The delivery conveyor conveys the substrate P in the substrate conveyance direction (X direction) and delivers it from the upstream device to the downstream device. The component mounting apparatus 100b is an example of the “component mounting system production apparatus” in the claims.

  The printing apparatus 100a performs a printing operation of screen-printing a bonding material such as solder on the substrate P as a production operation of the substrate P. The component mounting apparatus 100b performs a mounting operation for mounting the component E on the substrate P on which the printing operation has been performed by the printing apparatus 100a as a production operation of the substrate P. The inspection apparatus 100c before reflow performs an inspection operation for inspecting the substrate P on which the mounting operation has been performed by the component mounting apparatus 100b. The reflow furnace 100d joins the part E to the board | substrate P by which the test | inspection work was performed by the test | inspection apparatus 100c before reflow by melting and solidifying the joining material printed on the board | substrate P as production work of the board | substrate P. Perform reflow work. The inspection apparatus 100e after reflow performs an inspection operation for inspecting the substrate P on which the reflow operation has been performed by the reflow furnace 100d.

(Configuration of component mounting device)
Next, the configuration of the component mounting apparatus 100b of the component mounting system 100 will be described with reference to FIGS. In the following description, the direction along the substrate transport direction is the X direction, the direction orthogonal to the X direction in the horizontal plane is the Y direction, and the vertical direction orthogonal to the X direction and the Y direction is the Z direction.

  The component mounting apparatus 100b is an apparatus for mounting a component E (electronic component) such as an IC, a transistor, a capacitor, and a resistor on a substrate P such as a printed board as shown in FIGS.

  The component mounting apparatus 100b includes a base 1, a transport unit 2, a head unit 3, a head horizontal movement mechanism unit 4, a component imaging unit 5, a board imaging unit 6, a height measuring unit 7, and a storage unit. 8, a control unit 9 (see FIG. 3), and a communication unit 10. The board imaging unit 6 is an example of the “inspection unit” in the claims.

  The base 1 is a base serving as a basis for arranging each component in the component mounting apparatus 100b. On the base 1, a transport unit 2, a rail unit 42, and a component imaging unit 5 are provided. A control unit 9 is provided in the base 1. Further, the base 1 is provided with component supply devices 11 on both sides in the Y direction (Y1 direction side and Y2 direction side).

  The component supply device 11 is a device that supplies a component E mounted on the board P. The component supply device 11 is a tape feeder that supplies the component E by sending a component supply tape T (see FIG. 9) that houses the component E. The component supply device 11 intermittently sends the component supply tape T according to the component holding operation by the head unit 3. The component supply tape T is a tape that stores a plurality of components E at a predetermined pitch. On the component supply tape T, concave component storage portions Ta for storing and holding the component E are formed at a predetermined pitch.

  The transport unit 2 is configured to carry in the board P before mounting, transport the board P in the board transport direction (X direction), and carry out the board P after mounting. The transport unit 2 is configured to transport the loaded substrate P to the substrate fixing position Pa and to fix the substrate P by a substrate fixing mechanism (not shown) at the substrate fixing position Pa. Further, the transport unit 2 includes a pair of transport belts 21. The transport unit 2 is configured to transport the substrate P in the substrate transport direction with the pair of transport belts 21 supporting both ends in the width direction (Y direction) of the substrate P from the lower side (Z2 direction side). Has been.

  The head unit 3 is a component mounting head unit. The head unit 3 mounts the component E on the substrate P fixed at the substrate fixing position Pa. The head unit 3 includes a plurality (five) of heads (mounting heads) 31. A nozzle 31a (see FIG. 6) for holding (sucking) the component E is detachably attached to the tip of the head 31. The head 31 is configured to be capable of holding (sucking) the component E on the nozzle 31a by a negative pressure from a negative pressure supply unit (not shown).

  The head unit 3 includes a Z-axis motor 32 (see FIG. 3) that moves the head 31 in the vertical direction (Z direction) and an R-axis motor 33 (see FIG. 3) that rotates the head 31 about a rotation axis that extends in the Z direction. Reference). The head 31 is moved between a lowered position for holding the component E or mounting the held component E by the Z-axis motor 32 and an elevated position for transporting the held component E to the substrate P. Thus, it is configured to be movable in the vertical direction. The head 31 is configured to be capable of adjusting the orientation of the component E being held by being rotated by the R-axis motor 33 while holding the component E.

  The head horizontal movement mechanism unit 4 is configured to move the head unit 3 in the horizontal direction (X direction and Y direction). The head horizontal movement mechanism unit 4 includes a support unit 41 that supports the head unit 3 so as to be movable in the X direction, and a rail unit 42 that supports the support unit 41 so as to be movable in the Y direction. The support portion 41 includes a ball screw shaft 41a extending in the X direction and an X-axis motor 41b that rotates the ball screw shaft 41a. The head unit 3 is provided with a ball nut (not shown) that engages with the ball screw shaft 41 a of the support portion 41. The head unit 3 is configured to be movable in the substrate transport direction along the support portion 41 together with a ball nut engaged with the ball screw shaft 41a when the ball screw shaft 41a is rotated by the X-axis motor 41b. .

  The rail portion 42 includes a pair of guide rails 42a that support both ends of the support portion 41 in the X direction so as to be movable in the Y direction, a ball screw shaft 42b extending in the Y direction, and a Y axis motor that rotates the ball screw shaft 42b. 42c. The support portion 41 is provided with a ball nut (not shown) that engages with the ball screw shaft 42 b of the rail portion 42. The support portion 41 is movable in the Y direction along the pair of guide rails 42a of the rail portion 42 together with the ball nut engaged with the ball screw shaft 42b by rotating the ball screw shaft 42b by the Y-axis motor 42c. It is configured.

  The head unit 3 is configured to be movable on the base 1 in the horizontal direction by the support portion 41 and the rail portion 42 of the head horizontal movement mechanism portion 4. As a result, the head 31 of the head unit 3 can move above the component supply device 11 and hold (suck) the component E supplied from the component supply device 11. Further, the head 31 of the head unit 3 can move above the substrate P fixed at the substrate fixing position Pa and mount the held (sucked) component E on the substrate P.

