JP7239064B1 - 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用 - Google Patents

半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用 Download PDF

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Publication number
JP7239064B1
JP7239064B1 JP2022534399A JP2022534399A JP7239064B1 JP 7239064 B1 JP7239064 B1 JP 7239064B1 JP 2022534399 A JP2022534399 A JP 2022534399A JP 2022534399 A JP2022534399 A JP 2022534399A JP 7239064 B1 JP7239064 B1 JP 7239064B1
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Prior art keywords
prepreg
melt viscosity
mass
thermosetting resin
resin composition
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JP2022534399A
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Japanese (ja)
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JPWO2023042305A1 (https=
Inventor
俊亮 大竹
一行 満倉
伸治 島岡
広明 藤田
正樹 高橋
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2023031146A priority Critical patent/JP7794149B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022534399A 2021-09-15 2021-09-15 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用 Active JP7239064B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023031146A JP7794149B2 (ja) 2021-09-15 2023-03-01 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

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PCT/JP2021/033952 WO2023042305A1 (ja) 2021-09-15 2021-09-15 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

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JP7239064B1 true JP7239064B1 (ja) 2023-03-14
JPWO2023042305A1 JPWO2023042305A1 (https=) 2023-03-23

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JP2023031146A Active JP7794149B2 (ja) 2021-09-15 2023-03-01 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

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US (1) US20240381529A1 (https=)
JP (2) JP7239064B1 (https=)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023067929A (ja) * 2021-09-15 2023-05-16 株式会社レゾナック 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230317592A1 (en) * 2022-04-01 2023-10-05 Intel Corporation Substrate with low-permittivity core and buildup layers

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09117987A (ja) * 1995-10-25 1997-05-06 Matsushita Electric Works Ltd 金属箔張り積層板の製造方法
JP2004063991A (ja) * 2002-07-31 2004-02-26 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2006049616A (ja) * 2004-08-05 2006-02-16 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2016060870A (ja) * 2014-09-19 2016-04-25 日立化成株式会社 熱硬化性樹脂組成物及びその製造方法、並びにこれを用いたプリプレグ、積層板及びプリント配線板
JP2016069389A (ja) * 2014-09-26 2016-05-09 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板及びプリント配線板
JP2017008174A (ja) * 2015-06-19 2017-01-12 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP2021088654A (ja) * 2019-12-04 2021-06-10 住友ベークライト株式会社 プリプレグ、プリント配線基板および半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08198982A (ja) 1995-01-24 1996-08-06 Matsushita Electric Works Ltd 積層板の製造方法
JPH11126978A (ja) 1997-10-24 1999-05-11 Kyocera Corp 多層配線基板
WO2022059167A1 (ja) * 2020-09-18 2022-03-24 昭和電工マテリアルズ株式会社 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料
WO2023042305A1 (ja) 2021-09-15 2023-03-23 株式会社レゾナック 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09117987A (ja) * 1995-10-25 1997-05-06 Matsushita Electric Works Ltd 金属箔張り積層板の製造方法
JP2004063991A (ja) * 2002-07-31 2004-02-26 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2006049616A (ja) * 2004-08-05 2006-02-16 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2016060870A (ja) * 2014-09-19 2016-04-25 日立化成株式会社 熱硬化性樹脂組成物及びその製造方法、並びにこれを用いたプリプレグ、積層板及びプリント配線板
JP2016069389A (ja) * 2014-09-26 2016-05-09 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板及びプリント配線板
JP2017008174A (ja) * 2015-06-19 2017-01-12 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP2021088654A (ja) * 2019-12-04 2021-06-10 住友ベークライト株式会社 プリプレグ、プリント配線基板および半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023067929A (ja) * 2021-09-15 2023-05-16 株式会社レゾナック 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用
JP7794149B2 (ja) 2021-09-15 2026-01-06 株式会社レゾナック 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

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WO2023042305A1 (ja) 2023-03-23
US20240381529A1 (en) 2024-11-14
KR20240053065A (ko) 2024-04-23
JPWO2023042305A1 (https=) 2023-03-23
JP7794149B2 (ja) 2026-01-06
JP2023067929A (ja) 2023-05-16

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