JPWO2023042305A1 - - Google Patents

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Publication number
JPWO2023042305A1
JPWO2023042305A1 JP2022534399A JP2022534399A JPWO2023042305A1 JP WO2023042305 A1 JPWO2023042305 A1 JP WO2023042305A1 JP 2022534399 A JP2022534399 A JP 2022534399A JP 2022534399 A JP2022534399 A JP 2022534399A JP WO2023042305 A1 JPWO2023042305 A1 JP WO2023042305A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022534399A
Other languages
Japanese (ja)
Other versions
JP7239064B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2023031146A priority Critical patent/JP7794149B2/ja
Application granted granted Critical
Publication of JP7239064B1 publication Critical patent/JP7239064B1/ja
Publication of JPWO2023042305A1 publication Critical patent/JPWO2023042305A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022534399A 2021-09-15 2021-09-15 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用 Active JP7239064B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023031146A JP7794149B2 (ja) 2021-09-15 2023-03-01 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/033952 WO2023042305A1 (ja) 2021-09-15 2021-09-15 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023031146A Division JP7794149B2 (ja) 2021-09-15 2023-03-01 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

Publications (2)

Publication Number Publication Date
JP7239064B1 JP7239064B1 (ja) 2023-03-14
JPWO2023042305A1 true JPWO2023042305A1 (https=) 2023-03-23

Family

ID=85556191

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022534399A Active JP7239064B1 (ja) 2021-09-15 2021-09-15 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用
JP2023031146A Active JP7794149B2 (ja) 2021-09-15 2023-03-01 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023031146A Active JP7794149B2 (ja) 2021-09-15 2023-03-01 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

Country Status (4)

Country Link
US (1) US20240381529A1 (https=)
JP (2) JP7239064B1 (https=)
KR (1) KR20240053065A (https=)
WO (1) WO2023042305A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023042305A1 (ja) * 2021-09-15 2023-03-23 株式会社レゾナック 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用
US20230317592A1 (en) * 2022-04-01 2023-10-05 Intel Corporation Substrate with low-permittivity core and buildup layers

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08198982A (ja) 1995-01-24 1996-08-06 Matsushita Electric Works Ltd 積層板の製造方法
JPH09117987A (ja) * 1995-10-25 1997-05-06 Matsushita Electric Works Ltd 金属箔張り積層板の製造方法
JPH11126978A (ja) 1997-10-24 1999-05-11 Kyocera Corp 多層配線基板
JP2004063991A (ja) * 2002-07-31 2004-02-26 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2006049616A (ja) * 2004-08-05 2006-02-16 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP6519128B2 (ja) * 2014-09-19 2019-05-29 日立化成株式会社 熱硬化性樹脂組成物及びその製造方法、並びにこれを用いたプリプレグ、積層板及びプリント配線板
JP6459343B2 (ja) * 2014-09-26 2019-01-30 パナソニックＩｐマネジメント株式会社 プリプレグ、金属張積層板及びプリント配線板
JP6606882B2 (ja) * 2015-06-19 2019-11-20 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP7434855B2 (ja) * 2019-12-04 2024-02-21 住友ベークライト株式会社 プリプレグ、プリント配線基板および半導体装置
WO2022059167A1 (ja) * 2020-09-18 2022-03-24 昭和電工マテリアルズ株式会社 半導体パッケージ用基板材料を製造する方法、プリプレグ、及び半導体パッケージ用基板材料
WO2023042305A1 (ja) 2021-09-15 2023-03-23 株式会社レゾナック 半導体パッケージ用基板材料を製造する方法、プリプレグ、及びプリプレグの応用

Also Published As

Publication number Publication date
WO2023042305A1 (ja) 2023-03-23
US20240381529A1 (en) 2024-11-14
KR20240053065A (ko) 2024-04-23
JP7794149B2 (ja) 2026-01-06
JP7239064B1 (ja) 2023-03-14
JP2023067929A (ja) 2023-05-16

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