  The component imaging unit 5 is a component recognition camera. The component imaging unit 5 images the component E held (adsorbed) by the nozzle 31 a of the head 31 while the component E is being transported to the substrate P by the head 31 of the head unit 3. The component imaging unit 5 is fixed on the upper surface of the base 1 and images the component E held (sucked) by the nozzle 31a of the head 31 from the lower side (Z2 direction side) of the component E. Based on the captured image of the component E by the component imaging unit 5, the control unit 9 acquires (recognizes) the holding state (rotational posture and holding position with respect to the head 31) of the component E.

  The board imaging unit 6 is a board recognition camera. The board imaging unit 6 is configured to detect the position recognition marks (figures) attached to the upper surface of the board P in the board P fixed at the board fixing position Pa before the head 31 of the head unit 3 starts mounting the component E on the board P. (Dual Mark) F is imaged from above. The position recognition mark F is a mark for recognizing the position of the substrate P. Based on the captured image of the position recognition mark F by the substrate imaging unit 6, the control unit 9 acquires (recognizes) the accurate position and orientation of the substrate P fixed at the substrate fixing position Pa. The board imaging unit 6 is attached to the head unit 3. The board imaging unit 6 is configured to be movable along with the head unit 3 in the horizontal direction. Moreover, the board | substrate imaging part 6 functions as an inspection part for inspecting so that it may mention later.

  The height measuring unit 7 is a laser displacement meter for measuring the height position of the substrate P fixed at the substrate fixing position Pa. The height measuring unit 7 obtains a measurement result of the height position of the substrate P by irradiating the substrate P with laser light from above and receiving reflected light from the substrate P. The control unit 9 causes the height measurement unit 7 to measure the height position of the substrate P at a plurality of positions, and warps the substrate P based on the measurement result of the height position of the substrate P by the plurality of height measurement units 7. Get the quantity. The height measuring unit 7 is attached to the head unit 3. The height measuring unit 7 is configured to be movable along with the head unit 3 in the horizontal direction.

  The storage unit 8 is a storage medium including a flash memory, for example, and stores information. The storage unit 8 stores, for example, a production program 12 (mounting program) for producing the substrate P created according to the type of the substrate P. Specifically, the storage unit 8 stores a production program 12 used this time, a production program 12 as a master program, and a past production program 12 recorded after the production is completed. The past production program 12 is stored in the storage unit 8 so that the user cannot change it. Further, the past production program 12 may be stored in a production program creation device 200 described later.

  As shown in FIG. 4, the production program 12 includes various parameters that can be set (changed) by the user (operator). Specifically, the parameters include a parameter related to the substrate P, a parameter related to the component E, a parameter related to the component supply device 11, and the like. The parameters related to the substrate P include the size of the substrate P, the conveyance speed of the substrate P, and the like. Parameters related to the component E include the mounting position coordinates of the component E, the rotation angle of the component E, the size of the component E, the suction height of the component E, the mounting height of the component E, the imaging illumination amount of the component E by the component imaging unit 5, The rotational speed of the head 31 holding the component E is included. The parameters related to the component supply device 11 include a feeder (component supply device 11) feed pitch and the like.

  As shown in FIG. 3, the control unit 9 is a control circuit that controls the operation of the component mounting apparatus 100b. The control unit 9 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The control unit 9 performs control for producing the substrate P based on the production program 12. Specifically, the control unit 9 controls the conveyance unit 2, the component supply device 11, the X-axis motor 41 b and the Y-axis motor 42 c based on the production program 12, so that the component on the board P by the head unit 3. E is mounted to control the production of the substrate P.

  The communication unit 10 is an interface for communicating information. The communication unit 10 connects the component mounting apparatus 100b and other apparatuses (printing apparatus 100a, inspection apparatus 100c before reflow, reflow furnace 100d, inspection apparatus 100e after reflow) in a communicable manner. Moreover, the communication part 10 connects the component mounting apparatus 100b and the production program creation apparatus 200 so that communication is possible.

  The production program creation apparatus 200 is an apparatus for creating a program such as the production program 12 for the component mounting apparatus 100b. The production program creation device 200 includes a display unit 201, a control unit 202, and a communication unit 203. The display unit 201 includes, for example, a liquid crystal monitor and displays information. The display unit 201 displays information indicating the production program 12 being created, for example. The control unit 202 is a control circuit that controls the operation of the production program creation device 200. The control unit 202 includes a central processing unit (CPU), a read only memory (ROM), and a random access memory (RAM). The communication unit 203 is an interface for communicating information. The communication unit 203 communicates between the production program creation device 200 and each device of the component mounting system 100 (printing device 100a, component mounting device 100b, inspection device 100c before reflow, reflow furnace 100d, inspection device 100e after reflow). Connect as possible.

  The production program creation device 200 transmits the created production program 12 to the component mounting device 100b via the communication unit 203. The component mounting apparatus 100 b receives (acquires) the production program 12 created by the production program creation apparatus 200 via the communication unit 10.

(When there is a change in the parameters of the production program)
The user may change the parameter values of the production program 12 when there is an error in the input contents of the parameters of the production program 12 or when improving the production efficiency. When the parameter value of the production program 12 is changed, there is a possibility that an abnormality may occur due to the change of the parameter value of the production program 12.

  Therefore, in the first embodiment, as illustrated in FIGS. 5 to 9, the control unit 9 determines whether or not there is a change in the parameter value of the production program 12 before starting production of the substrate P by the production program 12. Control to detect whether or not. Then, when it is detected that there is a change in the parameter value of the production program 12, the control unit 9 checks the inspection item corresponding to the parameter in which the value is detected during the production of the substrate P. The board imaging unit 6 is controlled so as to perform the inspection.

<Detection of changes in parameters>
The control unit 9 performs control to detect that there is a change in the parameter value of the production program 12 based on a comparison between the past production program 12 stored in the storage unit 8 and the production program 12 used this time. . Specifically, the control unit 9 performs control to detect that there is a change in the parameter value of the production program 12 based on a comparison between the production program 12 used last time and the production program 12 used this time. Do. The control unit 9 performs control to compare the same parameters in the production program 12 used last time and the production program 12 used this time. Then, when the values of the compared parameters are different from each other, the control unit 9 detects that the parameter is changed, and detects a parameter having a different value as the parameter whose value has been changed. Moreover, the control part 9 detects that there is no change in a parameter, when the value of the compared parameters is the same.

<Determination of inspection items, inspection of inspection items>
As shown in FIG. 5, the control unit 9 performs control to determine an inspection item based on inspection item information 13 in which parameters of the production program 12 are associated with inspection items. The inspection item information 13 is a table in which parameters of the production program 12 are associated with inspection items. The inspection item information 13 is stored in the storage unit 8. The inspection items of the inspection item information 13 include items related to the substrate P, items related to the component E, items related to the component supply device 11, and the like. Items relating to the substrate P include inspection of positional deviation of the component E mounted on the substrate P, inspection of the fixed position of the substrate P, and the like. The items related to the substrate P are associated with parameters related to the substrate P (the size of the substrate P, the conveyance speed of the substrate P, etc.). Items relating to the component E include inspection of the mounting state of the component E and the like. Items related to the component E are associated with parameters related to the component E (mounting height of the component E, mounting position coordinates of the component E, etc.). Items related to the component supply device 11 include inspection of a feeder feeding state and the like. Items related to the component supply device 11 are associated with parameters (such as feeder feed pitch) related to the component supply device 11. When a parameter whose value has been changed is detected, the control unit 9 selects an inspection item corresponding to the parameter whose value has been changed from the inspection item information 13 and determines the inspection item to be inspected.

  For example, when “mounting height of component E” is detected as a parameter whose value has been changed, the control unit 9 checks “inspection of mounting state of component E” corresponding to “mounting height of component E”. Determine as an item. The same applies to the case where “the imaging illumination amount of the component E by the component imaging unit 5”, “the rotational speed of the head 31 holding the component E”, and “the mounting position coordinates of the component E” are detected as parameters whose values have been changed. is there. Further, for example, when the “transport speed of the substrate P” is detected as the parameter whose value has been changed, the control unit 9 corresponds to the “position of the component E already mounted on the substrate P” corresponding to the “transport speed of the substrate P”. "Inspection of deviation" is determined as an inspection item. Further, for example, when “the size of the substrate P” is detected as the parameter whose value has been changed, the “inspection of the fixed position of the substrate P” corresponding to the “size of the substrate P” is used as the inspection item. decide. For example, when “feeder feed pitch” is detected as a parameter whose value has been changed, the control unit 9 determines “feeder feed state inspection” corresponding to “feeder feed pitch” as an inspection item.

  Further, the control unit 9 controls the board imaging unit 6 so as to perform an inspection operation according to the determined inspection item. Specifically, the control part 9 controls the board | substrate imaging part 6 to perform the test | inspection operation regarding the board | substrate P, when the item regarding the board | substrate P is determined as an inspection item. In addition, when an item related to the component E is determined as an inspection item, the control unit 9 controls the board imaging unit 6 to perform an inspection operation related to the component E. In addition, when an item related to the component supply device 11 is determined as an inspection item, the control unit 9 controls the board imaging unit 6 to perform an inspection operation related to the component supply device 11.

  For example, when “inspection of the mounting state of the component E” is determined as the inspection item, as shown in FIG. 6, after the component E is mounted on the substrate P by the head 31 of the head unit 3, the control unit 9 The board imaging unit 6 is controlled so as to inspect the mounting state of the mounted component E. Specifically, after the component E is mounted on the substrate P by the head 31 of the head unit 3, the control unit 9 controls the substrate imaging unit 6 so as to image the mounted component E. And the control part 9 compares the position of the mounted component E with the design position (position which should be originally) based on the captured image of the component E by the board | substrate imaging part 6, and acquires a test result. The controller 9 determines that an abnormality has occurred when the position of the mounted component E is shifted from the design position. Further, the control unit 9 determines that there is no abnormality when the position of the mounted component E is not shifted from the design position.

  For example, when “inspection of positional deviation of the component E mounted on the substrate P” is determined as an inspection item, the control unit 9 fixes the substrate P on the substrate P by the transport unit 2 as shown in FIG. After the conveyance to the position Pa and the fixing of the board P at the board fixing position Pa, the board imaging unit 6 is controlled so as to inspect the positional deviation of the component E mounted on the fixed board P. Specifically, the control unit 9 transports the substrate P to the substrate fixing position Pa by the transport unit 2, and after fixing the substrate P at the substrate fixing position Pa, the component E mounted on the fixed substrate P. The board imaging unit 6 is controlled so as to take an image. As the component E to be imaged, a component E (such as a tall component E) whose position is likely to shift is set in advance. Then, the control unit 9 compares the position of the mounted component E with the design position (position that should be originally) based on the captured image of the component E by the board imaging unit 6 and acquires the inspection result. The control unit 9 determines that an abnormality has occurred when the position of the component E is shifted from the design position. Further, when the position of the part E is not deviated from the design position, the control unit 9 determines that there is no abnormality.

  Further, for example, when “inspection of the fixed position of the substrate P” is determined as an inspection item, the control unit 9 transfers the substrate P to the substrate fixing position Pa by the transfer unit 2 as shown in FIG. And after fixing the board | substrate P in the board | substrate fixed position Pa, the board | substrate imaging part 6 is controlled so that the fixed position of the fixed board | substrate P may be test | inspected. Specifically, after the transport unit 2 transports the substrate P to the substrate fixing position Pa and fixes the substrate P at the substrate fixing position Pa, the control unit 9 ends the fixed substrate P in the substrate transport direction. The board imaging unit 6 is controlled so as to image the part. Then, the control unit 9 determines the position and design position (originally) of the end of the fixed substrate P in the substrate transport direction based on the captured image of the end of the fixed substrate P in the substrate transport direction. To obtain a test result. The control unit 9 determines that an abnormality has occurred when the position of the end of the fixed substrate P in the substrate transport direction is shifted from the design position. Moreover, the control part 9 judges that there is no abnormality when the position of the edge part of the board | substrate conveyance direction of the fixed board | substrate P has not shifted | deviated from the design position.

  Further, for example, when “inspection of feeder feeding state” is determined as an inspection item, the control unit 9 after the feeding of the component supply tape T to the component supply position by the component supply device 11 is performed as shown in FIG. Then, the board imaging unit 6 is controlled so as to inspect the feeding state of the component supply tape T on the component supply device 11. Specifically, after the supply of the component supply tape T to the component supply position by the component supply device 11 and before the acquisition operation of the component E by the head 31 of the head unit 3, the component supply device 11 sent to the component supply position. The board imaging unit 6 is controlled so that the component storage unit Ta of the upper component supply tape T and the component E stored in the component storage unit Ta are imaged. In addition, you may perform the imaging by the board | substrate imaging part 6 after acquisition operation | movement of the component E by the head 31 of the head unit 3. FIG. In this case, since the component E is acquired from the component storage unit Ta, only the component storage unit Ta of the component supply tape T on the component supply device 11 sent to the component supply position is imaged. Then, the control unit 9 determines the position of the component storage unit Ta of the component supply tape T based on the captured images of the component storage unit Ta of the component supply tape T and the component E stored in the component storage unit Ta. And the design position (position that should be originally), or the position of the component E stored in the component storage unit Ta is compared with the design position to obtain the inspection result. The control unit 9 determines that an abnormality has occurred when the position of the component storage unit Ta of the component supply tape T or the component E stored in the component storage unit Ta is shifted from the design position. The control unit 9 determines that there is no abnormality when the position of the component storage unit Ta of the component supply tape T or the component E stored in the component storage unit Ta is not shifted from the design position.

  In the first embodiment, the control unit 9 inspects a predetermined number of times (for example, about several times) for a predetermined inspection item, and confirms that there is no abnormality continuously for the predetermined number of times. In this case, a control for terminating the inspection for a predetermined inspection item is performed. The number of times of inspection may be a fixed value or may be set by the user. Further, the number of inspections may be set individually for each inspection item. Further, when it is confirmed that there is an abnormality in the inspection for the predetermined inspection item, the control unit 9 changes the value of the parameter corresponding to the predetermined inspection item to the value before the change (the parameter value of the previous production program 12). Control to inquire the user whether or not to return to (value). Then, when receiving an instruction to return the parameter value corresponding to the predetermined inspection item to the value before the change, the control unit 9 performs control to return the parameter value corresponding to the predetermined inspection item to the value before the change. .

  Further, when it is detected that there is a change in the manufacturer of the part E before the production of the substrate P by the production program 12 is started, the control unit 9 checks the part E in which the change is detected. The board imaging unit 6 is controlled to perform. Since the inspection operation in this case is the same as the inspection operation in the case where “inspection of the mounting state of the component E” is determined as the inspection item, detailed description thereof is omitted. In addition, when it is detected that there is a change in the production lot of the substrate P before the production program 12 starts the production of the substrate P, the control unit 9 inspects the substrate P for which the change is detected. The height measuring unit 7 is controlled so as to perform the above. Specifically, the control unit 9 inspects the warped state of the fixed substrate P after the transport unit 2 transports the substrate P to the substrate fixing position Pa and fixes the substrate P at the substrate fixing position Pa. Thus, the height measuring unit 7 is controlled. The control unit 9 causes the height measurement unit 7 to measure the height position of the substrate P at a plurality of positions, and warps the substrate P based on the measurement result of the height position of the substrate P by the plurality of height measurement units 7. Get the quantity.

(Board production processing)
Next, a board production process by the component mounting apparatus 100b of the first embodiment will be described with reference to a flowchart with reference to FIG. Each process of the flowchart is performed by the control unit 9.

  As shown in FIG. 10, first, in step S1, the production program 12 as a master program is read as the current production program 12.

  In step S2, the operation of the component mounting apparatus 100b is started.

  In step S3, an inspection item determination process is performed. Details of the inspection item determination process will be described later.

  In step S4, a mounting process for one substrate is performed. Details of the mounting process for one substrate will be described later.

  In step S5, the number of produced substrates P is counted up.

  In step S6, it is determined whether or not the production number of the substrates P has reached the planned production number. If it is determined that the production number of the substrates P has not reached the planned production number, the process returns to step S4. Then, the processes in steps S4 to S6 are repeated until the number of substrates P produced reaches the planned production number.

  If it is determined in step S6 that the production number of substrates P has reached the planned production number, the process proceeds to step S7.

  In step S7, the current production program 12 is stored (recorded) in the storage unit 8 as the past production program 12.

  In step S8, it is determined whether or not to update the production program 12 as the master program based on an instruction from the user. In step S8, when an instruction not to update the production program 12 as the master program is received, it is determined that the production program 12 as the master program is not updated. Then, the substrate production process is terminated.

  In step S8, when an instruction to update the production program 12 as the master program is received, it is determined that the production program 12 as the master program is updated. Then, the process proceeds to step S9.

  In step S9, the current production program 12 is stored (recorded) in the storage unit 8 as the production program 12 as a master program. Then, the substrate production process is terminated.

(Inspection item decision processing)
Next, with reference to FIG. 11, the inspection item determination process by the component mounting apparatus 100b of the first embodiment will be described based on a flowchart. Each process of the flowchart is performed by the control unit 9.

  As shown in FIG. 11, first, the past production program 12 is read in step S11.

  In step S12, the current production program 12 and the past production program 12 are compared.

  In step S13, it is determined whether or not there is a change in the parameter value. When it is determined that there is no change in the parameter value (when all the compared parameters have the same parameter value), the inspection item determination process is terminated.

  If it is determined in step S13 that the parameter value is changed, the process proceeds to step S14.

  In step S14, the inspection item corresponding to the parameter whose value is changed from the inspection item information 13 is selected and determined as the inspection item to be inspected. Further, the determined inspection item is stored in the storage unit 8. Thereafter, the inspection item determination process is terminated.

(1 substrate mounting process)
Next, with reference to FIG. 12, the mounting process of one board | substrate by the component mounting apparatus 100b of 1st Embodiment is demonstrated based on a flowchart. Each process of the flowchart is performed by the control unit 9.

  As shown in FIG. 12, first, in step S21, the substrate P is loaded by the transport unit 2, and the loaded substrate P is transported to the substrate fixing position Pa and fixed at the substrate fixing position Pa.

  In step S22, an inspection process after fixing the substrate is performed. Details of the inspection process after fixing the substrate will be described later.

  And in step S23, the inspection process before component adsorption | suction is performed. The details of the inspection process before component adsorption will be described later.

  In step S <b> 24, the component E supplied from the component supply device 11 is sucked (held) by the head 31 of the head unit 3.

  In step S25, the component E sucked by the nozzle 31a of the head 31 is mounted on the substrate P by the head 31 of the head unit 3.

  In step S26, an inspection process after component mounting is performed. The details of the inspection process after component mounting will be described later.

  In step S27, it is determined whether or not the mounting of the component E at all mounting points to be mounted is completed. When it is determined that the mounting of the component E on all mounting points is not completed, the process returns to step S23. And the process of step S23-S27 is repeated until the mounting of the components E to all the mounting points is completed.

  If it is determined in step S27 that the mounting of the component E at all mounting points is completed, the process proceeds to step S28.

  In step S <b> 28, the fixation of the substrate P at the substrate fixing position Pa is released, and the released substrate P is carried out by the transport unit 2. Thereafter, the mounting process for one substrate is completed.

(Inspection process)
Next, with reference to FIG. 13, the inspection process by the component mounting apparatus 100b of the first embodiment will be described based on a flowchart. Here, the inspection processing after fixing the substrate, the inspection processing before component adsorption, and the inspection processing after component mounting will be collectively described as inspection processing. Each process of the flowchart is performed by the control unit 9.

  As shown in FIG. 13, first, in step S31, it is determined whether or not an inspection is necessary. Specifically, in step S31, it is determined whether or not there is an inspection item and whether or not the number of times that it has been confirmed that there is no abnormality in the inspection has reached a predetermined number.

  In step S31, if it is determined that there are no inspection items, or if it is determined that the number of times that it has been confirmed that there is no abnormality in the inspection has reached a predetermined number, it is determined that it is not necessary to perform the inspection. The In this case, the inspection process is terminated.

  In step S31, if it is determined that there is an inspection item, and if it is determined that the number of times that it has been confirmed that there is no abnormality in the inspection has not reached the predetermined number, it is determined that the inspection needs to be performed. Is done. In this case, the process proceeds to step S32.

  In step S32, the inspection operation by the board imaging unit 6 is executed according to the determined inspection item. If the inspection process is an inspection process after fixing the substrate, an inspection operation relating to the substrate P is performed in step S32. If the inspection process is an inspection process before component adsorption, an inspection operation related to the component supply apparatus 11 is performed in step S32. If the inspection process is an inspection process after component mounting, an inspection operation related to the component E is performed in step S32.

  In step S33, it is determined whether an abnormality has occurred in the inspection. If it is determined that there is no abnormality in the inspection, the process proceeds to step S34. In step S34, the number of times when it is confirmed that there is no abnormality in the inspection is counted up. Thereafter, the inspection process is terminated.

  If it is determined in step S33 that an abnormality has occurred in the inspection, the process proceeds to step S35.

  In step S35, the fact that an abnormality has occurred in the inspection is stored in the storage unit 8 as performance information. The user can know a parameter that has caused an abnormality in the past and the value of the parameter based on the record information.

  In step S36, control to display error information is performed. For example, the error information is displayed on a display unit of a portable terminal carried by the user.

  In step S37, the operation of the component mounting apparatus 100b is stopped.

  In step S38, it is determined whether or not to return the changed parameter value to the original value (return to the value before the change) based on an instruction from the user. In step S38, if an instruction to restore the changed parameter value is received, it is determined that the changed parameter value is restored. In this case, the process proceeds to step S39.

  In step S39, the changed parameter value is returned to the value before the change.

  In step S38, if an instruction not to restore the changed parameter value is received, it is determined that the changed parameter value is not restored. In this case, the process proceeds to step S40.

  In step S40, an instruction is given to the user (operator) to correct the changed parameter. In response to an instruction from the component mounting apparatus 100b, the user instructs correction contents. Then, the changed parameter is corrected based on the instructed correction content.

  In step S41, the operation of the component mounting apparatus 100b is resumed.

  In step S42, the inspection item determination process is performed again. Thereafter, the inspection process is terminated.

(Effect of 1st Embodiment)
In the first embodiment, the following effects can be obtained.

  In the first embodiment, as described above, the control unit 9 detects that there is a change in the parameter value of the production program 12 before starting production of the substrate P by the production program 12 for producing the substrate P. If it is, the board imaging unit 6 is configured to control the inspection item corresponding to the parameter detected to have a change in value. Thus, when the board P is produced by the production program 12 having a change in the parameter value, the board imaging unit 6 inspects the inspection item corresponding to the parameter whose value has been changed, and obtains an inspection result. it can. As a result, it is possible to provide the component mounting apparatus 100b capable of confirming whether or not an abnormality has occurred due to the parameter value being changed. Moreover, in the component mounting apparatus 100b of 1st Embodiment, it can test | inspect about an inspection item in the component mounting apparatus 100b. As a result, the parameter values have been changed compared to the case where the inspection is performed in a downstream apparatus such as the inspection apparatus 100c that does not have a production function and is disposed downstream of the component mounting apparatus 100b in the conveyance direction of the board P. It is possible to detect abnormalities caused by the problem at an early stage.

  In the first embodiment, as described above, it is detected that there is a change in the parameter value based on a comparison between the past production program 12 recorded after the completion of production and the production program 12 used this time. To do. Thereby, a parameter whose value has been changed can be detected based on a comparison between the past production program 12 with a production record and the current production program 12. As a result, it is possible to effectively detect a parameter that may cause an abnormality as a parameter to be inspected.

  In the first embodiment, as described above, the change in the parameter value is detected based on a comparison between the production program 12 used last time and the production program 12 used this time. Thereby, the parameter whose value has been changed can be detected based on the comparison between the previous (previous) production program 12 in which parameter optimization is further advanced and the current production program 12. As a result, a parameter that may cause an abnormality can be more effectively detected as a parameter for inspection.

  In the first embodiment, as described above, the inspection item is determined based on the inspection item information 13 in which the parameter and the inspection item are associated with each other. As a result, an appropriate inspection item can be determined simply by selecting an inspection item corresponding to the parameter whose value has been changed from the inspection item information 13. As a result, an appropriate inspection item can be easily determined according to the parameter whose value has been changed.

  Further, in the first embodiment, as described above, the parameters are configured to include a parameter related to the substrate P, a parameter related to the component E mounted on the substrate P, and a parameter related to the component supply device 11 that supplies the component E. To do. The inspection items are configured to include items related to the substrate P, items related to the component E, and items related to the component supply device 11. Thereby, it is possible to obtain an inspection result by inspecting the inspection item corresponding to the parameter related to the substrate P, the component E, or the component supply device 11 and having the value changed by the substrate imaging unit 6. . As a result, it is possible to confirm whether or not an abnormality has occurred due to a change in the parameter value relating to the substrate P, the component E, or the component supply device 11.

  In the first embodiment, as described above, the control unit 9 performs the inspection for the predetermined number of times for the predetermined inspection item, and when it is confirmed that there is no abnormality, the inspection for the predetermined inspection item is performed. It is configured to perform control to end. Accordingly, when it can be determined that stable substrate P can be produced even with the changed value, the inspection for a predetermined inspection item can be finished and the subsequent inspection can be omitted. As a result, it is possible to reduce the time required for the production of the substrate P by the amount of omitting the subsequent inspection while producing the stable substrate P.

  In the first embodiment, as described above, when it is confirmed that there is an abnormality in the inspection for the predetermined inspection item, the control unit 9 changes the value of the parameter corresponding to the predetermined inspection item before the change. Control is made to inquire the user whether or not to return the value. Thereby, the user can correct the changed parameter value to an appropriate value before the change only by instructing to return the parameter value to the value before the change in response to the inquiry. As a result, the changed parameter value can be corrected to an appropriate value while saving the user's trouble of correcting the parameter value.

[Second Embodiment]
Next, a second embodiment will be described with reference to FIGS. 1 to 3 and FIGS. 14 to 18. In the second embodiment, an example in which an inspection item is inspected in an inspection apparatus will be described, unlike the first embodiment in which an inspection item is inspected in a component mounting apparatus. In addition, about the structure same as the said 1st Embodiment, the same code | symbol is attached | subjected and shown in the figure, and the description is abbreviate | omitted.

(Configuration of component mounting system)
As shown in FIG. 1, the component mounting system 300 according to the second embodiment is different from the component mounting system 100 according to the first embodiment in that a component mounting device 300b and an inspection device 300c are provided. Moreover, the component mounting apparatus 300b (refer FIG. 2) is different from the component mounting apparatus 100b of the said 1st Embodiment by the point provided with the control part 309, as shown in FIG. The inspection device 300c is an example of a “downstream device” in the claims.

  As illustrated in FIG. 14, the inspection apparatus 300 c includes a control unit 321 and a communication unit 322. The control unit 321 is a control circuit that controls the operation of the inspection apparatus 300c. The control unit 321 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The communication unit 322 is an interface for communicating information. The communication unit 322 connects the inspection apparatus 300c and other apparatuses (printing apparatus 100a, component mounting apparatus 300b, reflow furnace 100d, and inspection apparatus 100e after reflow) in a communicable manner. The communication unit 322 connects the inspection device 300c and the production program creation device 200 so that they can communicate with each other.

  In the second embodiment, the control unit 309 of the component mounting apparatus 300b performs control to detect whether there is a change in the parameter value of the production program 12 before starting production of the board P by the production program 12. . Then, when it is detected that there is a change in the parameter value of the production program 12, the control unit 309 of the component mounting apparatus 300b inspects the inspection item corresponding to the parameter in which the value is detected to be changed. Control to instruct the inspection apparatus 300c via the communication unit 10 is performed. The control unit 321 of the inspection apparatus 300c performs control for inspecting the inspected inspection item based on an instruction from the component mounting apparatus 300b.

  In addition, the control unit 321 of the inspection apparatus 300c performs control to notify the component mounting apparatus 300b of the inspection result for the inspected inspection item via the communication unit 322. When the control unit 309 of the component mounting apparatus 300b is notified from the inspection apparatus 300c that there is an abnormality in the inspection for the predetermined inspection item, the control unit 309 returns the parameter value corresponding to the predetermined inspection item to the value before the change. Control is performed to inquire the user whether or not. When the control unit 309 of the component mounting apparatus 300b receives an instruction to return the parameter value corresponding to the predetermined inspection item to the value before the change, the control unit 309 changes the parameter value corresponding to the predetermined inspection item to the value before the change. Control to return to. The control unit 309 of the component mounting apparatus 300b performs control to end the inspection for the predetermined inspection item when notified from the inspection apparatus 300c that there is no abnormality for the predetermined inspection item.

(Board inspection processing)
Next, with reference to FIG. 15, a substrate inspection process by the inspection apparatus 300c of the second embodiment will be described based on a flowchart. Each process of the flowchart is performed by the control unit 321 of the inspection apparatus 300c.

  As shown in FIG. 15, first, in step S101, an inspection program for inspecting the substrate P is read.

  In step S102, the operation of the inspection apparatus 300c is started.

  In step S103, an inspection process for one substrate is performed. Details of the inspection process for one substrate will be described later.

  In step S104, the number of inspections of the substrate P is counted up.

  In step S105, it is determined whether or not the number of inspections of the substrate P has reached the planned inspection number. When it is determined that the number of inspections of the substrate P has not reached the scheduled inspection number, the process returns to step S103. Then, the processes in steps S103 to S105 are repeated until the number of inspections of the substrate P reaches the scheduled inspection number. If it is determined in step S105 that the number of inspections of the substrate P has reached the planned inspection number, the substrate inspection process is terminated.

(1 substrate inspection process)
Next, with reference to FIG. 16, the inspection process for one substrate by the inspection apparatus 300c of the second embodiment will be described based on a flowchart. Each process of the flowchart is performed by the control unit 321 of the inspection apparatus 300c.

  As shown in FIG. 16, first, in step S111, the substrate P is loaded, and the loaded substrate P is transferred to the substrate fixing position and fixed at the substrate fixing position.

  In step S112, a predetermined inspection point is inspected.

  In step S113, it is determined whether or not notification of the inspection result to the component mounting apparatus 300b is necessary. If it is determined that the inspection result needs to be notified to the component mounting apparatus 300b, the process proceeds to step S114.

  In step S114, the inspection result is notified to the component mounting apparatus 300b.

  If it is determined in step S113 that notification of the inspection result to the component mounting apparatus 300b is not necessary, the process proceeds to step S115.

  In step S115, the inspection result is stored.

  Then, in step S116, it is determined whether or not the inspection of all inspection points to be inspected has been completed. If it is determined that the inspection of all the inspection points has not been completed, the process returns to step S112. And the process of step S112-S116 is repeated until the test | inspection of all the test | inspection locations is completed.

  On the other hand, if it is determined in step S116 that all the inspection points have been inspected, the process proceeds to step S117.

  In step S117, the fixing of the substrate P at the substrate fixing position is released, and the substrate P that has been released from the fixing position is carried out. Thereafter, the inspection process for one substrate is completed.

(Inspection item decision processing)
Next, with reference to FIG. 17, an inspection item determination process by the component mounting apparatus 300b of the second embodiment will be described based on a flowchart. Each process of the flowchart is performed by the control unit 309 of the component mounting apparatus 300b.

  As shown in FIG. 17, first, the past production program 12 is read in step S121.

  In step S122, the current production program 12 and the past production program 12 are compared.

  In step S123, it is determined whether or not there is a change in the parameter value. When it is determined that there is no change in the parameter value (when all the compared parameters have the same parameter value), the inspection item determination process is terminated.

  If it is determined in step S123 that the parameter value has been changed, the process proceeds to step S124.

  In step S124, the inspection item corresponding to the parameter whose value has been changed is selected and determined from the inspection item information in which the parameter and the inspection item are associated with each other. Further, the determined inspection item is stored in the storage unit 8.

  In step S125, an item to be inspected in the inspection apparatus 300c is selected and determined from the determined inspection items.

  In step S126, the inspection item determined is notified to the inspection device 300c.

(Parameter correction processing)
Next, parameter correction processing by the component mounting apparatus 300b of the second embodiment will be described with reference to a flowchart with reference to FIG. Each process of the flowchart is performed by the control unit 309 of the component mounting apparatus 300b.

  As shown in FIG. 18, first, in step S131, it is determined whether or not an abnormality has occurred in the inspection in the inspection apparatus 300c. When it is determined that there is no abnormality in the inspection in the inspection apparatus 300c, the process proceeds to step S132. In step S132, the number of times when it is confirmed that there is no abnormality in the inspection in the inspection apparatus 300c is counted up. Thereafter, the parameter correction process is terminated.

  If it is determined in step S131 that an abnormality has occurred in the inspection performed by the inspection apparatus 300c, the process proceeds to step S133.

  In step S133, control for displaying error information is performed. For example, the error information is displayed on a display unit of a portable terminal carried by the user.

  In step S134, the operation of the component mounting apparatus 300b is stopped.

  In step S135, it is determined whether or not to return the changed parameter value to the original value (return to the value before the change) based on an instruction from the user. In step S135, when an instruction to restore the changed parameter value is received, it is determined that the changed parameter value is restored. In this case, the process proceeds to step S136.

  In step S136, the changed parameter value is returned to the value before the change.

  In step S135, when an instruction not to restore the changed parameter value is received, it is determined that the changed parameter value is not restored. In this case, the process proceeds to step S137.

  In step S137, an instruction is given to the user (operator) to correct the changed parameter. In response to an instruction from the component mounting apparatus 300b, the user instructs correction contents. Then, the changed parameter is corrected based on the correction content.

  In step S138, the operation of the component mounting apparatus 300b is resumed. Thereafter, the parameter correction process is terminated.

  In addition, the other structure of 2nd Embodiment is the same as that of the said 1st Embodiment.

(Effect of 2nd Embodiment)
In the second embodiment, the following effects can be obtained.

  In the second embodiment, as described above, the control unit 309 detects that there is a change in the parameter value of the production program 12 before the production of the substrate P by the production program 12 for producing the substrate P is started. If it is, the control is performed to instruct the inspection apparatus 300c via the communication unit 10 so that the inspection item corresponding to the parameter whose value is detected to be changed is inspected. Thus, when the substrate P is produced by the production program 12 having a change in the parameter value when the parameter value is changed, the inspection apparatus 300c inspects the inspection item corresponding to the parameter whose value has been changed. The test result can be obtained. As a result, it is possible to provide the component mounting apparatus 300b that can confirm whether or not an abnormality has occurred due to the parameter value being changed. Moreover, in the component mounting apparatus 300b of 2nd Embodiment, it can test | inspect about an inspection item in the inspection apparatus 300c. Thereby, compared with the case where it inspects in the component mounting apparatus 300b which instruct | indicated inspection, the burden of the component mounting apparatus 300b can be reduced.

  The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

[Modification]
In addition, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims, and further includes meanings equivalent to the scope of claims and all modifications (variants) within the scope.

  For example, in the first and second embodiments, the example in which the present invention is applied to a component mounting apparatus as a production apparatus of a component mounting system has been described, but the present invention is not limited to this. The present invention may be applied to a printing apparatus, a bonding material coating apparatus, or the like as a production apparatus for a component mounting system.

  Moreover, in the said 1st and 2nd embodiment, although the test | inspection part of this invention showed the example comprised by a board | substrate imaging part, this invention is not limited to this. In the present invention, the inspection unit may be configured by an inspection unit other than the board imaging unit. For example, the inspection unit may be configured by a dedicated imaging unit. Further, for example, the inspection unit may be configured by a laser displacement meter.

  In the first and second embodiments, the example in which the component mounting apparatus detects that the parameter value is changed has been described. However, the present invention is not limited to this. In the present invention, a change in the parameter value may be detected by an apparatus other than the component mounting apparatus. For example, the production program creation device may detect that there is a change in the parameter value. In this case, the parameters detected by the production program creation device may be notified to the production device of the component mounting system.

  In the first and second embodiments, the example in which the change in the parameter value is detected based on the comparison between the production program used last time and the production program used this time has been shown. The present invention is not limited to this. In the present invention, the change in the parameter value may be detected based on a comparison between a past production program other than the previously used production program and the production program used this time. In this case, the user may specify a past production program used for comparison.

  In the first and second embodiments, the example in which the inspection item is determined by the component mounting device (production device of the component mounting system) is shown, but the present invention is not limited to this. In the present invention, the inspection item may be determined by an apparatus other than the production apparatus of the component mounting system. For example, the inspection item may be determined by a production program creation device. In this case, the inspection items determined by the production program creation device may be notified to the production device of the component mounting system.

  In the first and second embodiments, an example is shown in which the parameters are configured to include a parameter related to the board, a parameter related to the component, and a parameter related to the component supply device. However, the present invention is not limited to this. . In the present invention, the parameter may be configured to include at least one of a parameter related to the substrate, a parameter related to the component, and a parameter related to the component supply apparatus. Further, the parameters may be configured to include parameters other than the parameters related to the substrate, the parameters related to the components, and the parameters related to the component supply apparatus.

  In the first and second embodiments, the example in which the inspection items are configured to include the items related to the board, the items related to the components, and the items related to the component supply device has been described. However, the present invention is not limited thereto. Absent. In the present invention, the inspection item may be configured to include at least one of an item related to the substrate, an item related to the component, and an item related to the component supply device. Further, the inspection items may be configured to include items other than the items related to the substrate, the items related to the components, and the items related to the component supply device.

  In the first and second embodiments, the control unit is configured to perform control to end the inspection for a predetermined inspection item when it is confirmed that there is no abnormality continuously for a predetermined number of times. However, the present invention is not limited to this. In the present invention, the control unit may be configured to perform control to continue the inspection for a predetermined inspection item until the production of the substrate is completed.

  In the first and second embodiments, when it is confirmed that there is an abnormality in the inspection for the predetermined inspection item, the control unit sets the value of the parameter corresponding to the predetermined inspection item to the value before the change. Although an example in which control is performed to inquire the user whether or not to return is shown, the present invention is not limited to this. In the present invention, when it is confirmed that there is an abnormality in the inspection of the predetermined inspection item, the control unit returns the parameter value corresponding to the predetermined inspection item to the value before the change without inquiring the user. You may comprise so that it may perform. In this case, the control unit may be configured to perform control to notify the user that the parameter value has been changed (returned to the value before the change).

  Moreover, in the said 2nd Embodiment, although the downstream apparatus of this invention showed the example comprised by the inspection apparatus before reflow, this invention is not limited to this. In the present invention, the downstream device may be constituted by an inspection device after reflow. Further, when a plurality of component mounting devices are provided in the component mounting system, the downstream device may be configured by a component mounting device arranged on the further downstream side.

  In the first and second embodiments, for convenience of explanation, the processing operation of the control unit has been described using a flow-driven flowchart that performs processing in order along the processing flow. However, the present invention is not limited to this. I can't. In the present invention, the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

6 Board imaging unit (inspection unit)
9, 309 Control unit 10 Communication unit 11 Component supply device 13 Inspection item information 31 Head 100b, 300b Component mounting device (component mounting system production device)
100, 300 Component mounting system 300c Inspection device (downstream device)
E component P substrate

Claims (10)

A production device constituting a component mounting system,
An inspection unit for performing an inspection;
If it is detected that there is a change in the parameter value of the production program before starting the production of the substrate by the production program for producing the substrate, the parameter in which the change is detected is detected. A production apparatus for a component mounting system, comprising: a control unit that controls the inspection unit so as to inspect a corresponding inspection item.   The component mounting according to claim 1, wherein the change in the parameter value is detected based on a comparison between the past production program recorded after the completion of production and the production program used this time. System production equipment.   The production of the component mounting system according to claim 2, wherein the change in the parameter value is detected based on a comparison between the production program used last time and the production program used this time. apparatus.   The production apparatus for a component mounting system according to any one of claims 1 to 3, wherein the inspection item is determined based on inspection item information in which the parameter and the inspection item are associated with each other. The parameter includes at least one of a parameter related to the substrate, a parameter related to a component mounted on the substrate, and a parameter related to a component supply device that supplies the component,
5. The component mounting system according to claim 1, wherein the inspection item includes at least one of an item related to the substrate, an item related to the component, and an item related to the component supply apparatus. Production equipment.   The control unit is configured to perform inspection for a predetermined number of times for the predetermined inspection item, and to control to end the inspection for the predetermined inspection item when it is confirmed that there is no abnormality. The production apparatus of the component mounting system of any one of Claims 1-5.   When it is confirmed that there is an abnormality in the inspection for the predetermined inspection item, the control unit inquires of the user whether to return the parameter value corresponding to the predetermined inspection item to the value before the change. The component mounting system production apparatus according to claim 1, wherein the production apparatus is configured to perform control. A production device constituting a component mounting system,
A communication unit that communicates with a downstream device disposed on the downstream side in the substrate transport direction;
If it is detected that there is a change in the parameter value of the production program before starting production of the substrate by the production program for production of the substrate, the parameter in which the value is detected to be changed And a control unit that performs control to instruct the downstream device via the communication unit so as to inspect the inspection items corresponding to the production item of the component mounting system. A head for mounting components on the board;
An inspection unit for performing an inspection;
If it is detected that there is a change in the parameter value of the production program before starting production of the substrate by the production program for production of the substrate, the parameter in which the value is detected to be changed And a control unit that controls the inspection unit so as to inspect the inspection items corresponding to the component mounting apparatus. Before starting production of the board by the production program for production of the board in the production apparatus constituting the component mounting system, it is detected whether there is a change in the parameter value of the production program,
An inspection method for a component mounting system, in which, when it is detected that the parameter value is changed, an inspection item corresponding to the parameter where the value is detected to be changed is inspected.

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